WO2008007908A1

WO2008007908A1 - Functional polymer materials and method of manufacturing the same

Info

Publication number: WO2008007908A1
Application number: PCT/KR2007/003382
Authority: WO
Inventors: Sang Kyoo Lim; Sung-Ho Hwang; Soo-Keun Lee; Ho Young Kim
Original assignee: Daegu Gyeongbuk Institute Of Science And Technology
Priority date: 2006-07-14
Filing date: 2007-07-12
Publication date: 2008-01-17
Also published as: KR100727086B1

Abstract

A method of manufacturing a functional polymer material, the method including: preparing a polymer resin composition containing a semiconductor metal oxide by mixing and kneading the semiconductor metal oxide and a polymer resin; forming a polymer material of a predetermined shape by shaping the polymer resin composition; and carrying a metal nanoparticle on a metal oxide particle, dispersed on a surface of the polymer material, by photo-depositing the metal nanoparticle on the polymer material. Metal nanoparticles such as silver (Ag), platinum (Pt), gold (Au), copper (Cu), and zinc (Zn) are carried on a surface of the polymer material.

Description

FUNCTIONAL POLYMER MATERIALS AND METHOD OF MANUFACTURING THE SAME

Technical Field The present invention relates to a functional polymer material and a method of manufacturing the same, and more particularly, to a functional polymer material and a method of manufacturing the same which is applicable to an ultraviolet-blocking, electromagnetic shielding, deodorizing, and antibiotic product.

Background Art

In a conventional art, functional polymer material manufacturing technologies, particularly, functional fiber manufacturing technologies are as follows.

In Korean Patent Publication No. 10-2004-0098808, a polypropylene multi filament yarn and method of manufacturing the same is disclosed. In the publication, a composition is made by adding a mixed powder such as a titanium dioxide powder, tourmaline powder, sericite powder, silver powder, silica, calcium oxide, zinc oxide, zirconium, and the like, to a polypropylene resin. A master batch is made by mixing the composition and the polypropylene resin at a weight ratio of 3 : 2. The master batch is mixed with the polypropylene resin at a weight ratio of 5 : 5 again. Water and moisture of the mixture is removed by thermal-processing the mixture at a temperature between 120 ⁰C and 140 ⁰C for about one hour, and then melt spinning is performed at a temperature between 220 ⁰C and 240 ⁰C. Accordingly, the polypropylene multi filament yarn has antibacterial, purification, anticorrosion, UV-protection, far-infrared- protection, and electromagnetic shielding functions. Also, in Korean Patent Publication No. 10-2005-0106396, a fiber reforming method is disclosed. In the publication, a crosslink agent or waterborne resin emulsion is added to an alkaline aqueous solution. The alkaline aqueous solution is obtained by dissolving cellulous ether which has a low degree of mole substitution of between 0.05 and 1.3 by an alkyl group and hydroxy alkyl group. The solution is adhered to a fiber, and the attached solution is neutralized by acid, solidified, and thermal-processed. According to the publication, a fiber may be reformed without a toxic solvent such as carbon disulfide, and thus safety is improved. Also, a melting process is simplified, lint is prevented, and tensile strength, abrasion resistance, and absorbency are improved. Lastly, in Korean Patent Publication No. 10-2001-0012855, refined wool is immersed into a solution which dissolves acetic anhydride (10 weight %) in dimethylformamide (DMF) (90 weight %). A negative ion chemical ionization is performed by increasing a temperature up to 50 ⁰C and maintaining the increased temperature, and the wool is washed. Also, at least one titan compound of titanalkoxide and titanfluoride is dissolved at a rate of 2.0 % owf. The negative ion chemical ionization processed wool is dipped into such a water solution, and processed at room temperature for about 30 minutes. Then, a mixture of boric acid, citric acid, and D, L-malic acid is added to the water solution at a rate of 0.5 % owf, processed at 50 ⁰C for about 30 minutes, and washed by water. In this instance, the boric acid, citric acid, and D, L-malic acid are mixed at a weight rate of 0.5 : 1 : 1. Accordingly, a natural fiber which is plated with titanium dioxide and has a specific function is manufactured.

