WO2007085022A3 - System, apparatus and methods for processing substrates using acoustic energy - Google Patents
System, apparatus and methods for processing substrates using acoustic energy Download PDFInfo
- Publication number
- WO2007085022A3 WO2007085022A3 PCT/US2007/060861 US2007060861W WO2007085022A3 WO 2007085022 A3 WO2007085022 A3 WO 2007085022A3 US 2007060861 W US2007060861 W US 2007060861W WO 2007085022 A3 WO2007085022 A3 WO 2007085022A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- crystal
- methods
- ceramic
- acoustic energy
- transducer assembly
- Prior art date
Links
- 239000000758 substrate Substances 0.000 title 1
- 239000013078 crystal Substances 0.000 abstract 4
- 239000000919 ceramic Substances 0.000 abstract 3
- 238000004140 cleaning Methods 0.000 abstract 1
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
- B08B3/10—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
- B08B3/12—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration by sonic or ultrasonic vibrations
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
- B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
- B06B1/00—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
- B06B1/02—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
- B06B1/06—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction
- B06B1/0644—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using a single piezoelectric element
- B06B1/0648—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using a single piezoelectric element of rectangular shape
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
- B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
- B06B1/00—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
- B06B1/02—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
- B06B1/06—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction
- B06B1/0644—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using a single piezoelectric element
- B06B1/0655—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using a single piezoelectric element of cylindrical shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67057—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing with the semiconductor substrates being dipped in baths or vessels
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01012—Magnesium [Mg]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01019—Potassium [K]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/0102—Calcium [Ca]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01021—Scandium [Sc]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01025—Manganese [Mn]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01057—Lanthanum [La]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01067—Holmium [Ho]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01068—Erbium [Er]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01078—Platinum [Pt]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01079—Gold [Au]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3011—Impedance
Abstract
A wafer cleaning system having a crystal or cersmic transducer assembly. The transducer assembly is adapted to convert electrical energy into sonic energy. The crystal or ceramic has a first conductive surface, The transducer assembly also has a transmitter made of an inert non-reactive plastic that transmits the sonic energy generated by the crystal or ceramic. The transmitter has a surface bonded directly to the conductive surface of the crystal or ceramic.
Applications Claiming Priority (10)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US76082006P | 2006-01-20 | 2006-01-20 | |
US60/760,820 | 2006-01-20 | ||
US76282706P | 2006-01-26 | 2006-01-26 | |
US60/762,827 | 2006-01-26 | ||
US83796506P | 2006-08-16 | 2006-08-16 | |
US60/837,965 | 2006-08-16 | ||
US88600807P | 2007-01-22 | 2007-01-22 | |
US11/625,651 US20070170812A1 (en) | 2006-01-20 | 2007-01-22 | System apparatus and methods for processing substrates using acoustic energy |
US60/886,008 | 2007-01-22 | ||
US11/625,651 | 2007-01-22 |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2007085022A2 WO2007085022A2 (en) | 2007-07-26 |
WO2007085022A3 true WO2007085022A3 (en) | 2008-04-17 |
Family
ID=38284861
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US2007/060861 WO2007085022A2 (en) | 2006-01-20 | 2007-01-22 | System, apparatus and methods for processing substrates using acoustic energy |
Country Status (2)
Country | Link |
---|---|
US (1) | US20070170812A1 (en) |
WO (1) | WO2007085022A2 (en) |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9049520B2 (en) * | 2006-01-20 | 2015-06-02 | Akrion Systems Llc | Composite transducer apparatus and system for processing a substrate and method of constructing the same |
US9987666B2 (en) | 2006-01-20 | 2018-06-05 | Naura Akrion Inc. | Composite transducer apparatus and system for processing a substrate and method of constructing the same |
US20080124777A1 (en) * | 2006-11-29 | 2008-05-29 | Canon U.S. Life Sciences, Inc. | Method for releasing genetic material from solid phase |
US20080121591A1 (en) * | 2006-11-29 | 2008-05-29 | Canon U.S. Life Sciences, Inc. | Device for nucleic acid preparation |
US20080131954A1 (en) * | 2006-11-30 | 2008-06-05 | Canon U.S. Life Sciences, Inc. | Method of Separating Target DNA from Mixed DNA |
US20090137024A1 (en) * | 2007-11-28 | 2009-05-28 | Canon U.S. Life Sciences, Inc. | Method of Separating Target DNA from Mixed DNA |
