WO2008016844A3 - Non-volatile memory capable of correcting overwritten cell - Google Patents

Non-volatile memory capable of correcting overwritten cell Download PDF

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Publication number
WO2008016844A3
WO2008016844A3 PCT/US2007/074564 US2007074564W WO2008016844A3 WO 2008016844 A3 WO2008016844 A3 WO 2008016844A3 US 2007074564 W US2007074564 W US 2007074564W WO 2008016844 A3 WO2008016844 A3 WO 2008016844A3
Authority
WO
WIPO (PCT)
Prior art keywords
reset
resistance
level
cells
volatile memory
Prior art date
Application number
PCT/US2007/074564
Other languages
French (fr)
Other versions
WO2008016844A2 (en
Inventor
Roy E Scheuerlein
Tanmay Kumar
Original Assignee
Sandisk 3D Llc
Roy E Scheuerlein
Tanmay Kumar
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US11/461,424 external-priority patent/US7495947B2/en
Priority claimed from US11/461,431 external-priority patent/US7492630B2/en
Application filed by Sandisk 3D Llc, Roy E Scheuerlein, Tanmay Kumar filed Critical Sandisk 3D Llc
Publication of WO2008016844A2 publication Critical patent/WO2008016844A2/en
Publication of WO2008016844A3 publication Critical patent/WO2008016844A3/en

Links

Classifications

    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C13/00—Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00
    • G11C13/0002—Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00 using resistive RAM [RRAM] elements
    • G11C13/0007—Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00 using resistive RAM [RRAM] elements comprising metal oxide memory material, e.g. perovskites
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C11/00—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
    • G11C11/56—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using storage elements with more than two stable states represented by steps, e.g. of voltage, current, phase, frequency
    • G11C11/5685—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using storage elements with more than two stable states represented by steps, e.g. of voltage, current, phase, frequency using storage elements comprising metal oxide memory material, e.g. perovskites
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C13/00—Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00
    • G11C13/0002—Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00 using resistive RAM [RRAM] elements
    • G11C13/0021—Auxiliary circuits
    • G11C13/0069—Writing or programming circuits or methods
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C16/00—Erasable programmable read-only memories
    • G11C16/02—Erasable programmable read-only memories electrically programmable
    • G11C16/06—Auxiliary circuits, e.g. for writing into memory
    • G11C16/34—Determination of programming status, e.g. threshold voltage, overprogramming or underprogramming, retention
    • G11C16/3404—Convergence or correction of memory cell threshold voltages; Repair or recovery of overerased or overprogrammed cells
    • G11C16/3413—Circuits or methods to recover overprogrammed nonvolatile memory cells detected during program verification, usually by means of a "soft" erasing step
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C5/00—Details of stores covered by group G11C11/00
    • G11C5/02—Disposition of storage elements, e.g. in the form of a matrix array
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C17/00—Read-only memories programmable only once; Semi-permanent stores, e.g. manually-replaceable information cards
    • G11C17/14—Read-only memories programmable only once; Semi-permanent stores, e.g. manually-replaceable information cards in which contents are determined by selectively establishing, breaking or modifying connecting links by permanently altering the state of coupling elements, e.g. PROM
    • G11C17/16—Read-only memories programmable only once; Semi-permanent stores, e.g. manually-replaceable information cards in which contents are determined by selectively establishing, breaking or modifying connecting links by permanently altering the state of coupling elements, e.g. PROM using electrically-fusible links
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C13/00—Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00
    • G11C13/0002—Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00 using resistive RAM [RRAM] elements
    • G11C13/0021—Auxiliary circuits
    • G11C13/0069—Writing or programming circuits or methods
    • G11C2013/009—Write using potential difference applied between cell electrodes
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C2211/00—Indexing scheme relating to digital stores characterized by the use of particular electric or magnetic storage elements; Storage elements therefor
    • G11C2211/56—Indexing scheme relating to G11C11/56 and sub-groups for features not covered by these groups
    • G11C2211/564—Miscellaneous aspects
    • G11C2211/5641—Multilevel memory having cells with different number of storage levels
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C2213/00—Indexing scheme relating to G11C13/00 for features not covered by this group
    • G11C2213/30—Resistive cell, memory material aspects
    • G11C2213/32—Material having simple binary metal oxide structure
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C2213/00—Indexing scheme relating to G11C13/00 for features not covered by this group
    • G11C2213/30—Resistive cell, memory material aspects
    • G11C2213/33—Material including silicon
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C2213/00—Indexing scheme relating to G11C13/00 for features not covered by this group
    • G11C2213/30—Resistive cell, memory material aspects
    • G11C2213/34—Material includes an oxide or a nitride
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C2213/00—Indexing scheme relating to G11C13/00 for features not covered by this group
    • G11C2213/70—Resistive array aspects
    • G11C2213/71—Three dimensional array
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C2213/00—Indexing scheme relating to G11C13/00 for features not covered by this group
    • G11C2213/70—Resistive array aspects
    • G11C2213/72—Array wherein the access device being a diode