In Korean Patent Unexamined Publication No. 10-2004-0098808, the mixed powder such as titanium dioxide powder, tourmaline powder, silver powder, silica, zirconium, and the like, is required to be mixed with the polypropylene resin in order to manufacture a fiber which has antibacterial, purification, anticorrosion, ultraviolet blocking, and electromagnetic shielding functions. In Korean Patent Unexamined Publication No. 10-2005-0106396, a function may not be maintained, since the crosslink agent or waterborne resin emulsion is added to an alkaline aqueous solution which is obtained by dissolving cellulous ether having a low degree of substitution of between 0.05 and 1.3 due to the alkyl group and hydroxy alkyl group.

Disclosure of Invention Technical Goals

The present invention provides a functional polymer material and a method of manufacturing the same which may stably manufacture the functional polymer material. The present invention also provides a functional polymer material and a method of manufacturing the same which may be applied to an ultraviolet-blocking, electromagnetic shielding, deodorizing, and antibiotic product.

Technical solutions According to an aspect of the present invention, there is provided a method of manufacturing a functional polymer material, the method including: preparing a polymer resin composition containing a semiconductor metal oxide by mixing and kneading the semiconductor metal oxide and a polymer resin; forming a polymer material of a predetermined shape by shaping the polymer resin composition; and carrying a metal nanoparticle on a metal oxide particle, dispersed on a surface of the polymer material, by photo-depositing the metal nanoparticle on the polymer material.

As the polymer resin, polyester, polypropylene, polyethylene, polyamid, polypropylene terephthalate, polybutylene terephthalate, polyacrylonitrile, polyvinyl alcohol, polyactic acid, polyethylene oxide, polyethylene vinyl alcohol copolymer, cellulose acetate, polymethacrylate, a polyester-based copolymer, polyvinyl acetate, polyvinylcarbazole, collagen, polyaniline, polystyrene, polyurethane, polycarbonate, nylon, polyethylene-vinylacetate copolymer, synthetic rubber, natural rubber, and the like may be used. As the semiconductor metal oxide, a tin oxide (SnO₂), a zinc oxide (ZnO), a titanium dioxide (TiO₂), an iron oxide (Fe₂O₃), an indium oxide (In₂O₃), an antimony trioxide (Sb₂O₃), a tungsten trioxide (WO₃), an indium tin oxide (In₂O₃: SnO₂), an antimony tin oxide (Sb₂O₃:SnO₂), a barium titanate (BaTiO₃), a cerium oxide (CeO₂), and the like may be used. The semiconductor metal oxide and the polymer resin may be mixed in a range of about 0.1 to about 40 parts by weight with respect to 100 parts by weight of the polymer resin.

The shaping may be performed using an injection machine, melting spinning machine, or electro spinning machine. The photo-depositing is performed by immersing the polymer material in a metal precursor solution and then irradiating the immersed polymer material with ultraviolet rays. The metal precursor solution has a salt-typed metal precursor.

The metal precursor solution may include a metal salt solution including at least one selected from the group consisting of silver (Ag), platinum (Pt), gold (Au), copper (Cu), and zinc (Zn).

According to another aspect of the present invention, there is provided a functional polymer material, including: a polymer material including a semiconductor metal oxide, wherein at least one metal nanoparticle selected from the group consisting of silver (Ag), platinum (Pt), gold (Au), copper (Cu), and zinc (Zn) is carried on a surface of the polymer material.

The metal nanoparticle may have a size of about 2 run to about 30 nm. The functional polymer material may include a fiber.

An amount of the semiconductor metal oxide may be in a range of about 0.1 to about 40 parts by weight with respect to 100 parts by weight of the polymer resin.

Brief Description of Drawings FIG. 1 is a transmission electron microscopy (TEM) picture illustrating platinum (Pt) nanoparticles are photo-deposited on a fiber including titanium dioxide (TiO₂) according to an embodiment of the present invention;

FIG. 2 is a TEM picture illustrating silver (Ag) nanoparticles are photo- deposited on a fiber including TiO₂ according to another embodiment of the present invention;

FIG. 3 is a scanning electron microscope (SEM) picture illustrating TiO₂/polyacrylonitrile nano composite fibers according to still another embodiment of the present invention;

FIG. 4 is a TEM picture illustrating a nano composite fiber which carries platinum nanoparticles and includes TiO₂ particles according to yet another embodiment of the present invention;

FIG. 5 is a SEM picture illustrating TiO₂/polyacrylonitrile nano composite fibers according to still another embodiment of the present invention; and

FIG. 6 is a TEM picture illustrating a nano composite fiber which carries silver nanoparticles and includes TiO₂ particles according to an embodiment of the present invention.

