WO2008034478A1

WO2008034478A1 - Substrates equipped with security features, and method for producing them

Info

Publication number: WO2008034478A1
Application number: PCT/EP2007/006285
Authority: WO
Inventors: Wolfgang Lohwasser; André Wisard
Original assignee: Alcan Technology & Management Ltd.
Priority date: 2006-09-22
Filing date: 2007-07-16
Publication date: 2008-03-27
Also published as: EP2067063A1

Abstract

Substrates equipped with optically perceptible security features contain a plastic film and, deposited thereon, a semitransparent layer composed of metal, at least one dielectric layer and a reflective layer composed of metal. The layers are deposited successively on one side of the substrate by means of a vacuum vapour deposition method in the layer sequence a) a semitransparent layer composed of titanium, vanadium, chromium, iron, cobalt, nickel, copper, rhodium, palladium, silver, tin, zinc, tungsten, platinum or gold or alloys thereof or of mixtures thereof, b) a layer composed of AlxOy, where x:y = 0.5 to 1, and c) a reflective layer composed of a metal. The substrates are particularly suitable as indications of origin, indications of originality, protections against forgery, markings, e.g. as, in or on valuable papers, banknotes, packagings, etc.

Description

Substrates equipped with security features and method for their production

The present invention relates to substrates which are equipped with optically perceptible security features and to methods for producing substrates equipped with optically perceptible security features and to the use of the substrates.

It is known from EP 1 504 923, for example, to provide substrates such as plastic films with security features. By way of example, a PET substrate is exposed to a semitransparent adsorber layer, a dielectric layer and a reflective metal layer. From the coated substrates, portions of securities, such as banknotes, may be generated.

From WO 2005/085780 a process for the production of a Fabry-Perot filter for use on decorative films has become known. A thin coating of three layers deposited on a substrate is described. Deposited on the substrate is a first opaque reflective layer of a base material, lying thereon an intermediate layer of the base material with another material and then thereon another partially transparent reflective layer of the base material.

The known security features, resp. Filters are either difficult to produce by their layer structure or are limited in more rational processes in the variability of the layer structure.

Object of the present invention is to overcome the disadvantages mentioned and to propose substrates with security features with new layer sequences and an improved manufacturing process for such security features.

According to the invention, this is achieved by the fact that, on one side of the substrate, the layer sequence a) comprises a semitransparent layer of chromium which, together with the substrate, has an optical transparency of 30 to 55% in the case of a light wave. b) a layer of Al _x O y, where x: y = 0.5 to 1, in a thickness of 120 to 750 nm, wherein the light absorption of the layer b) is less than 15% in the wavelength range of 420 to 800 nm and c) a reflective layer of aluminum, ruthenium and / or silver having an optical density OD of greater than 0.7 at a wavelength of 55 nm, is deposited.

The semitransparent layer a) consists of chromium, occasionally with process-typical impurities.

The layer b) is made of Al _x O _y , where x: y give the numbers given above and expediently x: y = 0.6 to 0.7 results. Preferably, x is the number 2 and y is the number 3.

The layer c) is, for example, a reflective layer comprising aluminum, titanium, vanadium, chromium, iron, cobalt, nickel, copper, rhodium, palladium, silver, tin, zinc, tungsten, platinum or gold or mixtures or alloys thereof, or stainless steel alloys contains or consists of. Aluminum is preferred.

The layers arranged on the substrate a) the semitransparent layer of the abovementioned metals can have a thickness of 2 to 50 nm (nanometers), b) the layer of Al _x O _y , can have a thickness of 20 to 1000 nm, and c) the reflective layer of a metal may have a thickness of 20 to 200 nm.

In a particularly preferred embodiment, the layer sequence a) on one side of the substrate is a semitransparent layer of chromium with an optical transmission, measured, resp. determined, together with the substrate, from 30 to 55% at a light wavelength of 550 nm, b) a layer of Al _x Oy, where x: y = 0, 5 to 1, in a thickness of 120 to 750 nm, wherein the light absorption of the layer b) is less than 15% in the wavelength range of 420 to 800 nm, and c) a reflective layer of aluminum, ruthenium and / or silver with an optical density OD of greater than 0.7 at a wavelength of 550 nm, deposited.

