WO2007103741A3 - Emi shielding and thermal management assemblies including frames and covers with multi-position latching - Google Patents

Emi shielding and thermal management assemblies including frames and covers with multi-position latching Download PDF

Info

Publication number
WO2007103741A3
WO2007103741A3 PCT/US2007/063091 US2007063091W WO2007103741A3 WO 2007103741 A3 WO2007103741 A3 WO 2007103741A3 US 2007063091 W US2007063091 W US 2007063091W WO 2007103741 A3 WO2007103741 A3 WO 2007103741A3
Authority
WO
WIPO (PCT)
Prior art keywords
emi shielding
thermal management
covers
management assemblies
assemblies including
Prior art date
Application number
PCT/US2007/063091
Other languages
French (fr)
Other versions
WO2007103741A2 (en
Inventor
Gerald Robert English
Allan Richard Zuehlsdorf
Original Assignee
Laird Technologies Inc
Gerald Robert English
Allan Richard Zuehlsdorf
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Laird Technologies Inc, Gerald Robert English, Allan Richard Zuehlsdorf filed Critical Laird Technologies Inc
Priority to EP07757737A priority Critical patent/EP1997363B1/en
Priority to DE602007010741T priority patent/DE602007010741D1/en
Priority to AT07757737T priority patent/ATE489844T1/en
Priority to CN2007800081469A priority patent/CN101395980B/en
Publication of WO2007103741A2 publication Critical patent/WO2007103741A2/en
Publication of WO2007103741A3 publication Critical patent/WO2007103741A3/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/002—Casings with localised screening
    • H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
    • H05K9/0024—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields
    • H05K9/0032—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields having multiple parts, e.g. frames mating with lids
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/02—Details
    • H05K5/03—Covers

Abstract

According to various aspects of the present disclosure, exemplary embodiments are of assemblies capable of providing board level EMI shielding and heat dissipation of one or more electrical components. Other aspects relate to components of such assemblies. Further aspects relate to methods of using EMI shielding and thermal management assemblies. Additional aspects relate to methods of making EMI shielding and thermal management assemblies, and methods of making the components thereof.
PCT/US2007/063091 2006-03-09 2007-03-01 Emi shielding and thermal management assemblies including frames and covers with multi-position latching WO2007103741A2 (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
EP07757737A EP1997363B1 (en) 2006-03-09 2007-03-01 Emi shielding and thermal management assemblies including frames and covers with multi-position latching
DE602007010741T DE602007010741D1 (en) 2006-03-09 2007-03-01 EMI SHIELDING AND HEAT MANAGEMENT ASSEMBLIES MIELUNG
AT07757737T ATE489844T1 (en) 2006-03-09 2007-03-01 EMI SHIELDING AND THERMAL MANAGEMENT ASSEMBLIES WITH MULTI-POSITION LOCKING FRAME AND COVERS
CN2007800081469A CN101395980B (en) 2006-03-09 2007-03-01 EMI shielding and thermal management assemblies including frames and covers with multi-position latching

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US78100006P 2006-03-09 2006-03-09
US60/781,000 2006-03-09
US11/440,618 2006-05-25
US11/440,618 US7623360B2 (en) 2006-03-09 2006-05-25 EMI shielding and thermal management assemblies including frames and covers with multi-position latching

Publications (2)

Publication Number Publication Date
WO2007103741A2 WO2007103741A2 (en) 2007-09-13
WO2007103741A3 true WO2007103741A3 (en) 2008-05-15

Family

ID=38475692

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2007/063091 WO2007103741A2 (en) 2006-03-09 2007-03-01 Emi shielding and thermal management assemblies including frames and covers with multi-position latching

Country Status (8)

Country Link
US (1) US7623360B2 (en)
EP (1) EP1997363B1 (en)
KR (1) KR101034920B1 (en)
CN (1) CN101395980B (en)
AT (1) ATE489844T1 (en)
DE (1) DE602007010741D1 (en)
TW (1) TWI328999B (en)
WO (1) WO2007103741A2 (en)

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KR101034920B1 (en) 2011-05-17
US7623360B2 (en) 2009-11-24
EP1997363A4 (en) 2010-04-07
EP1997363A2 (en) 2008-12-03
CN101395980A (en) 2009-03-25
TW200810683A (en) 2008-02-16
WO2007103741A2 (en) 2007-09-13
DE602007010741D1 (en) 2011-01-05
CN101395980B (en) 2011-09-07
KR20080106921A (en) 2008-12-09
TWI328999B (en) 2010-08-11
EP1997363B1 (en) 2010-11-24
US20070210082A1 (en) 2007-09-13
ATE489844T1 (en) 2010-12-15

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