Best Mode for Carrying Out the Invention

Hereinafter, the present invention is described in detail. To manufacture a functional polymer material according to the present invention, a polymer resin composition containing a semiconductor metal oxide is required to be prepared by mixing and kneading the semiconductor metal oxide and a polymer resin.

As the semiconductor metal oxide, a tin oxide (SnO₂), a zinc oxide (ZnO), a titanium dioxide (TiO₂), an iron oxide (Fe₂O₃), an indium oxide (In₂O₃), an antimony trioxide (Sb₂O₃), a tungsten trioxide (WO₃), an indium tin oxide (In₂O₃:SnO₂), an antimony tin oxide (Sb₂O₃)SnO₂), a barium titanate (BaTiO₃), a cerium oxide (CeO₂), and the like may be used. Also, the above-described compounds may be used alone or in a mixture thereof.

As the polymer resin, polyester, polyamid, polyacrylonitrile, polyvinyl alcohol, polyactic acid, polyethylene oxide, polyethylene vinyl alcohol copolymer, cellulose acetate, polymethacrylate, a polyester-based copolymer, polyvinyl acetate, 1,4- butadiene rubber, polyvinyl chloride, and the like may be used. The polymer resin may be used alone or in a mixture thereof.

In order to melt and knead the semiconductor metal oxide particles in the polymer resin, about 0.1 to about 40 parts by weight of the semiconductor metal oxide particles is mixed with 100 parts by weight of the polymer resin using a melting mixer. The mixing is performed until a mixture of the polymer resin and the semiconductor metal oxide changes into an integrally molten body at a melting temperature of the polymer resin. When the polymer resin is used as a soluble resin and a polymer resin solution mixed in a solvent, the polymer resin composition is manufactured by adding about 0.1 to about 40 parts by weight of the semiconductor metal oxide particles to about 5 ~ 20 parts by weight of a polymer gel and dispersing a mixture of the polymer resin and the semiconductor metal oxide particles. In this instance, a sigma mixer, brabender, single screw extruder, twin screw extruder, compounder, and the like may be used as a mixer. The compounder and the twin screw extruder may be used to perform a mechanical mixing more efficiently. In a case of the soluble resin, a homogenizer, ultrasonic distributor, magnetic stirrer, and the like may be used to disperse the semiconductor metal oxide particles to the polymer gel.

In order to manufacture the polymer resin composition as a fiber, the polymer resin composition is provided to a melting spinning machine, and spun at a predeterminedspinning speed at a temperature similar to a melting point of the polymer resin. Also, the polymer resin composition is elongated at a temperature similar to a glass transition temperature of the polymer resin, and thus the polymer resin composition is manufactured as the fiber. To manufacture the polymer resin composition as a nanofiber, the polymer resin composition is spun under a suitable electric field using a general electro spinning extruder. Also, to manufacture the polymer resin composition as a plastic injection molding product, the polymer resin composition is processed to be a melted in a temperature higher than the melting point of the polymer resin, and the plastic injection molding product is manufactured using an injection machine.

A material including the semiconductor metal oxide such as the fiber, plastic, rubber, and the like is immersed into a metal ion solution such as silver (Ag), platinum (Pt), gold (Au), copper (Cu), and zinc (Zn). Also, the material in the metal ion solution is photo-deposited using ultraviolet rays. Accordingly, a functional nano composite material where nanoparticles such as silver (Ag), platinum (Pt), gold (Au), copper (Cu), and zinc (Zn) are carried on a surface of the semiconductor metal oxide particles may be manufactured. The silver (Ag), platinum (Pt), gold (Au), copper (Cu), and zinc (Zn) is carried on metal oxide particles dispersed on a surface of the nano composite material. The metal preferably has a size of about 1 run to about 30 nm. The size of the metal oxide particles may be controlled by controlling an ultraviolet radiation time when performing the photo-deposition. Hereinafter, the present invention is described in greater detail through examples. However, it is apparent that the present invention is not limited to the embodiments.

