WO2008007223A3 - Product designed to be used with handling system - Google Patents

Product designed to be used with handling system Download PDF

Info

Publication number
WO2008007223A3
WO2008007223A3 PCT/IB2007/002907 IB2007002907W WO2008007223A3 WO 2008007223 A3 WO2008007223 A3 WO 2008007223A3 IB 2007002907 W IB2007002907 W IB 2007002907W WO 2008007223 A3 WO2008007223 A3 WO 2008007223A3
Authority
WO
WIPO (PCT)
Prior art keywords
gripping means
product
plateau
plate
handling system
Prior art date
Application number
PCT/IB2007/002907
Other languages
French (fr)
Other versions
WO2008007223A2 (en
Inventor
Jean Michel Processe
Florent Haddad
Alain Gaudon
Original Assignee
Recif Technologies
Jean Michel Processe
Florent Haddad
Alain Gaudon
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Recif Technologies, Jean Michel Processe, Florent Haddad, Alain Gaudon filed Critical Recif Technologies
Publication of WO2008007223A2 publication Critical patent/WO2008007223A2/en
Publication of WO2008007223A3 publication Critical patent/WO2008007223A3/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
    • B28D5/0088—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work the supporting or holding device being angularly adjustable

Abstract

A product (Pr) can be used in the semiconductor, MEM, flat screen and/or solar cell industries, where the product is capable of being gripped by a handling system (Bm). The product can include: a plate (1) made of silicon, quartz, silicon carbide, silicon nitride, arsenic, and/or gallium arsenide, comprising one first (2) and one second (3) opposite faces, a plateau (4) defined by at least one face (5) opposite the plate, an attachment means (7) of the plate (1) on the plateau (4) so that the at least one face (5) of the plateau (4) is opposite the first (2) or second (3) face of the plate, and a first gripping means (11) mounted in association with the plateau (4), where these said first gripping means is able to cooperate and is removable with second gripping means (12) in addition to the first gripping means (11), the second additional gripping means belonging to the handling system. Another embodiment of the invention is directed to a system for handling the product.
PCT/IB2007/002907 2006-06-27 2007-06-27 Product designed to be used with handling system WO2008007223A2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US11/426,800 US20070297885A1 (en) 2006-06-27 2006-06-27 Product designed to be used with handling system
US11/426,800 2006-06-27

Publications (2)

Publication Number Publication Date
WO2008007223A2 WO2008007223A2 (en) 2008-01-17
WO2008007223A3 true WO2008007223A3 (en) 2008-05-02

Family

ID=38873724

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/IB2007/002907 WO2008007223A2 (en) 2006-06-27 2007-06-27 Product designed to be used with handling system

Country Status (2)

Country Link
US (1) US20070297885A1 (en)
WO (1) WO2008007223A2 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102540125B1 (en) * 2017-08-30 2023-06-05 주성엔지니어링(주) Substrate safe arrival device and apparatus for substrate processing apparatus

Citations (14)

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Publication number Priority date Publication date Assignee Title
US4788994A (en) * 1986-08-13 1988-12-06 Dainippon Screen Mfg. Co. Wafer holding mechanism
US5093550A (en) * 1989-06-15 1992-03-03 Wacker-Chemitronic Gesellschaft Fur Elektronic-Grundstoffe Mbh Holding device and method for treating wafer-like objects, and a method of treating them
US5224581A (en) * 1989-12-14 1993-07-06 Applied Materials, Inc. Magnetic semiconductor wafers with handling apparatus and method
US5376216A (en) * 1993-03-31 1994-12-27 Dainippon Screen Mfg. Co., Ltd. Device for holding and rotating a substrate
US5775000A (en) * 1996-05-13 1998-07-07 Ebara Corporation Substrate gripper device for spin drying
EP0884766A2 (en) * 1997-06-12 1998-12-16 Lintec Corporation Method of die bonding electronic component and die bonding apparatus therefor
US5989342A (en) * 1996-01-30 1999-11-23 Dainippon Screen Mfg, Co., Ltd. Apparatus for substrate holding
US6126380A (en) * 1997-08-04 2000-10-03 Creative Design Corporation Robot having a centering and flat finding means
US6167893B1 (en) * 1999-02-09 2001-01-02 Novellus Systems, Inc. Dynamic chuck for semiconductor wafer or other substrate
US6217034B1 (en) * 1998-09-24 2001-04-17 Kla-Tencor Corporation Edge handling wafer chuck
US20040041148A1 (en) * 2002-09-03 2004-03-04 Beniamin Shulman Wafer monitoring system
US6827092B1 (en) * 2000-12-22 2004-12-07 Lam Research Corporation Wafer backside plate for use in a spin, rinse, and dry module and methods for making and implementing the same
EP1484791A1 (en) * 2002-03-04 2004-12-08 Tokyo Electron Limited Dicing method, method of inspecting integrated circuit element, substrate holding device, and pressure sensitive adhesive film
US20050031497A1 (en) * 2003-08-07 2005-02-10 Sonke Siebert Holding device for disk-shaped objects

