WO2007026945A1 - 回路装置およびその製造方法 - Google Patents
回路装置およびその製造方法 Download PDFInfo
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- WO2007026945A1 WO2007026945A1 PCT/JP2006/317605 JP2006317605W WO2007026945A1 WO 2007026945 A1 WO2007026945 A1 WO 2007026945A1 JP 2006317605 W JP2006317605 W JP 2006317605W WO 2007026945 A1 WO2007026945 A1 WO 2007026945A1
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- circuit
- circuit board
- boards
- circuit device
- lead
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
- H01L25/162—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits the devices being mounted on two or more different substrates
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- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
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- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/07—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
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- H05K1/056—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an organic insulating layer
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- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
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- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
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- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
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- H05K2201/10924—Leads formed from a punched metal foil
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- H05K3/00—Apparatus or processes for manufacturing printed circuits
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- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
- H05K3/4046—Through-connections; Vertical interconnect access [VIA] connections using auxiliary conductive elements, e.g. metallic spheres, eyelets, pieces of wire
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
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- Y10T29/00—Metal working
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Definitions
- the present invention relates to a circuit device and a manufacturing method thereof, and more particularly to a circuit device having a plurality of circuit boards each having an electric circuit incorporated on a surface thereof and a manufacturing method thereof.
- a conductive pattern 10 3 is formed on the surface of the rectangular substrate 10 1 through an insulating layer 1 0 2.
- a circuit element is fixed to a desired portion of the conductive pattern 10 3 to form a predetermined electric circuit.
- the semiconductor element 10 5 A and the chip element 10 5 B are connected to the conductive pattern 10 3 as circuit elements.
- the lead 104 is connected to a pad 1009 consisting of 103 conductive patterns formed in the peripheral portion of the substrate 101, and functions as an external terminal.
- the sealing resin 10 8 has a function of sealing an electric circuit formed on the surface of the substrate 10 1.
- the semiconductor element 105 A there may be employed a power switching element that performs high-current switching and an LSI that performs small signal processing.
- the potential of the substrate 10 1 made of metal may fluctuate, and the electric signal of several mA that passes through the LSI may be degraded.
- the entire substrate 101 may be heated and other circuit elements such as LSI may be adversely affected.
- the present invention has been made in view of the above-described problems, and the main object of the present invention is to provide a circuit device in which the operation of an electric circuit to be incorporated is stabilized.
- the purpose of this is to provide a method of manufacturing a circuit device that can flexibly cope with changes in the built-in electric circuit.
- the circuit device of the present invention includes a circuit board, an electric circuit formed of a conductive pattern and a circuit element formed on the upper surface of the circuit board, and is electrically connected to the electric circuit and led out to the outside.
- a plurality of independent circuit boards are provided, and each of the circuit boards is provided with the conductive pattern, a circuit element, and a general lE lead. Characterized by
- a lead and a frame having a unit consisting of a number of lead cards are prepared, and a conductive pattern and a circuit element are formed on the upper surface of the circuit board.
- a plurality of circuit boards in contact with a single lead V, and the circuit board is mechanically held in the rear K frame. It is characterized by comprising: a process and a step of integrally covering a plurality of circuit boards with a sealing resin.
- FIG. 1 m A) is a perspective view of the circuit device of the present invention
- FIG. 1B (B) is a perspective view of the circuit device of the present invention
- FIG. 2 (A) is a circuit diagram of the present invention
- FIG. 2 (B) is a circuit diagram of the circuit device of the present invention
- FIG. 1 m A) is a perspective view of the circuit device of the present invention
- FIG. 1B (B) is a perspective view of the circuit device of the present invention
- FIG. 2 (A) is a circuit diagram of the present invention
- FIG. 2 (B) is a circuit diagram of the circuit device of the present invention
- (A) is a plan view for explaining the method of manufacturing a circuit device according to the present invention.
- FIG. 4 (B) is a plan view for explaining a method for manufacturing a circuit device according to the present invention.
- (A) is a plan view for explaining a manufacturing method of the circuit device of the present invention, FIG.
- FIG. 5 (B) is a sectional view for explaining the method of manufacturing the circuit device of the present invention.
- (A) is a cross-sectional view for explaining a method for manufacturing a circuit device according to the present invention.
- FIG. 6 is a cross-sectional view for explaining a conventional hybrid conch shell circuit device.
- a hybrid integrated circuit device 10 In this embodiment, the structure of a hybrid integrated circuit device 10 will be described as an example of a circuit device.
- FIG. 1 (A) is a perspective view of the hybrid integrated circuit device 10 viewed obliquely from above.
