WO2007146581A3 - Method of expanding tester drive and measurement capability - Google Patents
Method of expanding tester drive and measurement capability Download PDFInfo
- Publication number
- WO2007146581A3 WO2007146581A3 PCT/US2007/069798 US2007069798W WO2007146581A3 WO 2007146581 A3 WO2007146581 A3 WO 2007146581A3 US 2007069798 W US2007069798 W US 2007069798W WO 2007146581 A3 WO2007146581 A3 WO 2007146581A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- measurement capability
- tester drive
- expanding
- expanding tester
- drive
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
- G01R31/2889—Interfaces, e.g. between probe and tester
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/26—Testing of individual semiconductor devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/07342—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being at an angle other than perpendicular to test object, e.g. probe card
Abstract
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP07797793A EP2041587A4 (en) | 2006-06-06 | 2007-05-25 | Method of expanding tester drive and measurement capability |
KR1020097000193A KR101374986B1 (en) | 2006-06-06 | 2007-05-25 | Method of expanding tester drive and measurement capability |
JP2009514467A JP6067202B2 (en) | 2006-06-06 | 2007-05-25 | Probe card assembly |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11/422,573 US7557592B2 (en) | 2006-06-06 | 2006-06-06 | Method of expanding tester drive and measurement capability |
US11/422,573 | 2006-06-06 |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2007146581A2 WO2007146581A2 (en) | 2007-12-21 |
WO2007146581A3 true WO2007146581A3 (en) | 2009-01-29 |
Family
ID=38832621
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US2007/069798 WO2007146581A2 (en) | 2006-06-06 | 2007-05-25 | Method of expanding tester drive and measurement capability |
Country Status (7)
Country | Link |
---|---|
US (2) | US7557592B2 (en) |
EP (1) | EP2041587A4 (en) |
JP (2) | JP6067202B2 (en) |
KR (1) | KR101374986B1 (en) |
CN (1) | CN101501511A (en) |
TW (1) | TWI429914B (en) |
WO (1) | WO2007146581A2 (en) |
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US6525555B1 (en) * | 1993-11-16 | 2003-02-25 | Formfactor, Inc. | Wafer-level burn-in and test |
US7609080B2 (en) * | 2005-03-22 | 2009-10-27 | Formfactor, Inc. | Voltage fault detection and protection |
WO2006116767A1 (en) | 2005-04-27 | 2006-11-02 | Aehr Test Systems | Apparatus for testing electronic devices |
DE102005037236A1 (en) * | 2005-08-08 | 2007-02-15 | Robert Bosch Gmbh | Device and method for configuring a semiconductor circuit |
US7557592B2 (en) * | 2006-06-06 | 2009-07-07 | Formfactor, Inc. | Method of expanding tester drive and measurement capability |
US7649366B2 (en) | 2006-09-01 | 2010-01-19 | Formfactor, Inc. | Method and apparatus for switching tester resources |
US7852094B2 (en) * | 2006-12-06 | 2010-12-14 | Formfactor, Inc. | Sharing resources in a system for testing semiconductor devices |
US7667475B2 (en) * | 2007-04-05 | 2010-02-23 | Aehr Test Systems | Electronics tester with a signal distribution board and a wafer chuck having different coefficients of thermal expansion |
US7800382B2 (en) | 2007-12-19 | 2010-09-21 | AEHR Test Ststems | System for testing an integrated circuit of a device and its method of use |
WO2009144828A1 (en) * | 2008-05-30 | 2009-12-03 | 株式会社アドバンテスト | Wafer unit for testing and testing system |