Optical transmission is understood to mean the transmittance of an incident radiation flux, in the present case light waves of the wavelength of 550 nm, which completely penetrates the substrate and the semitransparent layer. By optical density is meant the perceptual logarithmically formulated opacity and thus a measure of the attenuation or blackening of a radiation, in the present case light of a wavelength of 550 nm.

Possible also that on one side of the substrate, the layer sequence a) is the semi-transparent layer, b is the layer of Al _x Oy, and c) the reflective layer is deposited) and an additional layer d) arranged arrival on the layer c) ,

The substrate is advantageously a film of a plastic, which is in particular transparent or at least translucent. The substrate may also be only partially transparent or only partially translucent. However, the desired optical effect only becomes effective in the transparent or translucent areas. The substrate may contain one or more layers. For example, it can be a polyester film, for example a polyethylene terephthalate film (PET), a polyamide film, eg an oriented polyamide film (OPA), a polyolefin film, eg an oriented polypropylene film (OPP) or a film or layer containing an acid-denatured polyolefin. If the base film contains several layers, it may be two or more mutually adhesive-laminated, extrusion-laminated and / or hot calendered layers, resp. Act slides. Adhesive-laminated layers or films can be processed with aqueous, solvent-based and / or solvent-free adhesives. The thickness of the substrate may be from 12 to 500 .mu.m, suitably from 15 to 250 .mu.m. Typical thicknesses of individual films are 12, 15, 20, 23 and 25 μm.

The optional layer d) may be applied to the reflective layer (layer c) as at least one further layer. It may be a paint, a plastic layer, a plastic film, a plastic film composite, a metal foil, a paper, etc., or a combination of two or more of the materials. Material examples of plastic layers, plastic films and plastic film composites can be found in the material lists given for the substrates. The materials can be transparent, translucent or opaque. The lacquer may be an alkyd resin, epoxy resin, acrylic resin, polyester, polyurethane lacquer, a cellulosic lacquer, etc. The plastic layers may be extruded or laminated layers. Plastic films and composites as well as metal foils can be laminated or glued on. As metal foils, iron and non-ferrous metal foils such as foils of iron, steel, nickel, copper, etc. may be used. The metal foils have a thickness of, for example, 12 to 200 .mu.m, suitably 20 to 200 .mu.m, preferably 25 to 75 .mu.m and in particular 40 to 50 .mu.m. It is also possible to use composites of the cited plastics and the metal foils mentioned. Furthermore, papers, kraft papers or coated papers or combinations of papers with plastics and / or metal foils can be used.

The said layers of metal and Al _x Oy can be applied by physical deposition methods. Examples of physical deposition methods are vacuum evaporation methods and sputtering.

For coating with the layers with a metal, the substrate in a vacuum chamber in a vacuum, as a single sheets and particularly useful of unwound from a roll, roll or coil, exposed to an atmosphere of substantially vaporized or chipped metal. The metal-containing vapor precipitates in a 0.1 to 1000 nm thick layer on at least one side of the substrate. Continuously, the substrate coated with the metal can be rewound onto an opposite winding, roll or coil.

The semitransparent layer a) is made of Ti, V, Cr, Fe, Co, Ni, Cu, Rh, Pa, Ag, Sn, Zn, W, Pt or Au or alloys thereof or mixtures thereof or stainless steel alloys. Preferably, Cr and Cu are alone or in a mixture of the two metals and most preferably Cr. According to the required metal protective layer, the starting materials are selected from substances containing or consisting of the above-mentioned element (s). For example, the metal is placed in a vacuum chamber and evaporated by means of electron beam gun which is directed onto the target material, or sputtered by means of a sputtering cathode. The semitransparent layer a) preferably consists of chromium. The chromium is preferably evaporated in vacuo by means of an electron beam gun and then deposited on the substrate as the semitransparent layer. The target material is for example a plate of the metal to be evaporated. When a mixture of metals is to be deposited, a mixture of the corresponding metals or multiple metal plates of the corresponding metals may be vaporized or sputtered. The vaporized or sputtered metal deposits on the surface of the substrate in the specified thickness. To obtain a semi-transparent layer, thicknesses of 2 to 20 nm are deposited. The thickness of the metal deposit can be u.a. about the passage speed of the metal foil and the strength of the electron beam, resp. the power of the sputtering cathode, control.

