WO2008051351A3 - Sacrificial spacer process and resultant structure for mems support structure - Google Patents

Sacrificial spacer process and resultant structure for mems support structure Download PDF

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Publication number
WO2008051351A3
WO2008051351A3 PCT/US2007/021046 US2007021046W WO2008051351A3 WO 2008051351 A3 WO2008051351 A3 WO 2008051351A3 US 2007021046 W US2007021046 W US 2007021046W WO 2008051351 A3 WO2008051351 A3 WO 2008051351A3
Authority
WO
WIPO (PCT)
Prior art keywords
mems
movable mirror
support structure
sidewall spacer
sacrificial spacer
Prior art date
Application number
PCT/US2007/021046
Other languages
French (fr)
Other versions
WO2008051351A2 (en
Inventor
Ren Gregory David U
Original Assignee
Qualcomm Mems Technologies Inc
Ren Gregory David U
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Qualcomm Mems Technologies Inc, Ren Gregory David U filed Critical Qualcomm Mems Technologies Inc
Publication of WO2008051351A2 publication Critical patent/WO2008051351A2/en
Publication of WO2008051351A3 publication Critical patent/WO2008051351A3/en

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Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B81MICROSTRUCTURAL TECHNOLOGY
    • B81BMICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B3/00Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
    • B81B3/0064Constitution or structural means for improving or controlling the physical properties of a device
    • B81B3/0067Mechanical properties
    • B81B3/0072For controlling internal stress or strain in moving or flexible elements, e.g. stress compensating layers
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B26/00Optical devices or arrangements for the control of light using movable or deformable optical elements
    • G02B26/001Optical devices or arrangements for the control of light using movable or deformable optical elements based on interference in an adjustable optical cavity
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B81MICROSTRUCTURAL TECHNOLOGY
    • B81BMICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2201/00Specific applications of microelectromechanical systems
    • B81B2201/04Optical MEMS
    • B81B2201/047Optical MEMS not provided for in B81B2201/042 - B81B2201/045
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B81MICROSTRUCTURAL TECHNOLOGY
    • B81BMICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2203/00Basic microelectromechanical structures
    • B81B2203/01Suspended structures, i.e. structures allowing a movement
    • B81B2203/0109Bridges
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B81MICROSTRUCTURAL TECHNOLOGY
    • B81BMICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2203/00Basic microelectromechanical structures
    • B81B2203/05Type of movement
    • B81B2203/053Translation according to an axis perpendicular to the substrate
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B81MICROSTRUCTURAL TECHNOLOGY
    • B81CPROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2201/00Manufacture or treatment of microstructural devices or systems
    • B81C2201/01Manufacture or treatment of microstructural devices or systems in or on a substrate
    • B81C2201/0161Controlling physical properties of the material
    • B81C2201/0163Controlling internal stress of deposited layers
    • B81C2201/017Methods for controlling internal stress of deposited layers not provided for in B81C2201/0164 - B81C2201/0169

Abstract

Disclosed is a microelectromechanical systems (MEMS) device and method of manufacturing the same. MEMS such as an interferometric modulator include a sidewall spacer (844) formed adjacent to a movable mirror (840). The sidewall spacer (844) may be a sacrificial spacer that is removed during fabrication, or it may remain in the final product. Increased clearance (885) is provided between the movable mirror (840) and a support structure (880) during actuation of the movable mirror (840), thereby avoiding contact during operation of the interferometric modulator. The deformable layer (870) may be deposited in a more continuous fashion over the contour of a lower layer as determined by the contour of the sidewall spacer (844), resulting in a stronger and more resilient deformable layer (870).
PCT/US2007/021046 2006-10-19 2007-09-28 Sacrificial spacer process and resultant structure for mems support structure WO2008051351A2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US11/583,575 US7545552B2 (en) 2006-10-19 2006-10-19 Sacrificial spacer process and resultant structure for MEMS support structure
US11/583,575 2006-10-19

Publications (2)

Publication Number Publication Date
WO2008051351A2 WO2008051351A2 (en) 2008-05-02
WO2008051351A3 true WO2008051351A3 (en) 2008-07-03

Family

ID=39278310

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2007/021046 WO2008051351A2 (en) 2006-10-19 2007-09-28 Sacrificial spacer process and resultant structure for mems support structure

Country Status (2)

Country Link
US (1) US7545552B2 (en)
WO (1) WO2008051351A2 (en)

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US7625825B2 (en) * 2007-06-14 2009-12-01 Qualcomm Mems Technologies, Inc. Method of patterning mechanical layer for MEMS structures
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