KR101493871B1 (en) * | 2008-11-11 | 2015-02-17 | 삼성전자주식회사 | Interface structure for wafer test equipments |
US8030957B2 (en) | 2009-03-25 | 2011-10-04 | Aehr Test Systems | System for testing an integrated circuit of a device and its method of use |
KR101630481B1 (en) * | 2009-04-09 | 2016-06-14 | 테라다인 인코퍼레이티드 | Automated test equipment employing test signal transmission channel with embedded series isolation resistors |
US8269505B2 (en) * | 2009-12-15 | 2012-09-18 | International Business Machines Corporation | Locating short circuits in printed circuit boards |
WO2012002935A1 (en) * | 2010-06-29 | 2012-01-05 | Teradyne, Inc. | Calibrating a channel of a test system |
TW201219807A (en) * | 2010-11-15 | 2012-05-16 | Askey Computer Corp | Testing auxiliary apparatus |
CN102591624B (en) * | 2011-01-06 | 2015-06-03 | 上海华虹宏力半导体制造有限公司 | Method for surpassing arrangement mode of probe station |
JP5542720B2 (en) * | 2011-03-04 | 2014-07-09 | 新光電気工業株式会社 | Transmission apparatus, S-parameter measurement method, and gain adjustment method |
DE202012002391U1 (en) * | 2012-03-08 | 2013-06-10 | Rosenberger Hochfrequenztechnik Gmbh & Co. Kg | Device for measuring electronic components |
NL2009490C2 (en) * | 2012-09-19 | 2014-03-20 | Prodrive B V | Testing device for printed circuit boards. |
US9316685B2 (en) * | 2012-11-12 | 2016-04-19 | Mpi Corporation | Probe card of low power loss |
CN103808992B (en) * | 2012-11-12 | 2017-09-12 | 旺矽科技股份有限公司 | Probe card structure with low power consumption |
KR101726965B1 (en) * | 2012-12-17 | 2017-04-13 | 주식회사 아도반테스토 | Rf probe |
US20140327462A1 (en) * | 2013-05-03 | 2014-11-06 | Avago Technologies General Ip (Singapore) Pte. Ltd. | Test socket providing mechanical stabilization for pogo pin connections |
CN104280651B (en) * | 2013-07-10 | 2018-08-17 | 晶豪科技股份有限公司 | Test system and semiconductor element |
CN104808029A (en) | 2014-01-24 | 2015-07-29 | 矽创电子股份有限公司 | Active probe device |
US10451652B2 (en) * | 2014-07-16 | 2019-10-22 | Teradyne, Inc. | Coaxial structure for transmission of signals in test equipment |
JP2016191563A (en) * | 2015-03-30 | 2016-11-10 | 株式会社東芝 | Probe card and test device including the same |
KR102442100B1 (en) * | 2015-03-31 | 2022-09-08 | 테크노프로브 에스.피.에이. | Probe card for test equipment of electronic devices with improved filtering characteristics |
US10101367B2 (en) * | 2015-04-10 | 2018-10-16 | Intel Corporation | Microelectronic test device including a probe card having an interposer |
TWI580969B (en) * | 2015-04-14 | 2017-05-01 | Mpi Corp | Probe card |
DE102016114145A1 (en) * | 2016-08-01 | 2018-02-01 | Endress+Hauser Flowtec Ag | Test system for checking electrical connections of electronic components to a printed circuit board |
JP6782134B2 (en) * | 2016-09-26 | 2020-11-11 | ラピスセミコンダクタ株式会社 | Scan circuits, collective scan circuits, semiconductor devices, and semiconductor device inspection methods |
TWI623761B (en) * | 2016-10-20 | 2018-05-11 | 旺矽科技股份有限公司 | Chip probing apparatus and chip probing method |
TWI634334B (en) * | 2016-10-21 | 2018-09-01 | 新特系統股份有限公司 | Probe card module |
CN106405441B (en) * | 2016-11-13 | 2023-08-04 | 深圳市迅特通信技术股份有限公司 | Aging test device of optical module |
TWI636260B (en) * | 2017-01-06 | 2018-09-21 | 新特系統股份有限公司 | Probe card module |
WO2018160557A1 (en) | 2017-03-03 | 2018-09-07 | Aehr Test Systems | Electronics tester |