US8845812B2 (en) | 2009-06-12 | 2014-09-30 | Micron Technology, Inc. | Method for contamination removal using magnetic particles |
AU2010290941B2 (en) * | 2009-09-04 | 2015-01-15 | Bae Systems Plc | Acoustic transmission |
DE112014002730T5 (en) | 2013-06-07 | 2016-03-03 | Entegris, Inc. | Sensor with protective layer |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4354132A (en) * | 1979-04-06 | 1982-10-12 | Siemens Aktiengesellschaft | Ultrasonic transducer with a plastic piezoelectric receiving layer and a non plastic transmitting layer |
US4924890A (en) * | 1986-05-16 | 1990-05-15 | Eastman Kodak Company | Method and apparatus for cleaning semiconductor wafers |
US5355048A (en) * | 1993-07-21 | 1994-10-11 | Fsi International, Inc. | Megasonic transducer for cleaning substrate surfaces |
US5608267A (en) * | 1992-09-17 | 1997-03-04 | Olin Corporation | Molded plastic semiconductor package including heat spreader |
US6210510B1 (en) * | 1996-06-28 | 2001-04-03 | International Business Machines Corporation | Polymer protected component |
US6679272B2 (en) * | 2001-08-03 | 2004-01-20 | Verteq, Inc. | Megasonic probe energy attenuator |
Family Cites Families (29)
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US2852501A (en) * | 1954-10-05 | 1958-09-16 | Monsanto Chemicals | Polymerization of ethylene |
US4401131A (en) * | 1981-05-15 | 1983-08-30 | Gca Corporation | Apparatus for cleaning semiconductor wafers |
US5100714A (en) * | 1986-07-24 | 1992-03-31 | Ceramic Packaging, Inc. | Metallized ceramic substrate and method therefor |
US4869278A (en) * | 1987-04-29 | 1989-09-26 | Bran Mario E | Megasonic cleaning apparatus |
US5233067A (en) * | 1990-05-08 | 1993-08-03 | Rogers Corporation | Metallized polymeric substrates |
US5090432A (en) * | 1990-10-16 | 1992-02-25 | Verteq, Inc. | Single wafer megasonic semiconductor wafer processing system |
US5950645A (en) * | 1993-10-20 | 1999-09-14 | Verteq, Inc. | Semiconductor wafer cleaning system |
US5556479A (en) * | 1994-07-15 | 1996-09-17 | Verteq, Inc. | Method and apparatus for drying semiconductor wafers |
US6039059A (en) * | 1996-09-30 | 2000-03-21 | Verteq, Inc. | Wafer cleaning system |
US6122837A (en) * | 1997-06-25 | 2000-09-26 | Verteq, Inc. | Centrifugal wafer processor and method |
DE19811143B4 (en) * | 1998-03-14 | 2009-09-17 | TRüTZSCHLER GMBH & CO. KG | Apparatus for feeding and weighing (weighing feeder) textile fibers, in particular cotton and man-made fibers |
US6311702B1 (en) * | 1998-11-11 | 2001-11-06 | Applied Materials, Inc. | Megasonic cleaner |
US6799583B2 (en) * | 1999-05-13 | 2004-10-05 | Suraj Puri | Methods for cleaning microelectronic substrates using ultradilute cleaning liquids |
US6904921B2 (en) * | 2001-04-23 | 2005-06-14 | Product Systems Incorporated | Indium or tin bonded megasonic transducer systems |
US6539952B2 (en) * | 2000-04-25 | 2003-04-01 | Solid State Equipment Corp. | Megasonic treatment apparatus |
WO2002001613A2 (en) * | 2000-06-26 | 2002-01-03 | Applied Materials, Inc. | Method and apparatus for wafer cleaning |
US7451774B2 (en) * | 2000-06-26 | 2008-11-18 | Applied Materials, Inc. | Method and apparatus for wafer cleaning |
US6684691B1 (en) * | 2000-09-19 | 2004-02-03 | General Motors Corporation | Method and system for determining tire pressure imbalances |
US6732749B2 (en) * | 2000-12-22 | 2004-05-11 | Akrion, Llc | Particle barrier drain |
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US6791242B2 (en) * | 2001-11-02 | 2004-09-14 | Product Systems Incorporated | Radial power megasonic transducer |
DE60130663T2 (en) * | 2001-11-13 | 2008-07-17 | Perkins Engines Co. Ltd. | Cylinder head cover with electrical connection |
US6875284B2 (en) * | 2002-01-23 | 2005-04-05 | Semitool, Inc. | Side-specific cleaning method and apparatus |
US6843855B2 (en) * | 2002-03-12 | 2005-01-18 | Applied Materials, Inc. | Methods for drying wafer |
GB2391324B (en) * | 2002-07-29 | 2004-07-14 | Visteon Global Tech Inc | Open loop fuel controller |
CN1732711B (en) * | 2002-11-01 | 2010-11-03 | 艾奎昂有限责任公司 | Substrate process tank with acoustical source transmission and method of processing substrates |
US7135122B2 (en) * | 2004-03-31 | 2006-11-14 | Freudenberg-Nok General Partnership | Polytetrafluoroethylene composites |
US20050252522A1 (en) * | 2004-05-11 | 2005-11-17 | Struven Kenneth C | Megasonic cleaning with obliquely aligned transducer |
-
2007
- 2007-01-22 WO PCT/US2007/060861 patent/WO2007085022A2/en active Application Filing
- 2007-01-22 US US11/625,651 patent/US20070170812A1/en not_active Abandoned
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4354132A (en) * | 1979-04-06 | 1982-10-12 | Siemens Aktiengesellschaft | Ultrasonic transducer with a plastic piezoelectric receiving layer and a non plastic transmitting layer |
US4924890A (en) * | 1986-05-16 | 1990-05-15 | Eastman Kodak Company | Method and apparatus for cleaning semiconductor wafers |
US5608267A (en) * | 1992-09-17 | 1997-03-04 | Olin Corporation | Molded plastic semiconductor package including heat spreader |
US5355048A (en) * | 1993-07-21 | 1994-10-11 | Fsi International, Inc. | Megasonic transducer for cleaning substrate surfaces |
US6210510B1 (en) * | 1996-06-28 | 2001-04-03 | International Business Machines Corporation | Polymer protected component |
US6679272B2 (en) * | 2001-08-03 | 2004-01-20 | Verteq, Inc. | Megasonic probe energy attenuator |
Also Published As
Publication number | Publication date |
---|---|
US20070170812A1 (en) | 2007-07-26 |
WO2007085022A2 (en) | 2007-07-26 |
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