WO2007121114A3 - Transfer tape strap process - Google Patents

Transfer tape strap process Download PDF

Info

Publication number
WO2007121114A3
WO2007121114A3 PCT/US2007/066094 US2007066094W WO2007121114A3 WO 2007121114 A3 WO2007121114 A3 WO 2007121114A3 US 2007066094 W US2007066094 W US 2007066094W WO 2007121114 A3 WO2007121114 A3 WO 2007121114A3
Authority
WO
WIPO (PCT)
Prior art keywords
straps
web
capacitor
liner
transfer tape
Prior art date
Application number
PCT/US2007/066094
Other languages
French (fr)
Other versions
WO2007121114A2 (en
Inventor
Andre Cote
Detlef Duschek
Original Assignee
Checkpoint Systems Inc
Andre Cote
Detlef Duschek
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Checkpoint Systems Inc, Andre Cote, Detlef Duschek filed Critical Checkpoint Systems Inc
Priority to AU2007238242A priority Critical patent/AU2007238242B2/en
Priority to EP07760213A priority patent/EP2005370A2/en
Priority to JP2009505546A priority patent/JP4659904B2/en
Priority to MX2008013016A priority patent/MX2008013016A/en
Priority to CA002649039A priority patent/CA2649039A1/en
Priority to CN2007800213523A priority patent/CN101467163B/en
Publication of WO2007121114A2 publication Critical patent/WO2007121114A2/en
Publication of WO2007121114A3 publication Critical patent/WO2007121114A3/en

Links

Classifications

    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06KGRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06KGRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07718Constructional details, e.g. mounting of circuits in the carrier the record carrier being manufactured in a continuous process, e.g. using endless rolls
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06KGRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/0775Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna
    • GPHYSICS
    • G08SIGNALLING
    • G08BSIGNALLING OR CALLING SYSTEMS; ORDER TELEGRAPHS; ALARM SYSTEMS
    • G08B13/00Burglar, theft or intruder alarms
    • G08B13/22Electrical actuation
    • G08B13/24Electrical actuation by interference with electromagnetic field distribution
    • G08B13/2402Electronic Article Surveillance [EAS], i.e. systems using tags for detecting removal of a tagged item from a secure area, e.g. tags for detecting shoplifting
    • G08B13/2405Electronic Article Surveillance [EAS], i.e. systems using tags for detecting removal of a tagged item from a secure area, e.g. tags for detecting shoplifting characterised by the tag technology used
    • G08B13/2414Electronic Article Surveillance [EAS], i.e. systems using tags for detecting removal of a tagged item from a secure area, e.g. tags for detecting shoplifting characterised by the tag technology used using inductive tags
    • GPHYSICS
    • G08SIGNALLING
    • G08BSIGNALLING OR CALLING SYSTEMS; ORDER TELEGRAPHS; ALARM SYSTEMS
    • G08B13/00Burglar, theft or intruder alarms
    • G08B13/22Electrical actuation
    • G08B13/24Electrical actuation by interference with electromagnetic field distribution
    • G08B13/2402Electronic Article Surveillance [EAS], i.e. systems using tags for detecting removal of a tagged item from a secure area, e.g. tags for detecting shoplifting
    • G08B13/2405Electronic Article Surveillance [EAS], i.e. systems using tags for detecting removal of a tagged item from a secure area, e.g. tags for detecting shoplifting characterised by the tag technology used
    • G08B13/2414Electronic Article Surveillance [EAS], i.e. systems using tags for detecting removal of a tagged item from a secure area, e.g. tags for detecting shoplifting characterised by the tag technology used using inductive tags
    • G08B13/2417Electronic Article Surveillance [EAS], i.e. systems using tags for detecting removal of a tagged item from a secure area, e.g. tags for detecting shoplifting characterised by the tag technology used using inductive tags having a radio frequency identification chip
    • GPHYSICS
    • G08SIGNALLING
    • G08BSIGNALLING OR CALLING SYSTEMS; ORDER TELEGRAPHS; ALARM SYSTEMS
    • G08B13/00Burglar, theft or intruder alarms
    • G08B13/22Electrical actuation
    • G08B13/24Electrical actuation by interference with electromagnetic field distribution
    • G08B13/2402Electronic Article Surveillance [EAS], i.e. systems using tags for detecting removal of a tagged item from a secure area, e.g. tags for detecting shoplifting
    • G08B13/2428Tag details
    • G08B13/2437Tag layered structure, processes for making layered tags
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    • H01L2221/683Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68345Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used as a support during the manufacture of self supporting substrates
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    • H01L2223/00Details relating to semiconductor or other solid state devices covered by the group H01L23/00
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    • H01L2223/66High-frequency adaptations
    • H01L2223/6661High-frequency adaptations for passive devices
    • H01L2223/6677High-frequency adaptations for passive devices for antenna, e.g. antenna included within housing of semiconductor device
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    • H01L2224/10Bump connectors; Manufacturing methods related thereto
    • H01L2224/15Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161Disposition
    • H01L2224/16151Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
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    • H01L2224/83Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/838Bonding techniques
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    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/49002Electrical device making
    • Y10T29/49117Conductor or circuit manufacturing
    • Y10T29/49124On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913Assembling to base an electrical component, e.g., capacitor, etc.