The layer of metal c) may, for example, be composed of Al, Ti, V, Cr, Fe, Co, Ni, Cu, Rh, Pa, Ag, Sn, Zn, W, Pt or Au or alloys thereof or of mixtures thereof. see it. Preferably, AI. According to the required reflective layer, the starting materials are selected from substances containing or consisting of the above-mentioned elements. For example, the metal is placed in a vacuum chamber and vaporized by means of electron beam gun which is directed onto the target material, or preferably sputtered by means of a sputtering cathode. The target material is for example a plate of the metal to be evaporated. When a mixture of metals is to be deposited, a mixture of the corresponding metals or multiple metal plates of the corresponding metals may be vaporized or sputtered. The vaporized or sputtered metal deposits on the surface of the substrate in the specified thickness. To obtain a semi-transparent layer, thicknesses of 20 to 200 nm are deposited. The thickness of the metal deposition can be, inter alia, on the flow rate of the metal foil and by the strength of the electron beam, respectively. the power of the sputtering cathode, control.

The layer of Al _x O y b) can be obtained or produced, for example, from aluminum, from aluminum alloys or from aluminum-containing compounds. For example, the aluminum, an aluminum-containing metal or aluminum-containing compounds, as so-called target material, in a

Submitted vacuum chamber and evaporated by means of electron gun, which is directed to the target material. In the target material, oxygen-containing compounds, such as Al ₂ O ₃ , may be contained or admixed. Otherwise, at the same time as the evaporation of the aluminum, oxygen or an oxygen-containing gas is introduced into the vacuum chamber, in particular directly into the evaporation and deposition area of the aluminum. There is a substantially reactive deposition. The vapor phase elements or compounds may react to Al _x O y and strike down on the surface of the layer a) already on the substrate. In some cases, the previously evaporated aluminum can precipitate on the substrate and form the Al _x O _y immediately afterwards with the supplied oxygen molecules or ions. The layer of Al _x O _y can be in thicknesses of 20 be deposited to 1000 nm. The layer is advantageously transparent and the thickness applied may also depend on the wavelength of the light to be reflected. Depending on the wavelength of the incident and to be reflected light takes place in layer b) a gain or attenuation of the passage of light. Particularly preferred is a layer thickness of the layer b) of 300 to 800 nm, with a layer thickness of 450 to 550 nm is particularly preferred. Also advantageous is a thickness of the layer b), the λ, λ / 2 or λ / 4 or an integer multiple thereof, wherein λ means the wavelength of the light to be reflected.

The layer structure on the substrate equipped according to the invention leads to color effects due to the incident and partially reflected light. For the desired strong color effects, however, layer thicknesses of Al _x O _y on the order of 20 to 1000 nm, and in particular in a range of 500 nm, are desired. The fact that a metal other than aluminum is used as a semitransparent metal layer, the achievable color palette can be extended.

In an expedient embodiment, the substrate equipped according to the invention additionally has a perceptible pattern. The pattern may be any raster, such as a dot or line raster, any motif or motif sequence, characters, a font, or a letter or number sequence, etc. The pattern represents on the side of the substrate with the layer sequence a) the semitransparent layer, b) the layer of Al _x O y, and c) the reflective layer, partially etched through the layers a), b) and c). On the side of the substrate on which the layer sequence a) the semitransparent layer, b) the layer of Al _x O _x , and c) the reflective layer is deposited, and may partially the layer sequence a), b) and c) in the form of a pattern are etched away. The pattern can be produced, for example, by coating, for example printing, on the free side of the layer c) with the negative of the pattern coated on the free side of the layer c) with the negative of the pattern on the free side of the layer c), and then the Substrate is treated with an etching solution such that the unprotected by the paint sites, the layers a), b) and c) are etched away and there only the substrate remains at the protected areas by the paint layer sequence a), b) and c ) remains intact. In another way, a sensitive lacquer can be applied over the entire surface of the layer c). For example, if the resist is light-sensitive, the substrate may be exposed to the pattern and the unexposed portions of the resist removed. Thereafter, the surface can be etched, wherein the no longer protected by the paint parts of the layers a, b) and c) are etched away. The etching may be acidic or alkaline, with an acid etching solution being preferred. The pattern may also be generated by the application of controlled energetic radiation, such as a laser beam, and the partial removal of the layers a), b) and c) by the intended pattern with the energetic radiation.

