WO2007103551A3 - Apparatus and method for testing semiconductor devices - Google Patents

Apparatus and method for testing semiconductor devices Download PDF

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Publication number
WO2007103551A3
WO2007103551A3 PCT/US2007/006026 US2007006026W WO2007103551A3 WO 2007103551 A3 WO2007103551 A3 WO 2007103551A3 US 2007006026 W US2007006026 W US 2007006026W WO 2007103551 A3 WO2007103551 A3 WO 2007103551A3
Authority
WO
WIPO (PCT)
Prior art keywords
semiconductor devices
interface
testing semiconductor
testing
receptacles
Prior art date
Application number
PCT/US2007/006026
Other languages
French (fr)
Other versions
WO2007103551A2 (en
Inventor
Christian O Cojocneanu
Doru G Iosub
Original Assignee
Testmetrix Inc
Christian O Cojocneanu
Doru G Iosub
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Testmetrix Inc, Christian O Cojocneanu, Doru G Iosub filed Critical Testmetrix Inc
Priority to JP2008558417A priority Critical patent/JP2009529140A/en
Publication of WO2007103551A2 publication Critical patent/WO2007103551A2/en
Publication of WO2007103551A3 publication Critical patent/WO2007103551A3/en

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2887—Features relating to contacting the IC under test, e.g. probe heads; chucks involving moving the probe head or the IC under test; docking stations

Abstract

An apparatus for testing semiconductor devices includes a table having receptacles for trays holding semiconductor devices to be tested. An interface is positioned between the receptacles and at least one test device. The interface is customized to electrically connect the semiconductor devices to the at least one test device. The apparatus also includes a press that moves toward the table and applies force to each of the semiconductor devices, thereby securing the semiconductor devices in place for testing and securing the electrical connection to the interface.
PCT/US2007/006026 2006-03-07 2007-03-07 Apparatus and method for testing semiconductor devices WO2007103551A2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2008558417A JP2009529140A (en) 2006-03-07 2007-03-07 Apparatus and method for inspecting semiconductor elements

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US78033006P 2006-03-07 2006-03-07
US60/780,330 2006-03-07
US11/371,757 US7528617B2 (en) 2006-03-07 2006-03-08 Apparatus having a member to receive a tray(s) that holds semiconductor devices for testing
US11/371,757 2006-03-08

Publications (2)

Publication Number Publication Date
WO2007103551A2 WO2007103551A2 (en) 2007-09-13
WO2007103551A3 true WO2007103551A3 (en) 2009-02-05

Family

ID=38475592

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2007/006026 WO2007103551A2 (en) 2006-03-07 2007-03-07 Apparatus and method for testing semiconductor devices

Country Status (3)

Country Link
US (1) US7528617B2 (en)
JP (1) JP2009529140A (en)
WO (1) WO2007103551A2 (en)

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Also Published As

Publication number Publication date
US20070210811A1 (en) 2007-09-13
JP2009529140A (en) 2009-08-13
US7528617B2 (en) 2009-05-05
WO2007103551A2 (en) 2007-09-13

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