Abstract

A method for efficiently producing a plurality of EAS or RFID tags or inlays that form a label ready for use. The process utilizes a first web of RFID chip straps (20) or capacitor straps that are releasably secured to a liner (26) using only a low tack adhesive (28) and utilizes a second web of coils or antennas which are secured to a second liner. After indexing these two webs, selective heat and pressure are applied to the chips straps or to the capacitor straps to transfer them and electrically couple them to a corresponding coil or antenna. Where both chip straps and capacitor straps are applied to a common antenna, a third web of the additional strap is used in the process.
PCT/US2007/066094 2006-04-10 2007-04-05 Transfer tape strap process WO2007121114A2 (en)

Priority Applications (6)

Application Number Priority Date Filing Date Title
AU2007238242A AU2007238242B2 (en) 2006-04-10 2007-04-05 Transfer tape strap process
EP07760213A EP2005370A2 (en) 2006-04-10 2007-04-05 Transfer tape strap process
JP2009505546A JP4659904B2 (en) 2006-04-10 2007-04-05 Transfer tape mounting method
MX2008013016A MX2008013016A (en) 2006-04-10 2007-04-05 Transfer tape strap process.
CA002649039A CA2649039A1 (en) 2006-04-10 2007-04-05 Transfer tape strap process
CN2007800213523A CN101467163B (en) 2006-04-10 2007-04-05 Transfer tape strap process

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US11/400,932 US7646304B2 (en) 2006-04-10 2006-04-10 Transfer tape strap process
US11/400,932 2006-04-10

Publications (2)

Publication Number Publication Date
WO2007121114A2 WO2007121114A2 (en) 2007-10-25
WO2007121114A3 true WO2007121114A3 (en) 2007-12-13

Family

ID=38474277

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2007/066094 WO2007121114A2 (en) 2006-04-10 2007-04-05 Transfer tape strap process

Country Status (9)

Country Link
US (2) US7646304B2 (en)
EP (1) EP2005370A2 (en)
JP (1) JP4659904B2 (en)
CN (1) CN101467163B (en)
AU (1) AU2007238242B2 (en)
CA (1) CA2649039A1 (en)
MX (1) MX2008013016A (en)
TW (1) TW200818561A (en)
WO (1) WO2007121114A2 (en)

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US8026818B2 (en) * 2006-12-20 2011-09-27 Checkpoint Systems, Inc. EAS and UHF combination tag
WO2010017573A1 (en) 2008-08-11 2010-02-18 Tasmanian Alkaloids Pty Limited PROCESS FOR MAKING MORPHINAN-6α-OLS
US8128000B2 (en) * 2009-09-25 2012-03-06 Avery Dennison Corporation Method, system and apparatus for manufacturing a radio frequency identification device
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US8701271B2 (en) 2010-04-14 2014-04-22 Avery Dennison Corporation Method of assembly of articles
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US9299021B2 (en) * 2010-11-11 2016-03-29 Avery Dennison Corporation RFID devices and methods for manufacturing
US20130092739A1 (en) * 2011-10-13 2013-04-18 Supreme Technic Package Co., Ltd. Simple multifuncational identification labels and their manufacturing method
US10311351B1 (en) * 2012-04-11 2019-06-04 Impinj, Inc. RFID integrated circuits with antenna contacts on multiple surfaces
US20160148086A1 (en) * 2013-06-19 2016-05-26 Ross Robert Clarke Radio Frequency Identification Tag
KR102603422B1 (en) 2014-09-29 2023-11-17 애버리 데니슨 코포레이션 Tire tracking rfid label
KR101892689B1 (en) 2014-10-14 2018-08-28 삼성전기주식회사 Chip electronic component and board having the same mounted thereon
US10049319B2 (en) 2014-12-16 2018-08-14 Avery Dennison Retail Information Services, Llc Method of assembly using moving substrates, including creating RFID inlays
US10198677B2 (en) * 2016-05-26 2019-02-05 Avery Dennison Retail Information Services, Llc RFID tag for printed fabric label and method of making
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