WO2007061704A3 - Overlay metrology using the near infra-red spectral range - Google Patents

Overlay metrology using the near infra-red spectral range Download PDF

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Publication number
WO2007061704A3
WO2007061704A3 PCT/US2006/044259 US2006044259W WO2007061704A3 WO 2007061704 A3 WO2007061704 A3 WO 2007061704A3 US 2006044259 W US2006044259 W US 2006044259W WO 2007061704 A3 WO2007061704 A3 WO 2007061704A3
Authority
WO
WIPO (PCT)
Prior art keywords
nir
overlay metrology
overlay
illumination beam
measurements
Prior art date
Application number
PCT/US2006/044259
Other languages
French (fr)
Other versions
WO2007061704A2 (en
Inventor
Michael Adel
Aviv Frommer
Original Assignee
Kla Tencor Tech Corp
Michael Adel
Aviv Frommer
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kla Tencor Tech Corp, Michael Adel, Aviv Frommer filed Critical Kla Tencor Tech Corp
Priority to KR1020187033135A priority Critical patent/KR20180125621A/en
Priority to KR1020167008367A priority patent/KR20160040737A/en
Priority to KR1020147030323A priority patent/KR20140134339A/en
Publication of WO2007061704A2 publication Critical patent/WO2007061704A2/en
Publication of WO2007061704A3 publication Critical patent/WO2007061704A3/en

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/24—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures
    • G01B11/2441—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures using interferometry
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70605—Workpiece metrology
    • G03F7/70616—Monitoring the printed patterns
    • G03F7/70633—Overlay, i.e. relative alignment between patterns printed by separate exposures in different layers, or in the same layer in multiple exposures or stitching
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/17—Systems in which incident light is modified in accordance with the properties of the material investigated
    • G01N21/21—Polarisation-affecting properties
    • G01N21/211—Ellipsometry
    • G01N2021/213—Spectrometric ellipsometry

Abstract

A method and tool for conducting NIR overlay metrology is disclosed. Such methods involve generating a filtered illumination beam including NIR radiation and directing that illumination beam onto an overlay target to produce an optical signal that is detected and used to generate overlay metrology measurements. The method is particularly suited to substrate applications having layers of opaque material that are transmissive in the NIR range (e.g., amorphous carbon) and where NTR imaging is used to obtain overlay measurements. A tool implementation includes a means for generating a filtered illumination beam extending into the NIR range and a detector for receiving NIR signal from an NIR illuminated target and a computer for processing the signal data to obtain overlay metrology measurements.
PCT/US2006/044259 2005-11-18 2006-11-13 Overlay metrology using the near infra-red spectral range WO2007061704A2 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
KR1020187033135A KR20180125621A (en) 2005-11-18 2006-11-13 Overlay metrology using the near infra-red spectral range
KR1020167008367A KR20160040737A (en) 2005-11-18 2006-11-13 Overlay metrology using the near infra-red spectral range
KR1020147030323A KR20140134339A (en) 2005-11-18 2006-11-13 Overlay metrology using the near infra-red spectral range

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US73819105P 2005-11-18 2005-11-18
US60/738,191 2005-11-18
US11/557,880 US7684039B2 (en) 2005-11-18 2006-11-08 Overlay metrology using the near infra-red spectral range
US11/557,880 2006-11-08

Publications (2)

Publication Number Publication Date
WO2007061704A2 WO2007061704A2 (en) 2007-05-31
WO2007061704A3 true WO2007061704A3 (en) 2009-05-22

Family

ID=38067734

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2006/044259 WO2007061704A2 (en) 2005-11-18 2006-11-13 Overlay metrology using the near infra-red spectral range

Country Status (3)