- B) is a hybrid integrated circuit device 1 without the sealing resin 14 that seals the whole.
- FIG. 1 A first figure.
- the hybrid integrated circuit device 10 of the present embodiment includes a plurality of circuit boards 1 1 A, 11 1 arranged on substantially the same plane. B, 1
- the circuit board 1 1 A is an aluminum (A 1) A circuit board that is a metal substrate made of a metal such as copper (Cu) as a royal material.
- the side surface of the circuit board 1 1 A depends on the manufacturing method.
- the circuit board 1 1 A is manufactured by punching using a press machine, the side surface of the circuit board 1 1 A has a straight shape.
- the circuit board 11 A is manufactured by forming the V-shaped dicing groove, the side surface of the circuit board 11 A has a shape protruding outward.
- the insulating layer 12 A is formed so as to cover the entire upper surface of the circuit board 11 A.
- the insulating layer 1 2 A is made of an epoxy resin or the like that is highly filled with a filler such as AL 2 0 3 .
- a boiler is mixed into the insulating layer 12 A, the thermal resistance of the insulating layer 12 A is reduced, and the heat generated from the built-in circuit elements is actively transferred to the circuit board 11.
- the specific thickness of the insulating layer 12 A is, for example, about 50 ⁇ m.
- the back surface of the circuit board 1 1 A may be covered with an insulating layer 1 2 A.
- the conductive pattern 13 A is made of a metal such as copper, and is formed on the surface of the insulating layer 12 A so that a predetermined electric circuit is formed.
- a pad made of the conductive pattern 13 is formed on the side from which the lead 25 A is led out.
- a large number of pads made of a conductive pattern 13 A are also formed around the circuit element 15 A, and this pad and the circuit element 15 A are connected by a thin metal wire 17. .
- a single-layer conductive pattern 13 A is shown here, a multi-layer conductive pattern 13 A stacked via an insulating layer may be formed on the upper surface of the circuit board 11 A. Furthermore, a pad 18 A for connection to other circuit boards 11 B and 11 C is also formed.
- circuit element 15 A mounted on the circuit board 11 A active elements and passive elements can be generally adopted. Specifically, transistors, LSI chips, diodes, chip resistors, chip capacitors, inductances, thermistors, antennas, oscillators, etc. should be adopted as circuit elements 15 A. Can do. Furthermore, a resin-sealed package or the like can be fixed to the conductive pattern 13 A as the circuit element 15 A. In the figure, the chip element and the semiconductor element are shown as a circuit element 15 A. In this embodiment, a power switching element is employed as the circuit element 15 A. The circuit element 15 A is controlled by the circuit element 15 B which is a control element mounted on the circuit board 11 B.
- the circuit board has a plurality of circuit boards mounted on the surface, and different circuit elements are mounted on each circuit board.
- circuit element 15 B which is L S I which functions as a control element is mounted on circuit board 11 B located in the center.
- the circuit boards 1 1 A and 11 C located at both ends of the circuit board 1 1 B have circuit elements 15 A and 15 which are switching elements controlled by the circuit element 15 B. C is implemented.
- the circuit elements 15 A and 15 C for example, a semiconductor element force S through which a large current of 1 A or more passes is employed.
- circuit elements 15 A and 15 C are adopted as circuit elements 15 A and 15 C. Is possible.
- the lead 25 A is made of a metal whose main component is copper (Cu), aluminum (A1), an alloy of Fe_Ni, or the like.
- the lead 25A is connected to a pad provided along two opposing sides of the circuit board 11A.
- a pad may be provided along one side or four sides of the circuit board 11 A, and the lead 25 A may be connected to this pad.
- the sealing resin 14 is formed by a transfer molding using a thermosetting resin or an injection molding using a thermoplastic resin.
- the entire circuit board 1 1 A including the back side may be covered with the sealing resin 1 4.
- the back surface of the circuit board 11 A may be exposed from the sealing resin 14.
- three circuit boards 1 1 A, 1 1 B, and 1 1 C are supported by the sealing resin 14.
- the above is the configuration of the circuit board 11 A, and the configurations of the other circuit boards 11 B and 11 C incorporated in the hybrid integrated circuit device 10 are basically the same.
- the difference between these circuit boards is that the electric circuits formed on the surface are different.
- the electric circuits formed on the surfaces of the circuit boards 1 1 A, 1 I B, and 1 1 C are connected to each other through a thin metal wire 17 as a connection means.
- pad 18 A formed on the surface of circuit board 1 1 A and pad 1 8 B formed on the surface of circuit board 1 1 B are connected to each other through thin metal wire 1 7. Connected.
