WO2006135746A3 - Charge balance field effect transistor - Google Patents
Charge balance field effect transistor Download PDFInfo
- Publication number
- WO2006135746A3 WO2006135746A3 PCT/US2006/022474 US2006022474W WO2006135746A3 WO 2006135746 A3 WO2006135746 A3 WO 2006135746A3 US 2006022474 W US2006022474 W US 2006022474W WO 2006135746 A3 WO2006135746 A3 WO 2006135746A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- conductivity type
- trench
- field effect
- effect transistor
- semiconductor region
- Prior art date
Links
- 230000005669 field effect Effects 0.000 title abstract 2
- 239000004065 semiconductor Substances 0.000 abstract 3
- 239000002019 doping agent Substances 0.000 abstract 2
- 239000007943 implant Substances 0.000 abstract 2
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- H—ELECTRICITY
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- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
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- H01L29/7802—Vertical DMOS transistors, i.e. VDMOS transistors
- H01L29/7813—Vertical DMOS transistors, i.e. VDMOS transistors with trench gate electrode, e.g. UMOS transistors
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- H01L29/66734—Vertical DMOS transistors, i.e. VDMOS transistors with a step of recessing the gate electrode, e.g. to form a trench gate electrode
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- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
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Abstract
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
AT0923806A AT504290A2 (en) | 2005-06-10 | 2006-06-08 | FIELD EFFECT TRANSISTOR WITH LOAD BALANCE |
KR1020127027097A KR101296984B1 (en) | 2005-06-10 | 2006-06-08 | Charge balance field effect transistor |
DE112006001516T DE112006001516T5 (en) | 2005-06-10 | 2006-06-08 | Field effect transistor with charge balance |
CN2006800206309A CN101536163B (en) | 2005-06-10 | 2006-06-08 | Charge balance field effect transistor |
JP2008515966A JP2008546216A (en) | 2005-06-10 | 2006-06-08 | Charge balanced field effect transistor |
KR1020087000543A KR101296922B1 (en) | 2005-06-10 | 2006-06-08 | Charge balance field effect transistor |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US68922905P | 2005-06-10 | 2005-06-10 | |
US60/689,229 | 2005-06-10 |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2006135746A2 WO2006135746A2 (en) | 2006-12-21 |
WO2006135746A3 true WO2006135746A3 (en) | 2009-04-30 |
Family
ID=37532833
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US2006/022474 WO2006135746A2 (en) | 2005-06-10 | 2006-06-08 | Charge balance field effect transistor |
Country Status (8)
Country | Link |
---|---|
US (8) | US7393749B2 (en) |
JP (1) | JP2008546216A (en) |
KR (2) | KR101296984B1 (en) |
CN (2) | CN103094348B (en) |
AT (1) | AT504290A2 (en) |
DE (1) | DE112006001516T5 (en) |
TW (2) | TWI416741B (en) |
WO (1) | WO2006135746A2 (en) |
Families Citing this family (151)
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US6838722B2 (en) * | 2002-03-22 | 2005-01-04 | Siliconix Incorporated | Structures of and methods of fabricating trench-gated MIS devices |
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US9202758B1 (en) * | 2005-04-19 | 2015-12-01 | Globalfoundries Inc. | Method for manufacturing a contact for a semiconductor component and related structure |
DE112006001516T5 (en) | 2005-06-10 | 2008-04-17 | Fairchild Semiconductor Corp. | Field effect transistor with charge balance |
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KR100731141B1 (en) * | 2005-12-29 | 2007-06-22 | 동부일렉트로닉스 주식회사 | Semiconductor device and method for fabricating the same |
JP5017865B2 (en) * | 2006-01-17 | 2012-09-05 | 富士電機株式会社 | Semiconductor device |
US7492003B2 (en) * | 2006-01-24 | 2009-02-17 | Siliconix Technology C. V. | Superjunction power semiconductor device |
US7659588B2 (en) * | 2006-01-26 | 2010-02-09 | Siliconix Technology C. V. | Termination for a superjunction device |
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US7989293B2 (en) * | 2009-02-24 | 2011-08-02 | Maxpower Semiconductor, Inc. | Trench device structure and fabrication |
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Also Published As
Publication number | Publication date |
---|---|
US8742401B2 (en) | 2014-06-03 |
US7955920B2 (en) | 2011-06-07 |
TWI416741B (en) | 2013-11-21 |
AT504290A2 (en) | 2008-04-15 |
KR20080032080A (en) | 2008-04-14 |
US20080258213A1 (en) | 2008-10-23 |
US8278705B2 (en) | 2012-10-02 |
US8592895B2 (en) | 2013-11-26 |
WO2006135746A2 (en) | 2006-12-21 |
KR20120123159A (en) | 2012-11-07 |
US20090191678A1 (en) | 2009-07-30 |
JP2008546216A (en) | 2008-12-18 |
US7514322B2 (en) | 2009-04-07 |
US20110303975A1 (en) | 2011-12-15 |
CN101536163A (en) | 2009-09-16 |
US20100258855A1 (en) | 2010-10-14 |
US7767524B2 (en) | 2010-08-03 |
CN103094348A (en) | 2013-05-08 |
TW200705680A (en) | 2007-02-01 |
US20100038708A1 (en) | 2010-02-18 |
US20140054691A1 (en) | 2014-02-27 |
DE112006001516T5 (en) | 2008-04-17 |
US7393749B2 (en) | 2008-07-01 |
US20130181282A1 (en) | 2013-07-18 |
CN103094348B (en) | 2016-08-10 |
US7625799B2 (en) | 2009-12-01 |
TW201330286A (en) | 2013-07-16 |
TWI542020B (en) | 2016-07-11 |
KR101296922B1 (en) | 2013-08-14 |
KR101296984B1 (en) | 2013-08-14 |
US20060281249A1 (en) | 2006-12-14 |
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