WO2007106101A3 - Process for making contained layers and devices made with same - Google Patents

Process for making contained layers and devices made with same Download PDF

Info

Publication number
WO2007106101A3
WO2007106101A3 PCT/US2006/013118 US2006013118W WO2007106101A3 WO 2007106101 A3 WO2007106101 A3 WO 2007106101A3 US 2006013118 W US2006013118 W US 2006013118W WO 2007106101 A3 WO2007106101 A3 WO 2007106101A3
Authority
WO
WIPO (PCT)
Prior art keywords
layer
same
devices made
contained layers
making contained
Prior art date
Application number
PCT/US2006/013118
Other languages
French (fr)
Other versions
WO2007106101A2 (en
Inventor
Charles D Lang
Stephen Sorich
Charles K Taylor
Douglas R Anton
Alberto Goenaga
Paul A Sant
Original Assignee
Du Pont
Charles D Lang
Stephen Sorich
Charles K Taylor
Douglas R Anton
Alberto Goenaga
Paul A Sant
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Du Pont, Charles D Lang, Stephen Sorich, Charles K Taylor, Douglas R Anton, Alberto Goenaga, Paul A Sant filed Critical Du Pont
Priority to CN200680053669.0A priority Critical patent/CN101507177B/en
Priority to JP2008557249A priority patent/JP2009528663A/en
Priority to EP06749552A priority patent/EP1989818A4/en
Publication of WO2007106101A2 publication Critical patent/WO2007106101A2/en
Publication of WO2007106101A3 publication Critical patent/WO2007106101A3/en

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/12—Deposition of organic active material using liquid deposition, e.g. spin coating
    • H10K71/13—Deposition of organic active material using liquid deposition, e.g. spin coating using printing techniques, e.g. ink-jet printing or screen printing
    • H10K71/135—Deposition of organic active material using liquid deposition, e.g. spin coating using printing techniques, e.g. ink-jet printing or screen printing using ink-jet printing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04L—TRANSMISSION OF DIGITAL INFORMATION, e.g. TELEGRAPHIC COMMUNICATION
    • H04L9/00—Cryptographic mechanisms or cryptographic arrangements for secret or secure communications; Network security protocols
    • H04L9/30—Public key, i.e. encryption algorithm being computationally infeasible to invert or user's encryption keys not requiring secrecy
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/10—OLEDs or polymer light-emitting diodes [PLED]
    • H10K50/11—OLEDs or polymer light-emitting diodes [PLED] characterised by the electroluminescent [EL] layers

Abstract

There is provided a process for forming a contained second layer over a first layer, including the steps: forming the first layer having a first surface energy; treating the first layer with a reactive surface-active composition to form a treated first layer having a second surface energy which is lower than the first surface energy; exposing the treated first layer with radiation; and forming the second layer. There is also provided an organic electronic device made by the process.
PCT/US2006/013118 2006-03-02 2006-04-10 Process for making contained layers and devices made with same WO2007106101A2 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
CN200680053669.0A CN101507177B (en) 2006-03-02 2006-04-10 Process for making contained layers and devices made with same
JP2008557249A JP2009528663A (en) 2006-03-02 2006-04-10 Method for manufacturing a confined layer and device manufactured by the method
EP06749552A EP1989818A4 (en) 2006-03-02 2006-04-10 Process for making contained layers and devices made with same

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US75154906P 2006-03-02 2006-03-02
US60/751,549 2006-03-02

Publications (2)

Publication Number Publication Date
WO2007106101A2 WO2007106101A2 (en) 2007-09-20
WO2007106101A3 true WO2007106101A3 (en) 2009-04-16

Family

ID=38470737

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2006/013118 WO2007106101A2 (en) 2006-03-02 2006-04-10 Process for making contained layers and devices made with same

Country Status (6)

Country Link
EP (1) EP1989818A4 (en)
JP (2) JP2009528663A (en)
KR (1) KR20080108100A (en)
CN (1) CN101507177B (en)
TW (1) TW200735435A (en)
WO (1) WO2007106101A2 (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2009052085A1 (en) * 2007-10-15 2009-04-23 E. I. Du Pont De Nemours And Company Solution processed electronic devices
KR20100094475A (en) * 2007-10-26 2010-08-26 이 아이 듀폰 디 네모아 앤드 캄파니 Process and materials for making contained layers and devices made with same
EP2225776A4 (en) 2007-12-14 2013-01-16 Du Pont Backplane structures for electronic devices
CN108219588A (en) * 2013-10-31 2018-06-29 科迪华公司 For the composition for ink for including polythiophene of ink jet printing