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4567584A (en) * 1983-06-13 1986-01-28 Kabushiki Kaisha Toshiba Autochanger type disc player
US4627787A (en) * 1984-03-22 1986-12-09 Thomson Components-Mostek Corporation Chip selection in automatic assembly of integrated circuit
FR2606311B2 (en) * 1985-12-10 1989-11-17 Recif Sa AUTOMATIC CLOSING DEVICE FOR A VACUUM GRIPPING PIPETTE
FR2591324B1 (en) * 1985-12-10 1989-02-17 Recif Sa APPARATUS FOR UNITARY DRYING OF SILICON WAFERS BY CENTRIFUGATION
FR2591138B1 (en) * 1985-12-10 1988-04-08 Recif Sa PROCESS FOR MANUFACTURING MOUTHPIECES FOR VACUUM PIPETTES IN PARTICULAR AND THE MOUTHPIECES OBTAINED BY IMPLEMENTING THE PROCESS.
FR2624778B1 (en) * 1987-12-22 1994-09-23 Recif Sa NOZZLE FOR VACUUM PIPETTE
US5280979A (en) * 1991-06-20 1994-01-25 Recif, S.A. Tip for a vacuum pipette with improved electrostatic discharge properties
FR2751769B1 (en) * 1996-07-29 1998-10-09 Recif Sa METHOD AND APPARATUS FOR IDENTIFYING CHARACTERS FORMED ON A PLURALITY OF SILICON WAFERS
FR2778496B1 (en) * 1998-05-05 2002-04-19 Recif Sa METHOD AND DEVICE FOR CHANGING THE POSITION OF A SEMICONDUCTOR PLATE
US6205745B1 (en) * 1998-05-27 2001-03-27 Lucent Technologies Inc. High speed flip-chip dispensing
US6420864B1 (en) * 2000-04-13 2002-07-16 Nanophotonics Ag Modular substrate measurement system
DE60112563T2 (en) * 2000-04-13 2006-06-01 Nanophotonics Ag MODULAR MEASURING SYSTEM FOR SUBSTRATES
FR2835337B1 (en) * 2002-01-29 2004-08-20 Recif Sa METHOD AND DEVICE FOR IDENTIFYING CHARACTERS REGISTERED ON A SEMICONDUCTOR PLATE HAVING AT LEAST ONE GUIDANCE MARK
AU2003215146A1 (en) * 2002-02-08 2003-09-02 The Cleveland Clinic Foundation Snares and methods of controlling cytokinesis
FR2844258B1 (en) * 2002-09-06 2005-06-03 Recif Sa SYSTEM FOR TRANSPORTING AND STORING SEMICONDUCTOR PLATE CONTAINERS, AND TRANSFER MECHANISM
US6880560B2 (en) * 2002-11-18 2005-04-19 Techsonic Substrate processing apparatus for processing substrates using dense phase gas and sonic waves
AU2003296827A1 (en) * 2002-12-13 2004-07-09 Recif Device for gripping a semiconductor plate through a transfer opening, using the closure of the opening

Patent Citations (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4788994A (en) * 1986-08-13 1988-12-06 Dainippon Screen Mfg. Co. Wafer holding mechanism
US5093550A (en) * 1989-06-15 1992-03-03 Wacker-Chemitronic Gesellschaft Fur Elektronic-Grundstoffe Mbh Holding device and method for treating wafer-like objects, and a method of treating them
US5224581A (en) * 1989-12-14 1993-07-06 Applied Materials, Inc. Magnetic semiconductor wafers with handling apparatus and method
US5376216A (en) * 1993-03-31 1994-12-27 Dainippon Screen Mfg. Co., Ltd. Device for holding and rotating a substrate
US5989342A (en) * 1996-01-30 1999-11-23 Dainippon Screen Mfg, Co., Ltd. Apparatus for substrate holding
US5775000A (en) * 1996-05-13 1998-07-07 Ebara Corporation Substrate gripper device for spin drying
EP0884766A2 (en) * 1997-06-12 1998-12-16 Lintec Corporation Method of die bonding electronic component and die bonding apparatus therefor
US6126380A (en) * 1997-08-04 2000-10-03 Creative Design Corporation Robot having a centering and flat finding means
US6217034B1 (en) * 1998-09-24 2001-04-17 Kla-Tencor Corporation Edge handling wafer chuck
US6167893B1 (en) * 1999-02-09 2001-01-02 Novellus Systems, Inc. Dynamic chuck for semiconductor wafer or other substrate
US6827092B1 (en) * 2000-12-22 2004-12-07 Lam Research Corporation Wafer backside plate for use in a spin, rinse, and dry module and methods for making and implementing the same
EP1484791A1 (en) * 2002-03-04 2004-12-08 Tokyo Electron Limited Dicing method, method of inspecting integrated circuit element, substrate holding device, and pressure sensitive adhesive film
US20040041148A1 (en) * 2002-09-03 2004-03-04 Beniamin Shulman Wafer monitoring system
US20050031497A1 (en) * 2003-08-07 2005-02-10 Sonke Siebert Holding device for disk-shaped objects

Also Published As

Publication number Publication date
WO2008007223A2 (en) 2008-01-17
US20070297885A1 (en) 2007-12-27

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