It has been found and it has proved to be disadvantageous that layers of, for example, 500 nm SiO ₂ cause a pronounced rolling behavior on their film-shaped substrates due to a high layer tension. In the further processing, the pronounced rolling behavior proves to be annoying and prevents a machinability of such substrates. Foil-shaped or sheet-shaped objects made of such substrates can be difficult to handle or handle due to the ever-present tendency to roll. The substrate equipped according to the invention is now characterized by its non-existent or extremely low tendency to rolling. The semitransparent metal layer is protected in the present equipped substrates on the one hand by the substrate, on the other hand by the AI _x Oy against external influences. If the semitransparent metal layer were exposed to the outside atmosphere, there would be a risk of a chemical reaction, such as oxidation. As a result, the color effects can diminish or disappear. The double-sided coating prevents this. Likewise, the outer, ie free, side of the reflective layer c) applied to the substrate, which is made of a metal, can be protected from external influences by the optionally to be applied layer d) and also the mechanical strength can be increased. The thickness of the deposits from the vapor phase can be, inter alia, on the flow rate of the substrate and by the strength of the electron beam, resp. the power of the sputtering cathode, control.

Particularly expedient proves to be a plasma pretreatment with, for example, argon (Ar), nitrogen (N ₂ ), NH ₃ , NO _x (nitrogen oxides) and preferably by means of oxygen plasma, the substrate in the vacuum system. The pre-treatment can be carried out directly in the vacuum system before the first coating and occasionally before each coating treatment. The plasma pretreatment for a particularly good layer adhesion of the layers with each other and the layer on the substrate. The semitransparent layer of metal and the reflective layer of metal are preferably produced by sputtering and the Al _x Oy by electron beam evaporation. Particularly preferred is a plasma pretreatment by means of oxygen plasma. More preferably, the semitransparent layer of chromium and the reflective layer of aluminum are produced by sputtering.

In the case where the substrate is guided over coating rollers which are arranged in the vacuum chamber, the respective vapor is deposited on only the free side of the substrate which does not touch the coating roller.

The present invention also relates to a method for producing substrates equipped with optically perceptible security features.

According to the invention, a substrate is exposed to the coating treatments in at least one vacuum chamber under vacuum conditions at least two evaporation devices, the substrate by means of a first evaporation device with a) a semitransparent layer of titanium, vanadium, chromium, iron, cobalt, nickel, copper, rhodium, palladium, silver , Tin, zinc, tungsten, platinum or gold or alloys thereof or of mixtures thereof, ie coated, by means of a second evaporation b) an AI _x Oy - coated layer, ie coated, and by a further evaporation method with c), a reflective layer of a metal, applied, ie coated, is.

Preferably, the substrate is subjected to the coating treatments of two evaporators in a vacuum chamber under vacuum conditions, the substrate being a first evaporator having a) the semitransparent layer of titanium, vanadium, chromium, iron, cobalt, nickel, copper, rhodium, palladium , Silver, tin, zinc, tungsten, platinum or gold or alloys thereof or mixtures thereof, acted upon by a second evaporation device with b) the Al _x Oy - layer and in a further vacuum chamber under vacuum conditions by a further evaporation process with the other Layer c), the reflective layer of a metal, is applied.

In another preferred embodiment, the substrate is subjected to the coating treatments of two evaporation devices in a vacuum chamber under vacuum conditions, the substrate being heated by means of a first evaporation device comprising a), the semitransparent layer of titanium, vanadium, chromium, iron, cobalt, nickel, copper, Rhodium, palladium, silver,

Tin, zinc, tungsten, platinum or gold or alloys thereof or mixtures thereof, charged, applied by means of a second evaporation device with b) the Al _x O _y layer and by another evaporation process in the vacuum chamber under vacuum conditions with the further layer c) , the reflective layer of a metal, is applied. In particular, the substrate acted upon by the layer a) and the layer b) in the further evaporation process in the vacuum chamber under vacuum conditions in at least one of the evaporation devices with the layer c), the reflective layer of a metal, is applied.

