WO2006138426A3 - Electronic chip contact structure - Google Patents

Electronic chip contact structure Download PDF

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Publication number
WO2006138426A3
WO2006138426A3 PCT/US2006/023250 US2006023250W WO2006138426A3 WO 2006138426 A3 WO2006138426 A3 WO 2006138426A3 US 2006023250 W US2006023250 W US 2006023250W WO 2006138426 A3 WO2006138426 A3 WO 2006138426A3
Authority
WO
WIPO (PCT)
Prior art keywords
chip contact
contact structure
electronic chip
pad
barrier layer
Prior art date
Application number
PCT/US2006/023250
Other languages
French (fr)
Other versions
WO2006138426A2 (en
Inventor
Jon Callahan
John Trezza
Gregory Dudoff
Original Assignee
Cubic Wafer Inc
Jon Callahan
John Trezza
Gregory Dudoff
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Cubic Wafer Inc, Jon Callahan, John Trezza, Gregory Dudoff filed Critical Cubic Wafer Inc
Priority to CN200680029466.8A priority Critical patent/CN101496164B/en
Priority to JP2008517094A priority patent/JP5430931B2/en
Publication of WO2006138426A2 publication Critical patent/WO2006138426A2/en
Publication of WO2006138426A3 publication Critical patent/WO2006138426A3/en

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Abstract

A chip contact functionally having an IC pad, a barrier layer over the IC pad, and a malleable material over the barrier layer. An alternative chip contact functionally having an IC pad, a barrier layer over the IC pad, and a rigid material over the barrier layer.
PCT/US2006/023250 2005-06-14 2006-06-14 Electronic chip contact structure WO2006138426A2 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN200680029466.8A CN101496164B (en) 2005-06-14 2006-06-14 Electronic chip contact structure
JP2008517094A JP5430931B2 (en) 2005-06-14 2006-06-14 Electronic chip contact structure

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US69075905P 2005-06-14 2005-06-14
US60/690,759 2005-06-14
US11/329,885 US7781886B2 (en) 2005-06-14 2006-01-10 Electronic chip contact structure
US11/329,885 2006-01-10

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Publication Number Publication Date
WO2006138426A2 WO2006138426A2 (en) 2006-12-28
WO2006138426A3 true WO2006138426A3 (en) 2008-07-24

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PCT/US2006/023250 WO2006138426A2 (en) 2005-06-14 2006-06-14 Electronic chip contact structure

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US (1) US7781886B2 (en)
JP (1) JP5430931B2 (en)
KR (1) KR101015926B1 (en)
WO (1) WO2006138426A2 (en)

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US20060278981A1 (en) 2006-12-14
KR20080031183A (en) 2008-04-08
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WO2006138426A2 (en) 2006-12-28
US7781886B2 (en) 2010-08-24
JP5430931B2 (en) 2014-03-05

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