WO2007060661A3 - Method and devices for surface mounting - Google Patents

Method and devices for surface mounting Download PDF

Info

Publication number
WO2007060661A3
WO2007060661A3 PCT/IL2006/001347 IL2006001347W WO2007060661A3 WO 2007060661 A3 WO2007060661 A3 WO 2007060661A3 IL 2006001347 W IL2006001347 W IL 2006001347W WO 2007060661 A3 WO2007060661 A3 WO 2007060661A3
Authority
WO
WIPO (PCT)
Prior art keywords
circuit board
printed circuit
solder material
component
casing
Prior art date
Application number
PCT/IL2006/001347
Other languages
French (fr)
Other versions
WO2007060661A2 (en
Inventor
Joel Lang
Original Assignee
Cellergy Ltd
Joel Lang
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Cellergy Ltd, Joel Lang filed Critical Cellergy Ltd
Publication of WO2007060661A2 publication Critical patent/WO2007060661A2/en
Publication of WO2007060661A3 publication Critical patent/WO2007060661A3/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
    • B23K1/0016—Brazing of electronic components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3494—Heating methods for reflowing of solder
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/40—Semiconductor devices
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0756—Uses of liquids, e.g. rinsing, coating, dissolving
    • H05K2203/0776—Uses of liquids not otherwise provided for in H05K2203/0759 - H05K2203/0773
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/30—Details of processes not otherwise provided for in H05K2203/01 - H05K2203/17
    • H05K2203/304—Protecting a component during manufacturing

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

A method and thermal shield for connecting heat sensitive electric/electronic component onto a printed circuit board, which method comprises providing a printed circuit board having solder material applied thereon, placing said component in a casing provided with a liquid whose boiling point is lower than the melting point of said solder material, positioning said casing on said printed circuit board such that connector leads, which extend from one or more of the lateral sides of said component and exit said casing are brought into contact with said solder material, heating the printed circuit board whereby said solder material is melted and subsequently gradually cooling the same to solidify the solder, thereby securing said component to said printed circuit board.
PCT/IL2006/001347 2005-11-23 2006-11-23 Method and devices for surface mounting WO2007060661A2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
IL172146 2005-11-23
IL172146A IL172146A0 (en) 2005-11-23 2005-11-23 Thermal barrier for surface mounting

Publications (2)

Publication Number Publication Date
WO2007060661A2 WO2007060661A2 (en) 2007-05-31
WO2007060661A3 true WO2007060661A3 (en) 2009-04-09

Family

ID=38067628

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/IL2006/001347 WO2007060661A2 (en) 2005-11-23 2006-11-23 Method and devices for surface mounting

Country Status (2)

Country Link
IL (1) IL172146A0 (en)
WO (1) WO2007060661A2 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10827626B2 (en) * 2016-11-08 2020-11-03 Flex Ltd Protective heat shields for thermally sensitive components and methods for protecting thermally sensitive components

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3396894A (en) * 1965-05-11 1968-08-13 Raychem Corp Solder device
US3548265A (en) * 1968-06-11 1970-12-15 Gen Electric Porous anode capacitor
US3616533A (en) * 1969-10-28 1971-11-02 North American Rockwell Method of protecting articles in high temperature environment
US3624458A (en) * 1969-11-26 1971-11-30 Mallory & Co Inc P R Capacitor having a glass-to-metal seal and an elastomeric seal
US4581479A (en) * 1984-11-16 1986-04-08 Moore Theodore W Dimensionally precise electronic component mount
US5095626A (en) * 1986-11-25 1992-03-17 Hitachi, Ltd. Method of producing semiconductor memory packages
US6145280A (en) * 1998-03-18 2000-11-14 Ntk Powerdex, Inc. Flexible packaging for polymer electrolytic cell and method of forming same
US7054139B2 (en) * 2000-12-06 2006-05-30 Energy Storage Systems Pty Ltd Energy storage device

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3396894A (en) * 1965-05-11 1968-08-13 Raychem Corp Solder device
US3548265A (en) * 1968-06-11 1970-12-15 Gen Electric Porous anode capacitor
US3616533A (en) * 1969-10-28 1971-11-02 North American Rockwell Method of protecting articles in high temperature environment
US3624458A (en) * 1969-11-26 1971-11-30 Mallory & Co Inc P R Capacitor having a glass-to-metal seal and an elastomeric seal
US4581479A (en) * 1984-11-16 1986-04-08 Moore Theodore W Dimensionally precise electronic component mount
US5095626A (en) * 1986-11-25 1992-03-17 Hitachi, Ltd. Method of producing semiconductor memory packages
US6145280A (en) * 1998-03-18 2000-11-14 Ntk Powerdex, Inc. Flexible packaging for polymer electrolytic cell and method of forming same
US7054139B2 (en) * 2000-12-06 2006-05-30 Energy Storage Systems Pty Ltd Energy storage device

Also Published As

Publication number Publication date
IL172146A0 (en) 2006-04-10
WO2007060661A2 (en) 2007-05-31

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