WO2007054859A3 - Miniature optical component - Google Patents

Miniature optical component Download PDF

Info

Publication number
WO2007054859A3
WO2007054859A3 PCT/IB2006/054065 IB2006054065W WO2007054859A3 WO 2007054859 A3 WO2007054859 A3 WO 2007054859A3 IB 2006054065 W IB2006054065 W IB 2006054065W WO 2007054859 A3 WO2007054859 A3 WO 2007054859A3
Authority
WO
WIPO (PCT)
Prior art keywords
miniature optical
optical component
solder
carrier
light source
Prior art date
Application number
PCT/IB2006/054065
Other languages
French (fr)
Other versions
WO2007054859A2 (en
Inventor
Gunnar Luettgens
Os Koen Van
Samber Marc Andre De
Original Assignee
Philips Intellectual Property
Koninkl Philips Electronics Nv
Gunnar Luettgens
Os Koen Van
Samber Marc Andre De
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Philips Intellectual Property, Koninkl Philips Electronics Nv, Gunnar Luettgens, Os Koen Van, Samber Marc Andre De filed Critical Philips Intellectual Property
Publication of WO2007054859A2 publication Critical patent/WO2007054859A2/en
Publication of WO2007054859A3 publication Critical patent/WO2007054859A3/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements
    • H01L33/60—Reflective elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Abstract

The invention relates to a miniature optical component (31) comprising at least one optically active surface and having at least one base surface area on which at least one soldering surface is arranged via which the miniature optical component (31) can be positioned in a defined manner by at least one corresponding soldering surface on a carrier (1) with the use of a solder, wherein the miniature optical component (31) can also be arranged at a defined distance from a solid-state light source (2). The dimensions of the mutually corresponding soldering surfaces and the solder quantity are attuned to one another such that the defined positioning of the miniature optical components (31) on the carrier (1) can be realized by the liquid or liquefied and subsequently solidified solder, and at least one reference element (12) is arranged for the defined distancing of the miniature optical components (31) from the solid-state light source (2).
PCT/IB2006/054065 2005-11-09 2006-11-02 Miniature optical component WO2007054859A2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP05110507.0 2005-11-09
EP05110507 2005-11-09

Publications (2)

Publication Number Publication Date
WO2007054859A2 WO2007054859A2 (en) 2007-05-18
WO2007054859A3 true WO2007054859A3 (en) 2007-10-18

Family

ID=38023648

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/IB2006/054065 WO2007054859A2 (en) 2005-11-09 2006-11-02 Miniature optical component

Country Status (2)

Country Link
TW (1) TW200724475A (en)
WO (1) WO2007054859A2 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102008021661A1 (en) * 2008-04-30 2009-11-05 Ledon Lighting Jennersdorf Gmbh LED module with frame and printed circuit board
KR102450966B1 (en) * 2014-10-27 2022-10-06 루미리즈 홀딩 비.브이. Directional light emitting arrangement and a method of producing the same

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1987001509A1 (en) * 1985-09-10 1987-03-12 Plessey Overseas Limited Manufacture of a hybrid electronic or optical device
US6759687B1 (en) * 2000-10-13 2004-07-06 Agilent Technologies, Inc. Aligning an optical device system with an optical lens system
US20050041434A1 (en) * 2003-08-20 2005-02-24 Yasushi Yatsuda Light Source and vehicle lamp
US20050067628A1 (en) * 2003-09-30 2005-03-31 Citizen Electronics Co., Ltd. Light emitting diode
US20050133808A1 (en) * 2003-09-11 2005-06-23 Kyocera Corporation Package for housing light-emitting element, light-emitting apparatus and illumination apparatus

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1987001509A1 (en) * 1985-09-10 1987-03-12 Plessey Overseas Limited Manufacture of a hybrid electronic or optical device
US6759687B1 (en) * 2000-10-13 2004-07-06 Agilent Technologies, Inc. Aligning an optical device system with an optical lens system
US20050041434A1 (en) * 2003-08-20 2005-02-24 Yasushi Yatsuda Light Source and vehicle lamp
US20050133808A1 (en) * 2003-09-11 2005-06-23 Kyocera Corporation Package for housing light-emitting element, light-emitting apparatus and illumination apparatus
US20050067628A1 (en) * 2003-09-30 2005-03-31 Citizen Electronics Co., Ltd. Light emitting diode

Also Published As

Publication number Publication date
WO2007054859A2 (en) 2007-05-18
TW200724475A (en) 2007-07-01

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