WO2008058200A3 - Method and apparatus for electrochemical mechanical polishing nip substrates - Google Patents

Method and apparatus for electrochemical mechanical polishing nip substrates Download PDF

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Publication number
WO2008058200A3
WO2008058200A3 PCT/US2007/083956 US2007083956W WO2008058200A3 WO 2008058200 A3 WO2008058200 A3 WO 2008058200A3 US 2007083956 W US2007083956 W US 2007083956W WO 2008058200 A3 WO2008058200 A3 WO 2008058200A3
Authority
WO
WIPO (PCT)
Prior art keywords
mechanical polishing
electrochemical mechanical
polishing
polishing nip
nip substrates
Prior art date
Application number
PCT/US2007/083956
Other languages
French (fr)
Other versions
WO2008058200A2 (en
Inventor
Yuzhuo Li
Original Assignee
St Lawrence Nanotechnology Inc
Yuzhuo Li
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by St Lawrence Nanotechnology Inc, Yuzhuo Li filed Critical St Lawrence Nanotechnology Inc
Priority to US12/514,142 priority Critical patent/US20100059390A1/en
Publication of WO2008058200A2 publication Critical patent/WO2008058200A2/en
Publication of WO2008058200A3 publication Critical patent/WO2008058200A3/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/046—Lapping machines or devices; Accessories designed for working plane surfaces using electric current
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
    • G11B5/84—Processes or apparatus specially adapted for manufacturing record carriers
    • G11B5/8404—Processes or apparatus specially adapted for manufacturing record carriers manufacturing base layers

Abstract

The present invention relates to an apparatus and a method of electrochemical mechanical polishing (ECMP) for microelectronics applications. The apparatus and method of electrochemical mechanical polishing can be used planarize NiP substrate for a magnetic storage medium and for a process which allows polishing with a controlled surface finish, and a set of corresponding polishing electrolytes and slurry.
PCT/US2007/083956 2006-11-08 2007-11-07 Method and apparatus for electrochemical mechanical polishing nip substrates WO2008058200A2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US12/514,142 US20100059390A1 (en) 2006-11-08 2007-11-07 METHOD AND APARATUS FOR ELECTROCHEMICAL MECHANICAL POLISHING NiP SUBSTRATES

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US86481206P 2006-11-08 2006-11-08
US60/864,812 2006-11-08

Publications (2)

Publication Number Publication Date
WO2008058200A2 WO2008058200A2 (en) 2008-05-15
WO2008058200A3 true WO2008058200A3 (en) 2008-10-09

Family

ID=39365351

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2007/083956 WO2008058200A2 (en) 2006-11-08 2007-11-07 Method and apparatus for electrochemical mechanical polishing nip substrates

Country Status (3)

Country Link
US (1) US20100059390A1 (en)
CN (1) CN101573212A (en)
WO (1) WO2008058200A2 (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5617387B2 (en) * 2010-07-06 2014-11-05 富士電機株式会社 Method for manufacturing substrate for perpendicular magnetic recording medium, and substrate for perpendicular magnetic recording medium manufactured by the manufacturing method
CN102051665B (en) * 2011-01-04 2014-02-26 安徽工业大学 Polishing solution for electrochemical mechanical polishing of hard disk NiP
CN102407482A (en) * 2011-04-29 2012-04-11 上海华力微电子有限公司 Method for adjusting metal grinding speed and overcoming defects in grinding process
ES2604830B1 (en) * 2016-04-28 2017-12-18 Drylyte, S.L. Process for smoothing and polishing metals by ionic transport by means of free solid bodies, and solid bodies to carry out said process.
CN106670899B (en) * 2016-10-28 2019-03-15 中国电子科技集团公司第五十四研究所 A kind of gasbag-type electrochemical mechanical polishing head, burnishing device and polishing method
US10967478B2 (en) 2017-09-29 2021-04-06 Taiwan Semiconductor Manufacturing Company, Ltd. Chemical mechanical polishing apparatus and method

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6250995B1 (en) * 1998-02-27 2001-06-26 Speedfam Co., Ltd. Apparatus for polishing outer periphery of workpiece
US6261433B1 (en) * 1998-04-21 2001-07-17 Applied Materials, Inc. Electro-chemical deposition system and method of electroplating on substrates
US6811467B1 (en) * 2002-09-09 2004-11-02 Seagate Technology Llc Methods and apparatus for polishing glass substrates
US6896875B2 (en) * 1990-04-02 2005-05-24 Bracco International B.V. Mixable combination for generating a suspension of stable microbubbles for ultrasonic imaging
US6957511B1 (en) * 1999-11-12 2005-10-25 Seagate Technology Llc Single-step electromechanical mechanical polishing on Ni-P plated discs

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6896875B2 (en) * 1990-04-02 2005-05-24 Bracco International B.V. Mixable combination for generating a suspension of stable microbubbles for ultrasonic imaging
US6250995B1 (en) * 1998-02-27 2001-06-26 Speedfam Co., Ltd. Apparatus for polishing outer periphery of workpiece
US6261433B1 (en) * 1998-04-21 2001-07-17 Applied Materials, Inc. Electro-chemical deposition system and method of electroplating on substrates
US6957511B1 (en) * 1999-11-12 2005-10-25 Seagate Technology Llc Single-step electromechanical mechanical polishing on Ni-P plated discs
US6811467B1 (en) * 2002-09-09 2004-11-02 Seagate Technology Llc Methods and apparatus for polishing glass substrates

Also Published As

Publication number Publication date
CN101573212A (en) 2009-11-04
US20100059390A1 (en) 2010-03-11
WO2008058200A2 (en) 2008-05-15

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