WO2008051838A3 - Portable memory devices and method therefor - Google Patents

Portable memory devices and method therefor Download PDF

Info

Publication number
WO2008051838A3
WO2008051838A3 PCT/US2007/081924 US2007081924W WO2008051838A3 WO 2008051838 A3 WO2008051838 A3 WO 2008051838A3 US 2007081924 W US2007081924 W US 2007081924W WO 2008051838 A3 WO2008051838 A3 WO 2008051838A3
Authority
WO
WIPO (PCT)
Prior art keywords
integrated circuit
circuit products
test contacts
memory devices
method therefor
Prior art date
Application number
PCT/US2007/081924
Other languages
French (fr)
Other versions
WO2008051838A2 (en
Inventor
Warren Middlekauff
Robert Miller
Charlie Centofante
Original Assignee
Sandisk Corp
Warren Middlekauff
Robert Miller
Charlie Centofante
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US11/551,402 external-priority patent/US7928010B2/en
Priority claimed from US11/551,423 external-priority patent/US8013332B2/en
Application filed by Sandisk Corp, Warren Middlekauff, Robert Miller, Charlie Centofante filed Critical Sandisk Corp
Priority to KR1020097010131A priority Critical patent/KR101121422B1/en
Priority to CN2007800390316A priority patent/CN101542507B/en
Publication of WO2008051838A2 publication Critical patent/WO2008051838A2/en
Publication of WO2008051838A3 publication Critical patent/WO2008051838A3/en

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0266—Marks, test patterns or identification means
    • H05K1/0268—Marks, test patterns or identification means for electrical inspection or testing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0266—Marks, test patterns or identification means
    • H05K1/0269—Marks, test patterns or identification means for visual or optical inspection
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10159—Memory
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16—Inspection; Monitoring; Aligning
    • H05K2203/161—Using chemical substances, e.g. colored or fluorescent, for facilitating optical or visual inspection
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components

Abstract

Improved techniques to produce integrated circuit products are disclosed. The improved techniques permit smaller and less costly production of integrated circuit products. One aspect of the invention concerns covering test contacts (e.g., test pins) provided with the integrated circuit products using printed ink. Once covered with the ink, the test contacts are no longer electrically exposed. Hence, the integrated circuit products are not susceptible to accidental access or electrostatic discharge. Moreover, the integrated circuit products can be efficiently produced in a small form factor without any need for additional packaging or labels to electrically isolate the test contacts.
PCT/US2007/081924 2006-10-20 2007-10-19 Portable memory devices and method therefor WO2008051838A2 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
KR1020097010131A KR101121422B1 (en) 2006-10-20 2007-10-19 Portable memory devices and method therefor
CN2007800390316A CN101542507B (en) 2006-10-20 2007-10-19 Portable memory devices and method therefor

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US11/551,423 2006-10-20
US11/551,402 US7928010B2 (en) 2006-10-20 2006-10-20 Method for producing portable memory devices
US11/551,423 US8013332B2 (en) 2006-10-20 2006-10-20 Portable memory devices
US11/551,402 2006-10-20

Publications (2)

Publication Number Publication Date
WO2008051838A2 WO2008051838A2 (en) 2008-05-02
WO2008051838A3 true WO2008051838A3 (en) 2008-06-12

Family

ID=39267447

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2007/081924 WO2008051838A2 (en) 2006-10-20 2007-10-19 Portable memory devices and method therefor

Country Status (3)

Country Link
KR (1) KR101121422B1 (en)
TW (1) TWI407860B (en)
WO (1) WO2008051838A2 (en)

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4713298A (en) * 1985-03-15 1987-12-15 M&T Chemicals Inc. Printed circuit boards having improved adhesion between solder mask and metal
EP0581284A2 (en) * 1992-07-30 1994-02-02 Mitsubishi Denki Kabushiki Kaisha Non-contact IC card and manufacturing and testing methods of the same
US5512712A (en) * 1993-10-14 1996-04-30 Ibiden Co., Ltd. Printed wiring board having indications thereon covered by insulation
US20020131251A1 (en) * 2001-03-16 2002-09-19 Corisis David J. Semiconductor card and method of fabrication
US20040259291A1 (en) * 2003-06-23 2004-12-23 Sandisk Corporation Method for efficiently producing removable peripheral cards
US20050013106A1 (en) * 2003-07-17 2005-01-20 Takiar Hem P. Peripheral card with hidden test pins
WO2005091811A2 (en) * 2004-03-03 2005-10-06 Markem Corporation Jettable ink
EP1624001A1 (en) * 2003-05-09 2006-02-08 Taiyo Ink Manufacturing Co. Ltd Photocuring/thermosetting inkjet composition and printed wiring board using same

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4649009B2 (en) * 2000-03-08 2011-03-09 株式会社東芝 Information processing apparatus having a card interface, card-type electronic equipment that can be mounted on the apparatus, and operation mode setting method in the apparatus
TWI283831B (en) * 2001-02-28 2007-07-11 Elpida Memory Inc Electronic apparatus and its manufacturing method
US7410240B2 (en) * 2004-03-04 2008-08-12 Fujifilm Corporation Inkjet recording head and inkjet recording apparatus
US20060020469A1 (en) * 2004-07-08 2006-01-26 Rast Rodger H Apparatus and methods for static and semi-static displays
KR100761991B1 (en) 2006-11-06 2007-09-28 (주) 한맥 Eng Rfid tag for sealing using slot antenna

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4713298A (en) * 1985-03-15 1987-12-15 M&T Chemicals Inc. Printed circuit boards having improved adhesion between solder mask and metal
EP0581284A2 (en) * 1992-07-30 1994-02-02 Mitsubishi Denki Kabushiki Kaisha Non-contact IC card and manufacturing and testing methods of the same
US5512712A (en) * 1993-10-14 1996-04-30 Ibiden Co., Ltd. Printed wiring board having indications thereon covered by insulation
US20020131251A1 (en) * 2001-03-16 2002-09-19 Corisis David J. Semiconductor card and method of fabrication
EP1624001A1 (en) * 2003-05-09 2006-02-08 Taiyo Ink Manufacturing Co. Ltd Photocuring/thermosetting inkjet composition and printed wiring board using same
US20040259291A1 (en) * 2003-06-23 2004-12-23 Sandisk Corporation Method for efficiently producing removable peripheral cards
US20050013106A1 (en) * 2003-07-17 2005-01-20 Takiar Hem P. Peripheral card with hidden test pins
WO2005091811A2 (en) * 2004-03-03 2005-10-06 Markem Corporation Jettable ink

Also Published As

Publication number Publication date
TWI407860B (en) 2013-09-01
KR101121422B1 (en) 2012-03-22
TW200835413A (en) 2008-08-16
KR20090086220A (en) 2009-08-11
WO2008051838A2 (en) 2008-05-02

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