Country Link
US (1) US7684039B2 (en)
KR (4) KR20140134339A (en)
WO (1) WO2007061704A2 (en)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7438468B2 (en) * 2004-11-12 2008-10-21 Applied Materials, Inc. Multiple band pass filtering for pyrometry in laser based annealing systems
US7916295B2 (en) * 2008-09-03 2011-03-29 Macronix International Co., Ltd. Alignment mark and method of getting position reference for wafer
JP2014035307A (en) * 2012-08-10 2014-02-24 Hitachi High-Technologies Corp Defect inspection device and defect inspection method
WO2014058422A1 (en) * 2012-10-10 2014-04-17 Empire Technology Development, Llc Defect detection in saturable absorbers
US20160139032A1 (en) * 2014-11-19 2016-05-19 Kla-Tencor Corporation Inspection system and method using an off-axis unobscured objective lens
CN107843190B (en) * 2016-09-21 2020-09-01 睿励科学仪器（上海）有限公司 Optical critical dimension measuring system and method thereof
US10551166B2 (en) * 2017-10-11 2020-02-04 Kla-Tencor Corporation Optical measurement of a highly absorbing film layer over highly reflective film stacks
US11067389B2 (en) * 2018-03-13 2021-07-20 Kla Corporation Overlay metrology system and method
US10622238B2 (en) 2018-06-07 2020-04-14 Kla-Tencor Corporation Overlay measurement using phase and amplitude modeling
KR20230052878A (en) 2020-08-17 2023-04-20 도쿄엘렉트론가부시키가이샤 Tunable Wavelength Transparency Layer Stack

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2357158A (en) * 1996-07-22 2001-06-13 Kla Instr Corp Inspecting objects with multi-wavelength ultraviolet radiation
US20040063008A1 (en) * 2002-09-26 2004-04-01 Advanced Micro Devices, Inc. Post etch overlay metrology to avoid absorbing layers preventing measurements
US20050012928A1 (en) * 2003-07-17 2005-01-20 Abdurrahman Sezginer Apparatus and method for measuring overlay by diffraction gratings

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2571307A (en) * 1950-07-03 1951-10-16 Northrop Aircraft Inc Infrared objective lens
GB8801366D0 (en) * 1988-01-21 1988-02-17 Secr Defence Infra red transparent materials
US5835214A (en) 1991-02-22 1998-11-10 Applied Spectral Imaging Ltd. Method and apparatus for spectral analysis of images
US5856871A (en) 1993-08-18 1999-01-05 Applied Spectral Imaging Ltd. Film thickness mapping using interferometric spectral imaging
US5477322A (en) * 1994-10-13 1995-12-19 Nirsystems Incorporated Spectrophotometer with light source in the form of a light emitting diode array
US6064517A (en) 1996-07-22 2000-05-16 Kla-Tencor Corporation High NA system for multiple mode imaging
US6650357B1 (en) * 1997-04-09 2003-11-18 Richardson Technologies, Inc. Color translating UV microscope
US6142629A (en) 1998-08-30 2000-11-07 Applied Spectral Imaging Ltd. Spectral imaging using illumination of preselected spectral content
US6734962B2 (en) * 2000-10-13 2004-05-11 Chemimage Corporation Near infrared chemical imaging microscope
JP2001194321A (en) * 2000-01-12 2001-07-19 Tokyo Seimitsu Co Ltd Semiconductor wafer inspection device
US7317531B2 (en) 2002-12-05 2008-01-08 Kla-Tencor Technologies Corporation Apparatus and methods for detecting overlay errors using scatterometry
US7068833B1 (en) 2000-08-30 2006-06-27 Kla-Tencor Corporation Overlay marks, methods of overlay mark design and methods of overlay measurements
BR0105474A (en) * 2001-09-26 2003-09-23 Fundacao De Amparo A Pesquisa Deposition process of hydrogenated amorphous carbon film, hydrogenated amorphous carbon film and hydrogenated amorphous carbon film coated article
US7145722B2 (en) * 2003-04-24 2006-12-05 Banpil Photonics, Inc. Optical filter and method of manufacturing thereof
US7132201B2 (en) * 2003-09-12 2006-11-07 Micron Technology, Inc. Transparent amorphous carbon structure in semiconductor devices

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2357158A (en) * 1996-07-22 2001-06-13 Kla Instr Corp Inspecting objects with multi-wavelength ultraviolet radiation
US20040063008A1 (en) * 2002-09-26 2004-04-01 Advanced Micro Devices, Inc. Post etch overlay metrology to avoid absorbing layers preventing measurements
US20050012928A1 (en) * 2003-07-17 2005-01-20 Abdurrahman Sezginer Apparatus and method for measuring overlay by diffraction gratings

Also Published As

Publication number Publication date
US7684039B2 (en) 2010-03-23
US20070187606A1 (en) 2007-08-16
KR20140134339A (en) 2014-11-21
WO2007061704A2 (en) 2007-05-31
KR20080070863A (en) 2008-07-31
KR20180125621A (en) 2018-11-23
KR20160040737A (en) 2016-04-14

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