[Example 1]

A titanium dioxide (TiO₂) of about 5 parts by weight with respect to a polyethylene terephthalate (PET) resin was injected to a twin screw compounder (Wrarner & Pfleiderer, Type ZSK 25) at a discharge speed of 15 kg/h, mixed at a screw speed of 250 rpm at a temperature between about 260 ⁰C and about 290 ⁰C, and thus a resin composition in a form of chip was made. The resin composition was injected to a melting spinning machine (Korea Spin-draw M/C). The melting spinning machine includes a spinneret in which a diameter of a spinning hole is about 0.5 mm, and a number of spinning holes is 60. The resin composition was spun at a winding speed of 1500 m/min and the discharging speed of g/min at a spinning temperature of about 290 ⁰C. Also, the resin composition was elongated in an elongation ratio of 3.8 at an elongation temperature of 95 ⁰C. Accordingly, a 2.1 denier fiber was manufactured. While the fiber was immersed in a chloroplatinic acid (H₂PtCl₆H₂O) solution of 1.5 x 10^"4 mol, the platinum (Pt) was photo-deposited by irradiating the fiber with ultraviolet rays for 60 seconds. A composite fiber in which the platinum (Pt) was carried on a surface of the TiO₂ particles was washed by distilled water and dried at room temperature. A size of the platinum (Pt) particles carried on the TiO₂ particles was measured as about 1 nm to about 2 run. FIG. 1 is a transmission electron microscopy (TEM) picture illustrating a TiO₂/polyesther fiber in which the platinum (Pt) particles are carried according to an embodiment of the present invention.

[Example 2]

TiO₂ particles of about 10 parts by weight with respect to a PET resin was injected to a twin screw compounder (Wrarner & Pfleiderer, Type ZSK 25) at a discharge speed of 15 kg/h, mixed in a screw speed of 250 rpm at a temperature between about 260 ⁰C and about 290 ⁰C, and thus a resin composition in a form of chip was made. The resin composition was injected to a melting spinning machine (Korea Spin-draw M/C). The melting spinning machine includes a spinneret in which a diameter of a spinning hole is about 0.5 mm, and a number of spinning holes is 60. The resin composition was spun at a winding speed of 1500 m/min with a capacity of 19 g/min at a spinning temperature of about 290 ⁰C. Also, the resin composition was elongated at an elongation ratio of 3.8 at an elongation temperature of 95 ⁰C. Accordingly, a 2.1 denier fiber was manufactured. While the fiber was immersed in a chloroplatinic acid (H₂PtCl₆H₂O) solution of 1.5 x 10^"4 mol, the platinum (Pt) was photo-deposited by irradiating the fiber with ultraviolet rays for 60 seconds. A composite fiber in which the platinum (Pt) was carried on the TiO₂ particles was washed by distilled water and dried at room temperature.

[Example 3] A zinc oxide (ZnO) of about 10 parts by weight with respect to a PET resin was injected to a twin screw compounder (Wrarner & Pfleiderer, Type ZSK 25) at a discharge speed of of 15 kg/h, mixed at a screw speed of 250 rpm at a temperature between about 260 ⁰C and about 290 ⁰C, and thus a resin composition in a form of chip was made. The resin composition was injected to a melting spinning machine (Korea Spin-draw M/C). The melting spinning machine includes a spinneret in which a diameter of a spinning hole is about 0.5 mm, and a number of spinning holes is 60. The resin composition was spun at a winding speed of 1500 m/min with a capacity of 19 g/min at a spinning temperature of about 290 ⁰C. Also, the resin composition was elongated at an elongation rate of 3.8 at an elongation temperature of 95 ⁰C. Accordingly, a 2.1 denier fiber was manufactured. While the fiber was immersed in a chloroplatinic acid (H₂PtCl₆H₂O) solution of 1.5 x 10^"4 mol, the platinum (Pt) was photo-deposited by irradiating the fiber with ultraviolet rays for 60 seconds. A composite fiber in which the platinum (Pt) was carried on the ZnO particles was washed by distilled water and dried at room temperature. A size of the platinum (Pt) particles carried on the ZnO particles was measured as about 1 nm to about 2 run.