A particularly preferred method is characterized in that the substrate is subjected to the coating treatments in at least one vacuum chamber under vacuum. At least two evaporation devices are exposed to the conditions in which the substrate is subjected to a) a semitransparent layer of chromium in a first evaporation device by evaporation of chromium by electron beam, so that the optical transparency of the semitransparent layer, measured or determined together with the substrate, is maintained in a second evaporation device by evaporation of aluminum by means of electron beam with the addition of oxygen gas with b) an Al _x Oy layer and by another evaporation method, by means of electron beam or thermally, with aluminum, ruthenium or silver up to an optical density of greater than 0.7 at a wavelength of 550 nm with c) a reflective layer is applied.

For example, the substrate may also be acted upon on one side by the a) semi-transparent layer, b) the Al _x O y layer, and c) the reflective layer, and finally on the layer c) by a layer d), preferably a plastic layer , a plastic film, a plastic film composite, a metal foil, a paper or a combination of two or more of the materials, for example by laminating, molding, gluing, etc., are applied.

Present, according to the invention equipped, resp. coated substrates are, for example, as indications of origin, tamper evidence, tamper evident, markings, etc. The equipped substrates can packaging, packaging materials, seals, banderoles, closures, securities, banknotes, identity cards, lottery tickets, access cards, tickets, prepaid cards, driving and air tickets, etc Processed or can be attached to such objects. Therefore, the present invention also relates to the use of the substrates for the stated purposes, an application for banknotes being preferred.

The present invention is explained in more detail by way of example with reference to FIGS. 1 and 2. tert.

Figure 1 shows a section through a possible embodiment of the equipped with visually perceptible security features substrate.

FIG. 2 shows a section through a variant of a device for producing the substrates equipped according to the invention.

The substrate 6 shown in FIG. 1 has the following superimposed layers in section:

The equipped with the security features substrate (6) contains a substrate (1), such as a transparent or translucent plastic layer, respectively. - Foil. A semitransparent layer a) of a metal (2) from the series titan, vanadium, chromium, iron, cobalt, nickel, copper, rhodium, palladium, silver, tin, zinc, tungsten, platinum or gold or alloys thereof or aus Mixtures thereof, a layer b) of Al _x O _y (3), a reflective metal layer c) (4) and occasionally a further layer d) (5). The further layer (5) can represent a functional layer which can influence the properties of the overlying layers, for example with regard to strength, bendability, or acts as a separating or adhering intermediate layer to underlying further materials.

FIG. 2 shows an example of a unit for producing the substrates according to the invention. It is an evacuable space, the vacuum chamber (10). Within the vacuum chamber (10), a supply roll (12) or coil with the substrate (1 1) is arranged. The substrate (11) is continuously unwound and fed to a chill roll (13). At the cooling roller (13), the plasma treatment by means of the corresponding device (14). The plasma-treated substrate (11) is then, still on the circumference of the cooling roller 13, which is also the coating roller, located, a sputtering treatment by means of a sputtering device (15) for Coating with the semitransparent layer a) supplied. If, for example, chromium is used for the semitransparent layer, an electron beam gun is advantageously used for evaporation. After the metal vapor has deposited on the substrate (11), the once-coated substrate (11) leaves the chamber part (16) and is fed to a chamber part (17) separated by chamber walls. The substrate (11) also runs in the chamber part (17) via a cooling roller (18), resp. Coating roll. In the chamber part (17) by means of an electron beam crown (15) whose beam is directed to a supply of target material (19) and thereby the target material (19) evaporates. The target material is usually as ramming mass, debris or as a metal plate on a displacement device. The electron beam scans, ie it oscillates over the target material and vaporizes it in layers. The vaporized material strikes the substrate (11), which is acted upon by the Al _x 0y layer. The target material (19) may be, for example, Al ₂ O ₃ or a mixture of aluminum and an oxygen carrier, such as a solid compound. The target material (19) may also be aluminum. In the latter case, oxygen must be supplied. This can be done by a gas supply (20). By the gas supply (20) under, over or stoichiometric amounts of oxygen in the form of oxygen-containing gases or oxygen in the chamber part (17) are passed. Expediently, the gas supply (20) is located in the region of the cloud of vapor between the target material (19) and the cooling roller (18). The now doubly coated substrate (11) now leaves the chamber part (17) to finally be wound up on the take-up roll (21). In order to apply on the substrate (11) now the third layer, the reflective layer c) of a metal, various procedures can be used. The vacuum chamber (10) is vented and the take-up roll (21) can be removed from the vacuum chamber (10) and placed in the same vacuum chamber at the location of the supply roll (12) and, after evacuation and, subsequently, sputtering the now twice coated substrate (11) with the other, the reflective layer c), are applied. Thereafter, the vacuum chamber (10) vented and that with the security features coated substrate (11) are removed. The substrate can also be removed for coating with the reflective layer c) from a metal of the first vacuum chamber and fed to another vacuum chamber and coated there.