Abstract

A reverse bias trim operation for the reset state of a non-volatile memory system is disclosed. Non-volatile memory cells including a resistance change element undergo a reverse bias reset operation to change their resistance from a set state at a first level of resistance to a reset state at a second level of resistance. Certain memory cells in a set of cells that was reset may be deeply reset to a level of resistance beyond a target level for the reset state. A second reverse bias is applied to the set of memory cells to move the resistance of each cell that was deeply reset toward the target level of the reset state. A smaller reverse bias than used for the reset operation can shift the resistance of the cells back toward the set level and out of their deeply reset condition. The operation is self-limiting in that cells stop their resistance shifts upon reaching the target level. Cells that were not deeply reset are not affected.
PCT/US2007/074564 2006-07-31 2007-07-27 Non-volatile memory capable of correcting overwritten cell WO2008016844A2 (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US11/461,424 US7495947B2 (en) 2006-07-31 2006-07-31 Reverse bias trim operations in non-volatile memory
US11/461,431 2006-07-31
US11/461,431 US7492630B2 (en) 2006-07-31 2006-07-31 Systems for reverse bias trim operations in non-volatile memory
US11/461,424 2006-07-31

Publications (2)

Publication Number Publication Date
WO2008016844A2 WO2008016844A2 (en) 2008-02-07
WO2008016844A3 true WO2008016844A3 (en) 2008-03-27

Family

ID=38863123

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2007/074564 WO2008016844A2 (en) 2006-07-31 2007-07-27 Non-volatile memory capable of correcting overwritten cell

Country Status (2)

Country Link
TW (1) TWI356415B (en)
WO (1) WO2008016844A2 (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2008016833A2 (en) * 2006-07-31 2008-02-07 Sandisk 3D Llc Increasing write voltage pulse operations in non-volatile memory
US7522448B2 (en) 2006-07-31 2009-04-21 Sandisk 3D Llc Controlled pulse operations in non-volatile memory
US7719874B2 (en) 2006-07-31 2010-05-18 Sandisk 3D Llc Systems for controlled pulse operations in non-volatile memory
US7978507B2 (en) 2008-06-27 2011-07-12 Sandisk 3D, Llc Pulse reset for non-volatile storage
TWI480980B (en) * 2012-09-26 2015-04-11 Lin Chrong Jung Memory array and non-volatile memory device of the same

Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5818749A (en) * 1993-08-20 1998-10-06 Micron Technology, Inc. Integrated circuit memory device
US6483734B1 (en) * 2001-11-26 2002-11-19 Hewlett Packard Company Memory device having memory cells capable of four states
WO2003085675A2 (en) * 2002-04-04 2003-10-16 Kabushiki Kaisha Toshiba Phase-change memory device
EP1426971A2 (en) * 2002-12-05 2004-06-09 Sharp Kabushiki Kaisha Semiconductor memory device and metohd for correcting memory cell data
US20040114419A1 (en) * 2002-12-13 2004-06-17 Lowrey Tyler A. Method and system to store information
US20040264234A1 (en) * 2003-06-25 2004-12-30 Moore John T. PCRAM cell operation method to control on/off resistance variation
US20050226067A1 (en) * 2002-12-19 2005-10-13 Matrix Semiconductor, Inc. Nonvolatile memory cell operating by increasing order in polycrystalline semiconductor material
US20060109704A1 (en) * 2004-11-06 2006-05-25 Sun-Ae Seo Nonvolatile memory device using resistor having multiple resistance states and method of operating the same
WO2006121837A2 (en) * 2005-05-09 2006-11-16 Sandisk 3D Llc Nonvolatile memory cell comprising a diode and a resistance-switching material
US20070069276A1 (en) * 2005-09-28 2007-03-29 Scheuerlein Roy E Multi-use memory cell and memory array

Patent Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5818749A (en) * 1993-08-20 1998-10-06 Micron Technology, Inc. Integrated circuit memory device
US6483734B1 (en) * 2001-11-26 2002-11-19 Hewlett Packard Company Memory device having memory cells capable of four states
WO2003085675A2 (en) * 2002-04-04 2003-10-16 Kabushiki Kaisha Toshiba Phase-change memory device
EP1426971A2 (en) * 2002-12-05 2004-06-09 Sharp Kabushiki Kaisha Semiconductor memory device and metohd for correcting memory cell data
US20040114419A1 (en) * 2002-12-13 2004-06-17 Lowrey Tyler A. Method and system to store information
US20050226067A1 (en) * 2002-12-19 2005-10-13 Matrix Semiconductor, Inc. Nonvolatile memory cell operating by increasing order in polycrystalline semiconductor material
US20040264234A1 (en) * 2003-06-25 2004-12-30 Moore John T. PCRAM cell operation method to control on/off resistance variation
US20060109704A1 (en) * 2004-11-06 2006-05-25 Sun-Ae Seo Nonvolatile memory device using resistor having multiple resistance states and method of operating the same
WO2006121837A2 (en) * 2005-05-09 2006-11-16 Sandisk 3D Llc Nonvolatile memory cell comprising a diode and a resistance-switching material
US20070069276A1 (en) * 2005-09-28 2007-03-29 Scheuerlein Roy E Multi-use memory cell and memory array
WO2007038665A1 (en) * 2005-09-28 2007-04-05 Sandisk 3D Llc Memory cell comprising switchable semiconductor memory element with trimmable resistance

Also Published As

Publication number Publication date
WO2008016844A2 (en) 2008-02-07
TWI356415B (en) 2012-01-11
TW200830315A (en) 2008-07-16

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