WO2008063216A3 - Light emitting diode assembly and method of fabrication - Google Patents

Light emitting diode assembly and method of fabrication Download PDF

Info

Publication number
WO2008063216A3
WO2008063216A3 PCT/US2007/011187 US2007011187W WO2008063216A3 WO 2008063216 A3 WO2008063216 A3 WO 2008063216A3 US 2007011187 W US2007011187 W US 2007011187W WO 2008063216 A3 WO2008063216 A3 WO 2008063216A3
Authority
WO
WIPO (PCT)
Prior art keywords
led
light emitting
lens
area
fabrication
Prior art date
Application number
PCT/US2007/011187
Other languages
French (fr)
Other versions
WO2008063216A2 (en
Inventor
Yi-Qun Li
Yi Dong
Wei Shan
Original Assignee
Intematix Corp
Yi-Qun Li
Yi Dong
Wei Shan
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Intematix Corp, Yi-Qun Li, Yi Dong, Wei Shan filed Critical Intematix Corp
Priority to EP07794684A priority Critical patent/EP2098099A4/en
Priority to JP2009536220A priority patent/JP2010509769A/en
Priority to CN2007800494565A priority patent/CN101653039B/en
Publication of WO2008063216A2 publication Critical patent/WO2008063216A2/en
Publication of WO2008063216A3 publication Critical patent/WO2008063216A3/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H01L33/54—Encapsulations having a particular shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50—Wavelength conversion elements

Abstract

An LED assembly including an array of LEDs and lens disposed adjacent light emitting surfaces of the LEDs. The area of a cross-section of the lens projected onto the light emitting surface of the LED is substantially equal to or less than the area of the LED's light emitting surface. At least one lens is associated with each LED and the area of a cross-section of each lens projected onto the light emitting surface of its associated LED is substantially equal to or less than the surface area thereof. A phosphor may be included to absorb at least a portion of the light emitted from the LED to emit light at a second wavelength which may be combined with the light from the LED. Lithography may be used to fabricate the lens array in the same process flow used to generate the LED.
PCT/US2007/011187 2006-11-09 2007-05-08 Light emitting diode assembly and method of fabrication WO2008063216A2 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
EP07794684A EP2098099A4 (en) 2006-11-09 2007-05-08 Light emitting diode assembly and method of fabrication
JP2009536220A JP2010509769A (en) 2006-11-09 2007-05-08 Light emitting diode assembly and manufacturing method
CN2007800494565A CN101653039B (en) 2006-11-09 2007-05-08 Light emitting diode assembly and method of fabrication

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US85821106P 2006-11-09 2006-11-09
US60/858,211 2006-11-09
US11/800,977 US7737636B2 (en) 2006-11-09 2007-05-07 LED assembly with an LED and adjacent lens and method of making same
US11/800,977 2007-05-07

Publications (2)

Publication Number Publication Date
WO2008063216A2 WO2008063216A2 (en) 2008-05-29
WO2008063216A3 true WO2008063216A3 (en) 2008-10-30

Family

ID=39368374

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2007/011187 WO2008063216A2 (en) 2006-11-09 2007-05-08 Light emitting diode assembly and method of fabrication

Country Status (5)

Country Link
US (1) US7737636B2 (en)
EP (1) EP2098099A4 (en)
JP (1) JP2010509769A (en)
KR (1) KR20090082469A (en)
WO (1) WO2008063216A2 (en)

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US8098277B1 (en) 2005-12-02 2012-01-17 Intellectual Ventures Holding 67 Llc Systems and methods for communication between a reactive video system and a mobile communication device
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JP5430572B2 (en) 2007-09-14 2014-03-05 インテレクチュアル ベンチャーズ ホールディング ６７ エルエルシー Gesture-based user interaction processing
KR101361575B1 (en) * 2007-09-17 2014-02-13 삼성전자주식회사 Light Emitting Diode package and method of manufacturing the same
US8159682B2 (en) * 2007-11-12 2012-04-17 Intellectual Ventures Holding 67 Llc Lens system
EP2218114A4 (en) 2007-11-30 2014-12-24 Univ California High light extraction efficiency nitride based light emitting diode by surface roughening
US20100039500A1 (en) * 2008-02-15 2010-02-18 Matthew Bell Self-Contained 3D Vision System Utilizing Stereo Camera and Patterned Illuminator
US8259163B2 (en) 2008-03-07 2012-09-04 Intellectual Ventures Holding 67 Llc Display with built in 3D sensing
US8595218B2 (en) 2008-06-12 2013-11-26 Intellectual Ventures Holding 67 Llc Interactive display management systems and methods
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US20110089447A1 (en) * 2009-10-19 2011-04-21 Wu-Cheng Kuo Light-emiting device chip with micro-lenses and method for fabricating the same
KR20110043864A (en) * 2009-10-22 2011-04-28 포항공과대학교 산학협력단 Color mixing lens and liquid crystal display having the same
WO2011109442A2 (en) * 2010-03-02 2011-09-09 Oliver Steven D Led packaging with integrated optics and methods of manufacturing the same
CN101814572A (en) * 2010-03-05 2010-08-25 矽畿科技股份有限公司 Optical diode packaging structure
KR20130066637A (en) * 2010-05-27 2013-06-20 오스람 실바니아 인코포레이티드 Light emitting diode light source including all nitride light emitting diodes
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US8534901B2 (en) 2010-09-13 2013-09-17 Teledyne Reynolds, Inc. Collimating waveguide apparatus and method
US8608328B2 (en) 2011-05-06 2013-12-17 Teledyne Technologies Incorporated Light source with secondary emitter conversion element
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US9115865B1 (en) 2012-06-19 2015-08-25 Forever Gifts, Inc. Lighting device having light-distributing void
US20140307431A1 (en) * 2013-04-16 2014-10-16 Xeralux, Inc. Field Configurable Industrial LED Light Fixture
DE102013209919A1 (en) * 2013-05-28 2014-12-04 Osram Opto Semiconductors Gmbh Optoelectronic component with a housing with several openings
US20150133753A1 (en) * 2013-11-14 2015-05-14 General Electric Company Arrays of emitters for pulse oximetry devices and methods of making the same
US9465175B2 (en) * 2014-07-23 2016-10-11 Sifotonics Technologies Co., Ltd. Integrated lens-array-on-substrate for optical coupling system and fabrication method thereof
US10066160B2 (en) 2015-05-01 2018-09-04 Intematix Corporation Solid-state white light generating lighting arrangements including photoluminescence wavelength conversion components
US20180073686A1 (en) * 2016-09-14 2018-03-15 Osram Sylvania Inc. Solid state lighting device with electronically adjustable light beam distribution
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Also Published As

Publication number Publication date
EP2098099A2 (en) 2009-09-09
KR20090082469A (en) 2009-07-30
US20080111141A1 (en) 2008-05-15
WO2008063216A2 (en) 2008-05-29
EP2098099A4 (en) 2012-10-10
JP2010509769A (en) 2010-03-25
US7737636B2 (en) 2010-06-15

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