KR102148840B1 (en) * | 2018-11-27 | 2020-08-28 | 주식회사 에스디에이 | Probe card |
US11327095B2 (en) * | 2019-08-19 | 2022-05-10 | Samsung Electronics Co., Ltd. | Probe cards, system for manufacturing semiconductor device, and method of manufacturing semiconductor device |
US11835575B2 (en) | 2020-10-07 | 2023-12-05 | Aehr Test Systems | Electronics tester |
US11940478B2 (en) | 2020-12-07 | 2024-03-26 | Duke University | Electronic device characterization systems and methods |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
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US6518779B1 (en) * | 1997-10-20 | 2003-02-11 | Matsushita Electrical Industrial Do., Ltd. | Probe card |
US6798225B2 (en) * | 2002-05-08 | 2004-09-28 | Formfactor, Inc. | Tester channel to multiple IC terminals |
US20060028225A1 (en) * | 2004-07-22 | 2006-02-09 | Infineon Technologies Ag | Process and a device for the calibration of a semiconductor component test system |
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US4780670A (en) * | 1985-03-04 | 1988-10-25 | Xerox Corporation | Active probe card for high resolution/low noise wafer level testing |
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JP2951166B2 (en) * | 1992-09-01 | 1999-09-20 | 松下電器産業株式会社 | Semiconductor test equipment, semiconductor test circuit chip and probe card |
KR970010656B1 (en) * | 1992-09-01 | 1997-06-30 | 마쯔시다 덴기 산교 가부시끼가이샤 | Semiconductor test device, semiconductor test circuit chip and probe card |
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-
2006
- 2006-06-06 US US11/422,573 patent/US7557592B2/en not_active Expired - Fee Related
-
2007
- 2007-05-25 JP JP2009514467A patent/JP6067202B2/en not_active Expired - Fee Related
- 2007-05-25 KR KR1020097000193A patent/KR101374986B1/en not_active IP Right Cessation
- 2007-05-25 EP EP07797793A patent/EP2041587A4/en not_active Withdrawn
- 2007-05-25 CN CNA2007800211284A patent/CN101501511A/en active Pending
- 2007-05-25 TW TW096118747A patent/TWI429914B/en not_active IP Right Cessation
- 2007-05-25 WO PCT/US2007/069798 patent/WO2007146581A2/en active Application Filing
-
2009
- 2009-07-07 US US12/498,862 patent/US8067951B2/en not_active Expired - Fee Related
-
2016
- 2016-10-25 JP JP2016208980A patent/JP6496292B2/en not_active Expired - Fee Related
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6518779B1 (en) * | 1997-10-20 | 2003-02-11 | Matsushita Electrical Industrial Do., Ltd. | Probe card |
US6798225B2 (en) * | 2002-05-08 | 2004-09-28 | Formfactor, Inc. | Tester channel to multiple IC terminals |
US20060028225A1 (en) * | 2004-07-22 | 2006-02-09 | Infineon Technologies Ag | Process and a device for the calibration of a semiconductor component test system |
Non-Patent Citations (1)
Title |
---|
See also references of EP2041587A4 * |
Also Published As
Publication number | Publication date |
---|---|
US20090267627A1 (en) | 2009-10-29 |
EP2041587A2 (en) | 2009-04-01 |
JP2017053863A (en) | 2017-03-16 |
CN101501511A (en) | 2009-08-05 |
US7557592B2 (en) | 2009-07-07 |
TWI429914B (en) | 2014-03-11 |
JP6496292B2 (en) | 2019-04-03 |
KR101374986B1 (en) | 2014-03-18 |
WO2007146581A2 (en) | 2007-12-21 |
JP2009540297A (en) | 2009-11-19 |
TW200804830A (en) | 2008-01-16 |
US20070296422A1 (en) | 2007-12-27 |
JP6067202B2 (en) | 2017-01-25 |
US8067951B2 (en) | 2011-11-29 |
KR20090018714A (en) | 2009-02-20 |
EP2041587A4 (en) | 2010-06-16 |
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