- the pad 18 B formed on the surface of the circuit board 11 1 B and the pad 18 C formed on the surface of the circuit board 11 1 C are connected through the thin metal wire 17.
- connection part 19 A is the part that electrically connects circuit board 1 1 A and conductive pattern 1 3 A, and other circuit boards 1 1 B and 1 1 C also have connection parts of the same shape. It may be provided.
- Connection part 1 9 A is an insulating layer 1 2 A covering the upper surface of circuit board 1 1 A, opening circuit board 1 1 A partially exposing circuit board 1 1 A and the conductive pattern of the exposed part 1 3 A and are connected by a thin metal wire 1 7.
- connection portion 19 A By providing the connection portion 19 A, the operation of the electric circuit formed on the upper surface of the circuit board 11 A can be stabilized. For example, if the electric potential of the conductive pattern 1 3 A and the circuit board 1 1 A are different, the insulating layer 1 2 A is located between them. As a result, parasitic capacitance may occur and malfunction of the electrical circuit may occur. In this embodiment, since the potentials of the conductive pattern 13 A and the circuit board 11 A are kept substantially the same by the connecting portion 19 A, the parasitic capacitance is reduced. Therefore, it is possible to stabilize the operation of the electric circuit composed of the conductive pattern 13 A and the circuit element 15 A formed on the upper surface of the circuit board 11 A.
- FIG. 2 (B) An example of an electric circuit built in the hybrid integrated circuit device 10 of this embodiment will be described with reference to FIG. 2 (B).
- This inverter circuit has six switching elements Q 1 to Q 6 controlled by the control circuit 24. An intermediate point between Q 1 and Q 2, an intermediate point between Q 3 and Q 4, and an intermediate point between Q 5 and Q 6 are connected to motor 20. The control electrodes of the switching elements Q 1 to Q 6 are connected to the control circuit 24.
- the switching elements Q1 to Q6 are switched at a predetermined timing, so that the DC power supplied from the power supply 21 is changed to AC power. Converted. Then, the converted AC electrode is supplied to the motor 20 and the motor 20 rotates.
- control circuit 24 described above corresponds to circuit element 15 B mounted on circuit board 11 B. Further, the above switching elements Q 1 to Q 6 correspond to the circuit elements 15 A and 15 C mounted on the circuit boards 11 A and 11 C, respectively. Therefore, if the integrated circuit is incorporated in the hybrid integrated circuit device 10 of the present embodiment, the operation of the integrated circuit can be stabilized. Below, the advantage by this form is explained in full detail.
- a hybrid integrated circuit device 10 having a predetermined function is configured by combining modularized circuit boards 11 A, 11 B, 11 C.
- circuit board 1 IB on which circuit element 15 B as a control element is mounted, and circuit elements 15 A and 15 C as switching elements controlled by this circuit element 15 B are mounted.
- the circuit element mounted in each circuit board is connected using the metal fine wire 1 7. Therefore, even if the electric circuit incorporated in the hybrid integrated circuit device 10 changes, it can be dealt with by changing only one of the circuit boards 11 A, 11 B, and 11 C.
- the circuit element 15 A that is a switching element and the circuit element 15 B that is a control element are mounted on different substrates. This prevents malfunction of the circuit element 15 B due to the above. Specifically, the circuit element 15 A, which is a switching element, generates a large amount of heat because a large current passes through it. Therefore, when the circuit element 15 A and the circuit element 15 B are mounted on the same circuit board, the heat generated from the circuit element 15 A passes through the circuit board having excellent thermal conductivity. There is a risk of circuit element 1 5 B malfunctioning. Therefore, in this embodiment, the circuit element 15 A and the circuit element 15 B are mounted on different circuit boards 11 A and 1 IB.
- the circuit element 15 A As a result, even if the circuit element 15 A generates heat, the circuit board 11 A on which the circuit element 15 A is mounted is heated, but the circuit board 11 A is disposed away from the circuit board 11 A.
- the circuit board 1 1 B is not so hot. Therefore, the circuit element 15 B as the control element is hardly affected by the heat generation of the circuit element 15 A as the switching element. Furthermore, with the above configuration, it is possible to prevent malfunction of the electric circuit due to fluctuations in the potential of the circuit board. Specifically, a high voltage of, for example, several tens of volts is applied to the main electrode of the circuit element 15 A that is a switching element. On the other hand, a low voltage of several volts is applied to the circuit element 15 B as the control element.