However, as described, the substrate (11) may be unwound from the supply roll (12) and coated with the layers a) and b). The twice-coated substrate (11) is wound on the take-up roll (21) to then reverse the running direction of the twice-coated substrate (11). In some cases, once again an Al _x O _y coating can take place in the chamber part (17), wherein the layer b) is further reinforced. In the chamber part (16), in the sputtering device (15), the metal to be vaporized for the layer a) has been replaced by another metal, namely that of the layer c), or a sputtering device arranged in parallel has been activated and the reflecting one becomes Layer of metal c) in the same manner as layer a), but usually in a considerable greater thickness on the layer b), the Al _x O _y , deposited and then the substrate (11) on the supply roll (12) is wound up again. As a result, the vacuum chamber (10) is vented and the coated with the security features substrate (11).

Claims

claims

1. Substrates equipped with optically detectable security features, comprising a plastic film and deposited thereon a semitransparent metal layer, at least one dielectric layer and a reflective layer made of metal,

characterized in that

on one side of the substrate the layer sequence a) a semitransparent layer of titanium, vanadium, chromium, iron, cobalt, nickel, copper, rhodium, palladium, silver, tin, zinc, tungsten, platinum or gold or alloys thereof or of mixtures thereof, b) a layer of Al _x O _y , where x: y = 0, 5 to 1, and c) a reflective layer of a metal, is deposited.

2. With optically perceptible security features equipped substrates according to claim 1, characterized in that the semitransparent layer a) of chromium and / or copper, preferably of chromium.

3. Substrates equipped with optically perceptible security features according to claims 1 and 2, characterized in that layer c) comprises a reflective layer containing or consisting of aluminum, titanium, vanadium, chromium, iron, cobalt, nickel, copper, rhodium, palladium,

Silver, tin, zinc, tungsten, platinum or gold, or mixtures or alloys thereof, and wherein aluminum is preferred.

4. substrates with optically perceptible security features according to claims 1 to 3, characterized in that a) the semitransparent layer has a thickness of 2 to 50 nm, b) the layer of Al _x Oy, a thickness of 20 to 1000 nm, and c) the reflective layer of a metal has a thickness of 20 to 200 nm.

5. Substrates equipped with visually perceptible security features, according to claims 1 to 4, comprising a plastic film and deposited thereon a semitransparent layer of metal, at least one dielectric layer and a reflective layer of metal,

characterized in that

on one side of the substrate, the layer sequence a) a semitransparent layer of chromium with an optical transparency, with the substrate, from 30 to 55% at a light wavelength of 550 nm, b) a layer of Al _x Oy, where x: y = 0 Is 5 to 1, in a thickness of 120 to 750 nm, wherein the light absorption of the layer b) is less than 15% in the wavelength range of 420 to 800 nm, and c) a reflective layer of aluminum, ruthenium and / or silver an optical density OD of greater than 0.7 at a wavelength of 550 nm.

6. With visually perceptible security features equipped substrates according to claims 1 to 5, characterized in that layer b) of AI _x Oy, where x: y = 0.6 to 0.7 and preferably x = 2 and y = 3.

7. Equipped with optically perceptible security features substrates according to claims 1 to 6, characterized in that on one side of the substrate, the layer sequence a) the semi-transparent layer, b) the layer made of Al _x O _y, and c) the reflective layer is deposited and partially the layers a), b) and c) are removed in the form of a pattern.

8. With visually perceptible security features equipped substrates according to claims 1 to 7, characterized in that on one side of the substrate, the layer sequence a) the semitransparent layer, b) the layer of Al _x Oy ₁ and c) the reflective layer is deposited and on the layer c) a layer d) is arranged.