[Example 4]

TiO₂ particles of about 10 parts by weight with respect to a PET resin was injected to a twin screw compounder (Wrarner & Pfieiderer, Type ZSK 25) at a discharge speed of 15 kg/h, mixed at a screw speed of 250 rpm at a temperature between about 260 ⁰C and about 290 ⁰C, and thus a resin composition in a form of chip was made. The resin composition was injected to a melting spinning machine (Korea Spin-draw M/C). The melting spinning machine includes a spinneret in which a diameter of a spinning hole is about 0.5 mm, and a number of spinning holes is 60. The resin composition was spun at a winding speed of 1500 m/min with a capacity of 19 g/min at a spinning temperature of about 290 ⁰C. Also, the resin composition was elongated at an elongation ratio of 3.8 at an elongation temperature of 95 ⁰C. Accordingly, a 2.1 denier fiber was manufactured. While the fiber was immersed in a silver nitrate (AgNO₃) solution of 1.5 x 10^"4 mol, the silver (Ag) was photo-deposited by irradiating the fiber with ultraviolet rays for 60 seconds. A composite fiber in which the silver (Ag) was carried on the TiO₂ particles was washed by distilled water and dried at room temperature. A size of the silver (Ag) particles carried on the TiO₂ particles was measured as about 1 nm to about 2 nm. FIG. 2 is a TEM picture illustrating a TiO₂/polyesther fiber in which the silver (Ag) particles are carried according to another embodiment of the present invention.

[Example 5]

10 parts by weight of polyacrylonitrile was dissolved in an N, N- dimethylformamide (DMF) solvent, and then TiO₂ of about 1 part by weight with respect to the polyacrylonitrile was slowly injected to the solvent and stirred at a temperature of 60 ⁰C for six hours. Accordingly, a dispersed mixture of TiO₂ and polyacrylonitrile was manufactured. A TiO₂/polyacrylonitrile composite fiber having a diameter of 280 nm was manufactured by electro-spinning the dispersed mixture at a voltage of 20 kV. FIG. 3 is a scanning electron microscope (SEM) picture illustrating the TiO₂/polyacrylonitrile composite fiber. Also, after immersing the composite fiber into a chloroplatinic acid (H₂PtCl₆H₂O) solution of 1.5 x 10^"4 mol, platinum (Pt) was photo-deposited by irradiating the composite fiber with ultraviolet rays for 120 seconds. The composite fiber in which the platinum (Pt) was carried on the TiO₂ particles was washed by distilled water and dried at room temperature. FIG. 4 is a TEM picture illustrating the TiO₂/polyacrylonitrile composite fiber. A size of the platinum (Pt) particles carried on the TiO₂ particles was measured as about 1 nm to about 2 nm.

[Example 6] 10 parts by weight of polyacrylonitrile was dissolved in an N, N-DMF solvent, and then TiO₂ of about 10 parts by weight with respect to the polyacrylonitrile was slowly injected and stirred at a temperature of 60 ⁰C for six hours. Accordingly, a dispersed mixture of TiO₂ and polyacrylonitrile was manufactured. A Tiθ₂/polyacrylonitrile composite fiber having a diameter of 280 nm was manufactured by electro-spinning the dispersed mixture at a voltage of 20 kV. FIG. 5 is a SEM picture illustrating the TiO₂/polyacrylonitrile composite fiber. Also, after immersing the composite fiber in a chloroplatinic acid (H₂PtCl₆H₂O) solution of 1.5 x 10^"4 mol, platinum (Pt) was photo-deposited by irradiating the composite fiber with ultraviolet rays for 180 seconds. The composite fiber in which the platinum (Pt) was carried on the TiO₂ particles was washed by distilled water and dried at room temperature.

