WO2008035961A3 - Device for electrochemically depositing a material on a plateshaped substrate - Google Patents

Device for electrochemically depositing a material on a plateshaped substrate Download PDF

Info

Publication number
WO2008035961A3
WO2008035961A3 PCT/NL2007/000229 NL2007000229W WO2008035961A3 WO 2008035961 A3 WO2008035961 A3 WO 2008035961A3 NL 2007000229 W NL2007000229 W NL 2007000229W WO 2008035961 A3 WO2008035961 A3 WO 2008035961A3
Authority
WO
WIPO (PCT)
Prior art keywords
substrate
electrolytic solution
electrolytic
electrolytic bath
plateshaped
Prior art date
Application number
PCT/NL2007/000229
Other languages
French (fr)
Other versions
WO2008035961A2 (en
Inventor
Johannes Cornelis Oddens
Peter Jacobus Gerardu Loermans
Original Assignee
Meco Equip Eng
Johannes Cornelis Oddens
Peter Jacobus Gerardu Loermans
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Meco Equip Eng, Johannes Cornelis Oddens, Peter Jacobus Gerardu Loermans filed Critical Meco Equip Eng
Publication of WO2008035961A2 publication Critical patent/WO2008035961A2/en
Publication of WO2008035961A3 publication Critical patent/WO2008035961A3/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/001—Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/02—Electroplating of selected surface areas
    • C25D5/022—Electroplating of selected surface areas using masking means
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/08—Electroplating with moving electrolyte e.g. jet electroplating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/241—Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus

Abstract

The invention provides a device for electrochemically depositing a material on at least one side of a plate-shaped substrate having a circumferential edge, said device comprising an electrolytic bath with an electrolytic solution therein, which electrolytic bath has at least one inlet opening and at least one outlet opening for feeding and discharging the electrolytic solution to and from the electrolytic bath, respectively, a substrate holder for positioning the substrate in the electrolytic bath such that the substrate is connected as a cathode, an anode arranged in the electrolytic solution opposite the substrate, and a screening member between the anode and the substrate for screening the substrate locally at the circumferential edge of the substrate. The screening member is tubular is shape, while at least one flow passage is provided in the wall of the tubular screening member, which passage can serve as the inlet opening or as the outlet opening for the electrolytic solution.
PCT/NL2007/000229 2006-09-19 2007-09-17 Device for electrochemically depositing a material on a plateshaped substrate WO2008035961A2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
NL1032540A NL1032540C2 (en) 2006-09-19 2006-09-19 Device for the electrolytic deposition of material on a plate-shaped substrate.
NL1032540 2006-09-19

Publications (2)

Publication Number Publication Date
WO2008035961A2 WO2008035961A2 (en) 2008-03-27
WO2008035961A3 true WO2008035961A3 (en) 2008-08-14

Family

ID=37891733

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/NL2007/000229 WO2008035961A2 (en) 2006-09-19 2007-09-17 Device for electrochemically depositing a material on a plateshaped substrate

Country Status (3)

Country Link
NL (1) NL1032540C2 (en)
TW (1) TW200833878A (en)
WO (1) WO2008035961A2 (en)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5932077A (en) * 1998-02-09 1999-08-03 Reynolds Tech Fabricators, Inc. Plating cell with horizontal product load mechanism
US20040154927A1 (en) * 2001-03-02 2004-08-12 Paul Silinger Internal heat spreader plating methods and devices
WO2004081261A2 (en) * 2003-03-11 2004-09-23 Ebara Corporation Plating apparatus

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5932077A (en) * 1998-02-09 1999-08-03 Reynolds Tech Fabricators, Inc. Plating cell with horizontal product load mechanism
US20040154927A1 (en) * 2001-03-02 2004-08-12 Paul Silinger Internal heat spreader plating methods and devices
WO2004081261A2 (en) * 2003-03-11 2004-09-23 Ebara Corporation Plating apparatus

Also Published As

Publication number Publication date
TW200833878A (en) 2008-08-16
NL1032540C2 (en) 2008-03-20
WO2008035961A2 (en) 2008-03-27

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