WO2007122516A3 - Apparatus and method for use in mounting electronic elements - Google Patents

Apparatus and method for use in mounting electronic elements Download PDF

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Publication number
WO2007122516A3
WO2007122516A3 PCT/IB2007/002411 IB2007002411W WO2007122516A3 WO 2007122516 A3 WO2007122516 A3 WO 2007122516A3 IB 2007002411 W IB2007002411 W IB 2007002411W WO 2007122516 A3 WO2007122516 A3 WO 2007122516A3
Authority
WO
WIPO (PCT)
Prior art keywords
casing
electrode
chip carrier
carrier part
outside
Prior art date
Application number
PCT/IB2007/002411
Other languages
French (fr)
Other versions
WO2007122516A2 (en
Inventor
Jian Hui Xie
Siu Cheong Cheng
Original Assignee
Cotco Luminant Device Ltd
Jian Hui Xie
Siu Cheong Cheng
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=38625380&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=WO2007122516(A3) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Cotco Luminant Device Ltd, Jian Hui Xie, Siu Cheong Cheng filed Critical Cotco Luminant Device Ltd
Priority to JP2009507195A priority Critical patent/JP2010501998A/en
Priority to CN200780015100XA priority patent/CN101432875B/en
Priority to EP07789665.2A priority patent/EP2011149B1/en
Publication of WO2007122516A2 publication Critical patent/WO2007122516A2/en
Publication of WO2007122516A3 publication Critical patent/WO2007122516A3/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/64—Heat extraction or cooling elements
    • H01L33/647—Heat extraction or cooling elements the elements conducting electric current to or from the semiconductor body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/483—Containers
    • H01L33/486—Containers adapted for surface mounting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/64—Heat extraction or cooling elements
    • H01L33/642—Heat extraction or cooling elements characterized by the shape

Abstract

Surface mount devices (100,500) are provided, which include a first electrode (110,510) comprising a chip carrier part (120,505), a second electrode (115,515) disposed proximate to the chip carrier part, and a casing (105,505) encasing a portion of the first and second electrodes. The first electrode (110,510) can extend from the chip carrier part toward a perimeter of the casing, and the second electrode (115,515) can extend away from the chip carrier part (120,520) and projects outside of the casing (105,505). In extending away from the chip carrier part the first electrode (110,510) divides into a plurality of leads(320,325,720,725,726) separated by an aperture (345) that join into a single first joined lead portion (330) with a First width before projecting outside the casing and maintains the first width outside of the casing. The second electrode (115,515) can attain a second width prior to projecting outside of the casing and maintains the second width outside the casing.
PCT/IB2007/002411 2006-04-26 2007-04-25 Apparatus and method for use in mounting electronic elements WO2007122516A2 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2009507195A JP2010501998A (en) 2006-04-26 2007-04-25 Apparatus and method used for mounting electronic devices
CN200780015100XA CN101432875B (en) 2006-04-26 2007-04-25 Apparatus and method for mounting electronic elements
EP07789665.2A EP2011149B1 (en) 2006-04-26 2007-04-25 Surface mount device

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US11/380,402 2006-04-26
US11/380,402 US7635915B2 (en) 2006-04-26 2006-04-26 Apparatus and method for use in mounting electronic elements

Publications (2)

Publication Number Publication Date
WO2007122516A2 WO2007122516A2 (en) 2007-11-01
WO2007122516A3 true WO2007122516A3 (en) 2008-04-03

Family

ID=38625380

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/IB2007/002411 WO2007122516A2 (en) 2006-04-26 2007-04-25 Apparatus and method for use in mounting electronic elements

Country Status (5)

Country Link
US (2) US7635915B2 (en)
EP (1) EP2011149B1 (en)
JP (1) JP2010501998A (en)
CN (2) CN101432875B (en)
WO (1) WO2007122516A2 (en)

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EP2011149A4 (en) 2011-12-07
US7635915B2 (en) 2009-12-22
EP2011149A2 (en) 2009-01-07
US20070252250A1 (en) 2007-11-01
US8362605B2 (en) 2013-01-29
JP2010501998A (en) 2010-01-21
CN101834265A (en) 2010-09-15

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