[Example 7] 10 parts by weight of polyacrylonitrile was dissolved in an N, N-DMF solvent, and then TiO₂ of about 10 parts by weight with respect to the polyacrylonitrile was slowly injected and stirred at a temperature of 60 ⁰C for six hours. Accordingly, a dispersed mixture of TiO₂ and polyacrylonitrile was manufactured. A TiO₂/polyacrylonitrile composite fiber having a diameter of 280 run was manufactured by electro-spinning the dispersed mixture at a voltage of 20 kV. Also, after immersing the composite fiber in a silver nitrate (AgNO₃) solution of 1.5 x 10^"4 mol, silver (Ag) was photo-deposited by irradiating the composite fiber with ultraviolet rays for 60 seconds. The composite fiber in which the silver (Ag) was carried on the TiO₂ particles was washed by distilled water and dried at room temperature. FIG. 6 is a TEM picture illustrating the TiO₂/polyacrylonitrile composite fiber. A size of the silver (Ag) particles carried on the TiO₂ particles was measured as about 1 run to about 3 ran.

[Example 8]

10 parts by weight of polyacrylonitrile was dissolved in an N, N-DMF solvent, and then zinc oxide (ZnO) nano particles of about 10 parts by weight with respect to the polyacrylonitrile was slowly injected and stirred at a temperature of 60 ⁰C for six hours. Accordingly, a dispersed mixture of ZnO and polyacrylonitrile was manufactured. A ZnO/polyacrylonitrile composite fiber having a diameter of 300 run was manufactured by electro-spinning the dispersed mixture at a voltage of 20 kV. Also, after immersing the composite fiber in a chloroplatinic acid (H₂PtCl₆H₂O) solution of 1.5 x 10^"4 mol, platinum (Pt) was photo-deposited by irradiating the composite fiber with ultraviolet rays for 120 seconds. The composite fiber in which the platinum (Pt) was carried on the ZnO particles was washed by distilled water and dried at room temperature.

[Example 9]

10 parts by weight of polyacrylonitrile was dissolved in an N, N-DMF solvent, and then tin oxide (SnO₂) nano particles of about 10 parts by weight with respect to the polyacrylonitrile was slowly injected and stirred at a temperature of 60 ⁰C for six hours.

Accordingly, a dispersed mixture of SnO₂ and polyacrylonitrile was manufactured. A

SnO₂/polyacrylonitrile composite fiber having a diameter of 360 run was manufactured by electro-spinning the dispersed mixture at a voltage of 20 kV. Also, after immersing the composite fiber in a chloroplatinic acid (H₂PtCl₆H₂O) solution of 1.5 x 10^"4 mol, platinum (Pt) was photo-deposited by irradiating the composite fiber with ultraviolet rays for 60 seconds. The composite fiber in which the platinum (Pt) was carried on the SnO₂ particles was washed by distilled water and dried at room temperature.

[Example 10]

TiO₂ particles of about 10 parts by weight with respect to PET resin was injected to a twin screw compounder (Wrarner & Pfleiderer, Type ZSK 25) at a discharge speed of 15 kg/h, mixed at a screw speed of 200 rpm at a temperature between about 220 ⁰C and about 230 ⁰C, and thus a resin composition in a form of chip was made. After manufacturing an injection sample using an injection machine, and immersing the injection sample in a silver nitrate (AgNO₃) solution of 1.5 x 10^"4 mol, silver (Ag) was photo-deposited by irradiating the injection sample with ultraviolet rays for 60 seconds. A plastic injection product in which the silver (Ag) was carried on the TiO₂ particles was washed by distilled water and dried at room temperature.

According to the present invention, nano-size silver (Ag), platinum (Pt), gold (Au), copper (Cu), and zinc (Zn) particles are photo-deposited on semiconductor metal oxide particles. Accordingly, a functional polymer material according to the present invention selectively includes the silver (Ag), platinum (Pt), gold (Au), copper (Cu), and zinc (Zn). Thus, the functional polymer material is applicable to a functional plastic, functional clothing, industrial fiber, and medical goods requiring an antibiotic, electromagnetic shielding, and deodorizing function. Also, when applied to a non- woven fabric, the functional polymer material may be used for air purifying. Further, the functional polymer material may be used for medical goods such as a wound- covering material, which prevents a wound area from secondary infection, skin wipes, plastic sheets, plastic material for vehicles, plastic containers for packing, and the like.

Although a few examples of the present invention have been shown and described, the present invention is not limited to the described examples. Instead, it would be appreciated by those skilled in the art that changes may be made to these examples without departing from the principles and spirit of the invention, the scope of which is defined by the claims and their equivalents.

