WO2007056025A3 - Reclaiming substrates having defects and contaminants - Google Patents

Reclaiming substrates having defects and contaminants Download PDF

Info

Publication number
WO2007056025A3
WO2007056025A3 PCT/US2006/042702 US2006042702W WO2007056025A3 WO 2007056025 A3 WO2007056025 A3 WO 2007056025A3 US 2006042702 W US2006042702 W US 2006042702W WO 2007056025 A3 WO2007056025 A3 WO 2007056025A3
Authority
WO
WIPO (PCT)
Prior art keywords
substrates
test
identification code
reclaimed
cassettes
Prior art date
Application number
PCT/US2006/042702
Other languages
French (fr)
Other versions
WO2007056025A2 (en
Inventor
Krishna Vepa
Yashaj Bhatnagar
Ronald Rayandayan
Hong Wang
Original Assignee
Applied Materials Inc
Krishna Vepa
Yashaj Bhatnagar
Ronald Rayandayan
Hong Wang
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Materials Inc, Krishna Vepa, Yashaj Bhatnagar, Ronald Rayandayan, Hong Wang filed Critical Applied Materials Inc
Priority to JP2008539010A priority Critical patent/JP2009521097A/en
Publication of WO2007056025A2 publication Critical patent/WO2007056025A2/en
Publication of WO2007056025A3 publication Critical patent/WO2007056025A3/en

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67242Apparatus for monitoring, sorting or marking
    • H01L21/67294Apparatus for monitoring, sorting or marking using identification means, e.g. labels on substrates or labels on containers
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67242Apparatus for monitoring, sorting or marking
    • H01L21/67288Monitoring of warpage, curvature, damage, defects or the like

Abstract

A process (110), the test substrates to be reclaimed are identified by the system (100) and stored into cassettes (118), each of which is preferably assigned a unique identification code which may include alphanumeric or other symbols. Although the illustrated system is described in connection with silicon test substrates and cassettes, it is appreciated that certain embodiments may be directed to other types of test semiconductor and non-semiconductor substrates including silicon on insulator (SOI), gallium arsenide, germanium, silicon germanium, glass and other test substrates. Also, it is appreciated that storage containers or bins other than cassettes may be used. One example is a FOUP used to transport 300 mm substrates. A computer database (120) in which the system (100) stores the identification code of each test substrate to be reclaimed and the identification code of the particular cassette (118) in which each such test substrate is stored. The system (100) includes a controller comprising a suitable computer or computer network (124) which maintains the cassette database (120). A reader (126) reads the identification code from each test substrate (130) to be reclaimed, for storage in the database (120).
PCT/US2006/042702 2005-11-02 2006-10-31 Reclaiming substrates having defects and contaminants WO2007056025A2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2008539010A JP2009521097A (en) 2005-11-02 2006-10-31 Regeneration of substrates with defects and contaminants

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US11/265,237 US7657390B2 (en) 2005-11-02 2005-11-02 Reclaiming substrates having defects and contaminants
US11/265,237 2005-11-02

Publications (2)

Publication Number Publication Date
WO2007056025A2 WO2007056025A2 (en) 2007-05-18
WO2007056025A3 true WO2007056025A3 (en) 2009-06-25

Family

ID=37996916

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2006/042702 WO2007056025A2 (en) 2005-11-02 2006-10-31 Reclaiming substrates having defects and contaminants

Country Status (6)

Country Link
US (1) US7657390B2 (en)
JP (1) JP2009521097A (en)
KR (1) KR20080075140A (en)
CN (1) CN101632080A (en)
TW (1) TWI368931B (en)
WO (1) WO2007056025A2 (en)

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CN105470157A (en) * 2014-09-12 2016-04-06 上海华虹宏力半导体制造有限公司 Cu content detection method in ICP_MS test
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JP6832658B2 (en) * 2016-09-23 2021-02-24 スタンレー電気株式会社 Light transmission board, display device, signal device, and lighting device
CN111933541A (en) * 2020-08-10 2020-11-13 北京北方华创微电子装备有限公司 Method and system for processing wafer in semiconductor equipment
CN114202133A (en) 2020-09-02 2022-03-18 长鑫存储技术有限公司 Method for detecting process data, computer readable medium and electronic device
CN112366249B (en) * 2020-11-16 2023-10-20 理想万里晖半导体设备(上海)股份有限公司 Solar cell manufacturing method with tracking function and tracking system used by solar cell manufacturing method
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Also Published As

Publication number Publication date
KR20080075140A (en) 2008-08-14
WO2007056025A2 (en) 2007-05-18
US20070099310A1 (en) 2007-05-03
TWI368931B (en) 2012-07-21
TW200737286A (en) 2007-10-01
CN101632080A (en) 2010-01-20
JP2009521097A (en) 2009-05-28
US7657390B2 (en) 2010-02-02

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