- circuit element 15 A that is a switching element and the circuit element 15 B that is a control element are mounted on separate circuit boards 11 A and 1 IB. Therefore, even if the circuit element 15 A is switched, the potential changes only in the circuit board 11 A on which the circuit element 15 A is mounted, and the potential of the circuit board 11 B does not change. As a result, the circuit element 15 B as the control element is not electrically adversely affected by the circuit element 15 A as the switching element.
- an active filter is a sensitive circuit that is susceptible to the adverse effects of noise when an active filter and an impedance circuit are built in a single circuit device. Therefore, it is necessary to suppress the noise generated from the high-frequency switching elements constituting the inverter circuit from propagating to the active filter.
- the active filter and the inverter circuit can be formed on the top surfaces of different substrates, and the two can be separated, and the noise generated from the inverter circuit can adversely affect the active filter. And can be suppressed.
- a lead frame provided with a large number of leads 25. 4 0 is prepared.
- Fig. 3 (A) is a plan view showing one unit 46 provided in the lead frame 40
- Fig. 3 (B) is a plan view showing the whole of the lead frame 40. is there.
- unit 4 6 has a large number of leads 25 1 with one end located in the area where circuit boards 1 1 A, 1 1 B, and 1 1 C are placed. Consists of.
- the lead 25 extends from the left and right directions toward the area where the circuit board is placed on the paper.
- the plurality of leads 25 are connected to each other by a taper 44 extending from the outer frame 41 to prevent deformation.
- the tip of the lead 25 extends to the area inside the circuit board.
- three circuit boards 1 1 A, 1 1 B, and 1 1 C are arranged in one unit 4 6.
- a plurality of units 46 having the above-described configuration are arranged in a strip-shaped lead frame 40 so as to be separated from each other.
- a hybrid integrated circuit device is manufactured by providing a plurality of units 46 in the lead frame 40, thereby performing wire bonding and molding processes all at once, thereby improving productivity. Has improved.
- FIG. 4 (A) is a plan view showing the unit 46 of the lead frame 40
- FIG. 4 (B) is a cross-sectional view of a portion where the circuit board 11A is fixed.
- a plurality of circuit boards are fixed to one unit 46.
- Each circuit board is connected to the pad of the conductive pattern provided on the surface of these circuit boards by fixing the leading end of the lead 25 via a fixing material such as solder. Fixed to 0.
- circuit boards 1 1 A and 1 1 B 1 1 C are fixed to one unit 4 6 through a lead 2 5.
- the frame 4 0 can be used to fix the relative positions of the three circuit boards 1 1 A, 1 1 B, and 1 1 C. That is, the circuit boards 1 1 A, 1 1 B, and 1 1 C are arranged on substantially the same plane and separated by a predetermined distance. As a result, it is not necessary to individually recognize the position of each circuit board in the process of forming a fine metal wire or the process of resin sealing, so that these processes can be simplified.
- three circuit boards 1 1 A, 1 1 B, and 1 1 C are arranged in one unit 46, but the number of circuit boards arranged may be two, or four or more But it ’s okay.
- circuit boards 1 1 A, 1 1 B, and 11 C on which circuit elements 15 A, 15 B, and 15 C such as semiconductor elements are mounted are fixed to the lead frame 40.
- circuit elements may be mounted and fine metal wires may be formed.
- the electrical circuit formed on the surface of each circuit board is electrically Connect to.
- the pad 18 A formed on the surface of the circuit board 11 A and the pad 18 B connected to the surface of the circuit board 11 B using the metal wires 17 Connecting.
- pad 18B formed on the surface of circuit board 11B is connected to pad 18C formed on the surface of circuit board 11C.
- a plate-like conductive member such as a lead may be used instead of the thin metal wire 17, a plate-like conductive member such as a lead may be used.
- FIG. 5 is a cross-sectional view showing the process of molding the circuit board 11 using a mold
- Fig. 5 (B) is the lead frame after molding.
- the circuit board is housed in the cavity 2 3 formed from the upper mold 2 2 A and the lower mold 2 2 B.
- one circuit board 1 1 A is shown, but in reality, one capability 2 3
- Three circuit boards 1 1 A, 1 1 B, and 1 1 C are disposed on the substrate and sealed together by a sealing resin 14.
- the upper mold 2 2 A and the lower mold 2 2 B are brought into contact with the lead 2 5, so that the circuit board 1 1 A and the like inside the cavity 2 3 The position is fixed. Further, a resin is injected into the cavity 23 from a gate (not shown) provided in the mold to seal the circuit board. Further, as the sealing resin is injected into the cavity 23, the air inside the cavity 23 is discharged to the outside through a gate (not shown). In this process, transfer molding using a thermosetting resin or injection molding using a thermoplastic resin is performed.