Claims

1. A method of manufacturing a functional polymer material, the method comprising: preparing a polymer resin composition containing a semiconductor metal oxide by mixing and kneading the semiconductor metal oxide and a polymer resin; forming a polymer material of a predetermined shape by shaping the polymer resin composition; and carrying a metal nanoparticle on a metal oxide particle, dispersed on a surface of the polymer material, by photo-depositing the metal nanoparticle on the polymer material.

2. The method of claim 1, wherein the polymer resin is selected from the group consisting of polyester, polypropylene, polyethylene, polyamid, polypropylene terephthalate, polybutylene terephthalate, polyacrylonitrile, polyvinyl alcohol, polyactic acid, polyethylene oxide, polyethylene vinyl alcohol copolymer, cellulose acetate, polymethacrylate, a polyester-based copolymer, polyvinyl acetate, polyvinylcarbazole, collagen, polyaniline, polystyrene, polyurethane, polycarbonate, nylon, polyethylene- vinylacetate copolymer, synthetic rubber, and natural rubber.

3. The method of claim 1, wherein the semiconductor metal oxide is at least one selected from the group consisting of a tin oxide (SnO₂), a zinc oxide (ZnO), a titanium dioxide (TiO₂), an iron oxide (Fe₂O₃), an indium oxide (In₂O₃), an antimony trioxide (Sb₂O₃), a tungsten trioxide (WO₃), an indium tin oxide (In₂O₃: SnO₂), an antimony tin oxide (Sb₂O₃:SnO₂), a barium titanate (BaTiO₃), and a cerium oxide (CeO₂).

4. The method of claim 1, wherein the semiconductor metal oxide and the polymer resin are mixed in a range of about 0.1 to about 40 parts by weight with respect to 100 parts by weight of the polymer resin.

5. The method of claim 1, wherein the shaping is performed using an injection machine, melting spinning machine, or electro spinning extruder.

6. The method of claim 1, wherein the photo-depositing is performed by immersing the polymer material in a metal precursor solution and then irradiating the immersed polymer material with ultraviolet rays, the metal precursor solution having a salt-typed metal precursor.

7. The method of claim 6, wherein the metal precursor solution includes a metal salt solution including at least one selected from the group consisting of silver (Ag), platinum (Pt), gold (Au), copper (Cu), and zinc (Zn).

8. A functional polymer material, comprising: a polymer material including a semiconductor metal oxide, wherein at least one metal nanoparticle selected from the group consisting of silver (Ag), platinum (Pt), gold (Au), copper (Cu), and zinc (Zn) is carried on a surface of the polymer material.

9. The functional polymer material of claim 8, wherein the semiconductor metal oxide is at least one selected from the group consisting of a tin oxide (SnO₂), a zinc oxide (ZnO), a titanium dioxide (TiO₂), an iron oxide (Fe₂O₃), an indium oxide (In₂O₃), an antimony trioxide (Sb₂O₃), a tungsten trioxide (WO₃), an indium tin oxide (In₂O₃ISnO₂), an antimony tin oxide (Sb₂O₃ISnO₂), a barium titanate (BaTiO₃), and a cerium oxide (CeO₂).

10. The functional polymer material of claim 8, wherein the polymer is selected from the group consisting of polyester, polypropylene, polyethylene, polyamid, polypropylene terephthalate, polybutylene terephthalate, polyacrylonitrile, polyvinyl alcohol, polyactic acid, polyethylene oxide, polyethylene vinyl alcohol copolymer, cellulose acetate, polymethacrylate, a polyester-based copolymer, polyvinyl acetate, polyvinylcarbazole, collagen, polyaniline, polystyrene, polyurethane, polycarbonate, nylon, polyethylene-vinylacetate copolymer, synthetic rubber, and natural rubber.

11. The functional polymer material of claim 8, wherein the metal nanoparticle has a size of about 1 nm to about 30 nm.

12. The functional polymer material of claim 11, wherein the functional polymer material includes a fiber.

13. The functional polymer material of claim 8, wherein an amount of the semiconductor metal oxide is in a range of about 0.1 to about 40 parts by weight with respect to 100 parts by weight of the polymer resin.