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5435887A (en) * 1993-11-03 1995-07-25 Massachusetts Institute Of Technology Methods for the fabrication of microstructure arrays
US20040079940A1 (en) * 2002-08-02 2004-04-29 Samsung Sdi Co., Ltd. Substrate and organic electroluminescence device using the substrate
US20040175646A1 (en) * 2001-07-26 2004-09-09 Tadashi Hatanaka Polyamic acid resin composition
US20050023661A1 (en) * 2003-02-06 2005-02-03 Neomax Co., Ltd. Hermetic sealing cap and method of manufacturing the same

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5416203A (en) * 1977-07-07 1979-02-06 Nippon Paint Co Ltd Dry making method of photosensitive resin plate
US5392980A (en) * 1993-12-29 1995-02-28 Dell Usa, L.P. Method and apparatus for reworking ball grid array packages to allow reuse of functional devices
DE19500912A1 (en) * 1995-01-13 1996-07-18 Basf Ag Electroluminescent arrangement
JPH09203803A (en) * 1996-01-25 1997-08-05 Asahi Glass Co Ltd Production of color filter and liquid crystal display element formed by using the color filter
JP4413035B2 (en) * 1997-08-08 2010-02-10 大日本印刷株式会社 Pattern forming body and pattern forming method
KR20010085420A (en) * 2000-02-23 2001-09-07 기타지마 요시토시 Electroluminescence element and method manufacturing the same
JP2001237069A (en) * 2000-02-23 2001-08-31 Dainippon Printing Co Ltd El element and manufacturing method of the same
US6656611B2 (en) * 2001-07-20 2003-12-02 Osram Opto Semiconductors Gmbh Structure-defining material for OLEDs
JP4231645B2 (en) * 2001-12-12 2009-03-04 大日本印刷株式会社 Method for producing pattern forming body
US6955773B2 (en) * 2002-02-28 2005-10-18 E.I. Du Pont De Nemours And Company Polymer buffer layers and their use in light-emitting diodes
EP1560068B1 (en) * 2002-11-06 2008-01-23 Asahi Glass Company Ltd. Barrier rib and its method of preparation
JP2004177793A (en) * 2002-11-28 2004-06-24 Seiko Epson Corp Method for manufacturing microstructure, spontaneous light emission element, optical element and device manufactured by using the method, and electronic apparatus provided with the device
JP2004234901A (en) * 2003-01-28 2004-08-19 Seiko Epson Corp Display substrate, organic el display device, manufacturing method of display substrate and electronic apparatus
JP4632193B2 (en) * 2003-09-18 2011-02-16 大日本印刷株式会社 Patterning substrate manufacturing method
US7067841B2 (en) * 2004-04-22 2006-06-27 E. I. Du Pont De Nemours And Company Organic electronic devices

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5435887A (en) * 1993-11-03 1995-07-25 Massachusetts Institute Of Technology Methods for the fabrication of microstructure arrays
US20040175646A1 (en) * 2001-07-26 2004-09-09 Tadashi Hatanaka Polyamic acid resin composition
US20040079940A1 (en) * 2002-08-02 2004-04-29 Samsung Sdi Co., Ltd. Substrate and organic electroluminescence device using the substrate
US20050023661A1 (en) * 2003-02-06 2005-02-03 Neomax Co., Ltd. Hermetic sealing cap and method of manufacturing the same

Also Published As

Publication number Publication date
EP1989818A4 (en) 2011-05-18
TW200735435A (en) 2007-09-16
JP2013048118A (en) 2013-03-07
CN101507177A (en) 2009-08-12
WO2007106101A2 (en) 2007-09-20
KR20080108100A (en) 2008-12-11
JP2009528663A (en) 2009-08-06
CN101507177B (en) 2014-08-13
EP1989818A2 (en) 2008-11-12

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