9. substrates equipped with optically perceptible security features according to claim 8, characterized in that the layer d) a plastic layer, a plastic film, a plastic film composite, a metal foil, a paper or a combination of two or more of

Materials is.

10. A process for the production of visually perceptible security features substrates according to claim 1,

characterized in that

a substrate is subjected to coating treatments in at least one vacuum chamber under vacuum conditions at least two evaporation devices, wherein the substrate by means of a first evaporation device with a) a semitransparent layer of titanium, vanadium, chromium, iron, cobalt, nickel, copper, rhodium, palladium, Applied to silver, tin, zinc, tungsten, platinum or gold or alloys thereof or from mixtures thereof, by means of a second evaporation device with b) an AI _x Oy - layer applied and by another

Evaporation process c) is applied to a reflective layer of a metal.

1 1. The method according to claim 10, characterized in that the substrate is exposed in a vacuum chamber under vacuum conditions, the coating treatments of two evaporation devices, wherein the substrate by means of a first evaporation device with a) the semi- transparent layer of titanium, vanadium, chromium, iron, cobalt, nickel, copper, rhodium, palladium, silver, tin, zinc, tungsten, platinum or gold or alloys thereof or mixtures thereof, applied by means of a second evaporation device with b) the AI _x O _y - layer acted upon and in a further vacuum chamber under vacuum conditions by a further evaporation process with the further layer c), the reflective layer of a metal, is applied.

12. The method according to claim 10, characterized in that the substrate is exposed in a vacuum chamber under vacuum conditions the Beschichtungsbe- actions of two evaporators, wherein the substrate by means of a first evaporation device with a) the semitransparent layer of titanium, vanadium, chromium, iron, Cobalt, nickel, copper, rhodium, palladium, silver, tin, zinc, tungsten, platinum or gold or alloys thereof or mixtures thereof, acted upon by a second evaporation device with b) of the Al _x O _y - layer applied and by another Evaporation process in the vacuum chamber under vacuum conditions, the further layer c), the reflective layer of a metal, is applied.

13. The method according to claim 12, characterized in that the substrate acted upon by the layer a) and the layer b) in the further evaporation process in the vacuum chamber under vacuum conditions in at least one of the evaporation devices with the layer c), the reflective layer of a metal, is charged.

14. The method according to claims 10 to 13, characterized in that the substrate is subjected to the coating treatments in at least one vacuum chamber under vacuum conditions at least two evaporation devices, wherein the substrate by means of an electron beam gun as the first evaporation device with a) a semitransparent layer of chromium is charged.

15. A process for the production of visually perceptible security features substrates according to claim 5,

characterized in that

a substrate is subjected to the coating treatments in at least one vacuum chamber under vacuum conditions at least two evaporation devices, wherein the substrate is applied in a first evaporator by evaporation of chromium by electron beam with a) a semitransparent layer of chromium, so that the optical transparency of the semitransparent layer with the Substrate of 30 to 55% is maintained at a light wavelength of 550 nm, in a second evaporation device by evaporation of aluminum by electron beam with the addition of oxygen gas with b) an AI _x Oy - layer is applied and by another evaporation method, by electron beam or thermally , with aluminum, ruthenium or silver to an optical density of greater than 0.7 at a wavelength of 550 nm with c) a reflective layer is applied.

16. The method according to claims 10 to 15, characterized in that the substrate is exposed to the coating treatments and with the layers a), b) and c) is applied and then partially removed the layers a), b) and c) to form a pattern , etched away in particular by an etching treatment.

17. The method according to claims 10 to 16, characterized in that the substrate on one side with the a) the semitransparent layer, b) the layer of Al _x Oy, and c) applied to the reflective layer and on the layer c) a layer d), preferably a plastic layer, a plastic film, a plastic film composite, a metal foil, a paper or a combination of two or more of the materials is applied.

18. Trademarks, tamper evidence, anti-counterfeiting, markings, packaging, packaging materials, seals, banderoles, seals, securities, banknotes, identity cards, lottery tickets, access cards, tickets, prepaid cards, travel and air tickets, using at least one substrate according to claim 1 or claim 5 ,

19. Banknotes using a substrate according to claim 1 or claim 5.