- lead 25 is separated from lead frame 40. Specifically, the leads 25 are individually separated at the place where the typers 44 are provided, and the hybrid integrated circuit device 10 as shown in Fig. 1 is separated from the lead frames 40. .
- three circuit boards 1 1 A, 1 1 B, and 11 C are built in the sealing resin 14.
- the electric circuit composed of the conductive pattern and the circuit element is formed on the upper surface of each of the plurality of circuit boards. Accordingly, circuit elements arranged on different substrates do not adversely affect each other, and the operation of the electric circuit formed inside the device can be stabilized.
- a circuit device is configured by combining a plurality of circuit boards each having an electric circuit incorporated on the surface. Therefore, even if there is a change in the electric circuit built into the circuit device, it can be handled by simply changing the combination of the circuit boards, so the cost associated with the change in the electric circuit can be reduced.
Abstract
Description
Claims
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2006800320484A CN101253626B (zh) | 2005-08-31 | 2006-08-30 | 电路装置及其制造方法 |
US12/064,996 US7935899B2 (en) | 2005-08-31 | 2006-08-30 | Circuit device and method of manufacturing the same |
JP2007533379A JP5378683B2 (ja) | 2005-08-31 | 2006-08-30 | 回路装置およびその製造方法 |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005-252187 | 2005-08-31 | ||
JP2005252187 | 2005-08-31 |
Publications (1)
Publication Number | Publication Date |
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WO2007026945A1 true WO2007026945A1 (ja) | 2007-03-08 |
Family
ID=37809023
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2006/317605 WO2007026945A1 (ja) | 2005-08-31 | 2006-08-30 | 回路装置およびその製造方法 |
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Country | Link |
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US (1) | US7935899B2 (ja) |
JP (1) | JP5378683B2 (ja) |
KR (1) | KR20080031449A (ja) |
CN (1) | CN101253626B (ja) |
WO (1) | WO2007026945A1 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
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JP2022520691A (ja) * | 2019-01-22 | 2022-04-01 | モレックス エルエルシー | 特定用途向けエレクトロニクスパッケージング製造プロセスを使用したスマートコネクタ及びその製造方法 |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
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JP2012028511A (ja) * | 2010-07-22 | 2012-02-09 | On Semiconductor Trading Ltd | 回路基板およびその製造方法、回路装置およびその製造方法、絶縁層付き導電箔 |
JP5749468B2 (ja) * | 2010-09-24 | 2015-07-15 | セミコンダクター・コンポーネンツ・インダストリーズ・リミテッド・ライアビリティ・カンパニー | 回路装置およびその製造方法 |
JP5796956B2 (ja) * | 2010-12-24 | 2015-10-21 | セミコンダクター・コンポーネンツ・インダストリーズ・リミテッド・ライアビリティ・カンパニー | 回路装置およびその製造方法 |
JP5743922B2 (ja) * | 2012-02-21 | 2015-07-01 | 日立オートモティブシステムズ株式会社 | 熱式空気流量測定装置 |
WO2015155831A1 (ja) * | 2014-04-08 | 2015-10-15 | 三菱電機株式会社 | モールドモジュール |
US9397017B2 (en) | 2014-11-06 | 2016-07-19 | Semiconductor Components Industries, Llc | Substrate structures and methods of manufacture |
US11437304B2 (en) | 2014-11-06 | 2022-09-06 | Semiconductor Components Industries, Llc | Substrate structures and methods of manufacture |
US9408301B2 (en) | 2014-11-06 | 2016-08-02 | Semiconductor Components Industries, Llc | Substrate structures and methods of manufacture |
CN108000798B (zh) * | 2017-12-13 | 2020-11-06 | 陕西宝成航空仪表有限责任公司 | 适用于电沉积工艺制造的微型导电环环体成型方法 |
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- 2006-08-30 JP JP2007533379A patent/JP5378683B2/ja active Active
- 2006-08-30 WO PCT/JP2006/317605 patent/WO2007026945A1/ja active Application Filing
- 2006-08-30 KR KR1020087004309A patent/KR20080031449A/ko not_active Application Discontinuation
- 2006-08-30 CN CN2006800320484A patent/CN101253626B/zh not_active Expired - Fee Related
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Also Published As
Publication number | Publication date |
---|---|
KR20080031449A (ko) | 2008-04-08 |
JPWO2007026945A1 (ja) | 2009-03-12 |
CN101253626B (zh) | 2010-09-29 |
US7935899B2 (en) | 2011-05-03 |
CN101253626A (zh) | 2008-08-27 |
JP5378683B2 (ja) | 2013-12-25 |
US20090135572A1 (en) | 2009-05-28 |
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