WO2007106363A3 - Improved multi-layer device - Google Patents

Improved multi-layer device Download PDF

Info

Publication number
WO2007106363A3
WO2007106363A3 PCT/US2007/005853 US2007005853W WO2007106363A3 WO 2007106363 A3 WO2007106363 A3 WO 2007106363A3 US 2007005853 W US2007005853 W US 2007005853W WO 2007106363 A3 WO2007106363 A3 WO 2007106363A3
Authority
WO
WIPO (PCT)
Prior art keywords
wafer
terminal
layer device
insulator
electrically connected
Prior art date
Application number
PCT/US2007/005853
Other languages
French (fr)
Other versions
WO2007106363A2 (en
Inventor
Tom Kwa
Lihn Le
Nina Tikhomirova
Original Assignee
Endevco Corp
Tom Kwa
Lihn Le
Nina Tikhomirova
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Endevco Corp, Tom Kwa, Lihn Le, Nina Tikhomirova filed Critical Endevco Corp
Priority to EP07752545A priority Critical patent/EP1999780A4/en
Publication of WO2007106363A2 publication Critical patent/WO2007106363A2/en
Publication of WO2007106363A3 publication Critical patent/WO2007106363A3/en

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R33/00—Arrangements or instruments for measuring magnetic variables
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/562—Protection against mechanical damage

Abstract

A multi-layer device is provided for connecting to an electrical unit is enclosed. A first wafer has a first outer terminal and a second outer terminal with etch pits. A first insulator has a first surface bonded to the first wafer and a first inner terminal located on an opposing second surface. A second wafer has a first surface bonded to the second surface of the first insulating layer and includes a pillar electrically connected to the first wafer. A second insulator has a first surface bonded to a second surface of the second wafer and a second inner terminal located on the first surface of the second insulator. The first outer terminal is electrically connected to the first inner terminal, and the second outer terminal is electrically connected to the second inner terminal. The first and second outer terminals are adapted for connecting to an electrical unit.
PCT/US2007/005853 2006-03-10 2007-03-06 Improved multi-layer device WO2007106363A2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
EP07752545A EP1999780A4 (en) 2006-03-10 2007-03-06 Improved multi-layer device

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US11/373,520 US7696083B2 (en) 2006-03-10 2006-03-10 Multi-layer device
US11/373,520 2006-03-10

Publications (2)

Publication Number Publication Date
WO2007106363A2 WO2007106363A2 (en) 2007-09-20
WO2007106363A3 true WO2007106363A3 (en) 2009-02-26

Family

ID=38479450

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2007/005853 WO2007106363A2 (en) 2006-03-10 2007-03-06 Improved multi-layer device

Country Status (3)

Country Link
US (1) US7696083B2 (en)
EP (1) EP1999780A4 (en)
WO (1) WO2007106363A2 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8371160B2 (en) 2009-12-16 2013-02-12 Meggitt (San Juan Capistrano), Inc. Weatherized direct-mount absolute pressure sensor

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6593651B1 (en) * 2002-01-30 2003-07-15 Endevco Corporation Terminals for multi-layer devices
US6644117B1 (en) * 1999-10-08 2003-11-11 Hahn-Schickard-Gesellschaft Fuer Angewandte Forschung E.V. Electro-mechanical component and method for producing the same
US20050116328A1 (en) * 2003-12-02 2005-06-02 Kenichi Oi Substrate and method of manufacture thereof

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2687778B1 (en) * 1992-02-20 1994-05-20 Sextant Avionique CAPACITIVE MICRO-SENSOR WITH REDUCED PARASITIC CAPACITY AND MANUFACTURING METHOD.
JP4480939B2 (en) * 2001-03-14 2010-06-16 フラウンホファー ゲセルシャフトツール フェールデルンク ダー アンゲヴァンテン フォルシュンク エー．ファオ． Method for structuring a flat substrate made of a glass-based material
US7026223B2 (en) * 2002-03-28 2006-04-11 M/A-Com, Inc Hermetic electric component package
SG111972A1 (en) * 2002-10-17 2005-06-29 Agency Science Tech & Res Wafer-level package for micro-electro-mechanical systems
US7326629B2 (en) * 2004-09-10 2008-02-05 Agency For Science, Technology And Research Method of stacking thin substrates by transfer bonding

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6644117B1 (en) * 1999-10-08 2003-11-11 Hahn-Schickard-Gesellschaft Fuer Angewandte Forschung E.V. Electro-mechanical component and method for producing the same
US6593651B1 (en) * 2002-01-30 2003-07-15 Endevco Corporation Terminals for multi-layer devices
US20050116328A1 (en) * 2003-12-02 2005-06-02 Kenichi Oi Substrate and method of manufacture thereof

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of EP1999780A4 *

Also Published As

Publication number Publication date
EP1999780A2 (en) 2008-12-10
US7696083B2 (en) 2010-04-13
US20070212818A1 (en) 2007-09-13
EP1999780A4 (en) 2012-11-21
WO2007106363A2 (en) 2007-09-20

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