WO2008078235A3 - Light-emitting apparatus with shaped wavelength converter - Google Patents

Light-emitting apparatus with shaped wavelength converter Download PDF

Info

Publication number
WO2008078235A3
WO2008078235A3 PCT/IB2007/055109 IB2007055109W WO2008078235A3 WO 2008078235 A3 WO2008078235 A3 WO 2008078235A3 IB 2007055109 W IB2007055109 W IB 2007055109W WO 2008078235 A3 WO2008078235 A3 WO 2008078235A3
Authority
WO
WIPO (PCT)
Prior art keywords
light
emitting apparatus
ceramic body
wavelength converter
shaped wavelength
Prior art date
Application number
PCT/IB2007/055109
Other languages
French (fr)
Other versions
WO2008078235A2 (en
Inventor
Joseph L A M Sormani
Egbert Lenderink
Matthias D Epmeier
Aldegonda L Weijers
Original Assignee
Koninkl Philips Electronics Nv
Philips Intellectual Property
Joseph L A M Sormani
Egbert Lenderink
Matthias D Epmeier
Aldegonda L Weijers
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Koninkl Philips Electronics Nv, Philips Intellectual Property, Joseph L A M Sormani, Egbert Lenderink, Matthias D Epmeier, Aldegonda L Weijers filed Critical Koninkl Philips Electronics Nv
Priority to US12/519,439 priority Critical patent/US8410500B2/en
Priority to KR1020097014974A priority patent/KR101484461B1/en
Priority to CN200780047604XA priority patent/CN101569020B/en
Priority to EP07849489.5A priority patent/EP2097935B1/en
Priority to JP2009542317A priority patent/JP2010514187A/en
Publication of WO2008078235A2 publication Critical patent/WO2008078235A2/en
Publication of WO2008078235A3 publication Critical patent/WO2008078235A3/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50—Wavelength conversion elements
    • H01L33/505—Wavelength conversion elements characterised by the shape, e.g. plate or foil
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B19/00—Condensers, e.g. light collectors or similar non-imaging optics
    • G02B19/0004—Condensers, e.g. light collectors or similar non-imaging optics characterised by the optical means employed
    • G02B19/0028—Condensers, e.g. light collectors or similar non-imaging optics characterised by the optical means employed refractive and reflective surfaces, e.g. non-imaging catadioptric systems
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B19/00—Condensers, e.g. light collectors or similar non-imaging optics
    • G02B19/0033—Condensers, e.g. light collectors or similar non-imaging optics characterised by the use
    • G02B19/0047—Condensers, e.g. light collectors or similar non-imaging optics characterised by the use for use with a light source
    • G02B19/0061—Condensers, e.g. light collectors or similar non-imaging optics characterised by the use for use with a light source the light source comprising a LED
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B2207/00—Coding scheme for general features or characteristics of optical elements and systems of subclass G02B, but not including elements and systems which would be classified in G02B6/00 and subgroups
    • G02B2207/113—Fluorescence
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements
    • H01L33/60—Reflective elements

Abstract

Proposed is a light-emitting apparatus 200,300,400, comprising a semiconductor light emitting device 220,320,420 and a transparent ceramic body 230,330,430 comprising a wavelength converting material positioned in light receiving relationship to the semiconductor device. The light-emitting apparatus is characterized in that the side surfaces 233,333,433 of the ceramic body 230,330,430 are at an oblique angle 234,334,434 relative its bottom surface 231,331,431. This is especially advantageous to unlock the wave-guide modes inside the body 230,330,430. Consequently the total flux emitted from the light-emitting apparatus 200,300,400 can be enhanced considerably. Alternatively, the brightness of the top surface 232,332,432 of the ceramic body 230,330,430 can be enhanced considerably.
PCT/IB2007/055109 2006-12-21 2007-12-14 Light-emitting apparatus with shaped wavelength converter WO2008078235A2 (en)

Priority Applications (5)

Application Number Priority Date Filing Date Title
US12/519,439 US8410500B2 (en) 2006-12-21 2007-12-14 Light-emitting apparatus with shaped wavelength converter
KR1020097014974A KR101484461B1 (en) 2006-12-21 2007-12-14 Light-emitting apparatus with shaped wavelength converter
CN200780047604XA CN101569020B (en) 2006-12-21 2007-12-14 Light-emitting apparatus with shaped wavelength converter
EP07849489.5A EP2097935B1 (en) 2006-12-21 2007-12-14 Light-emitting apparatus with shaped wavelength converter
JP2009542317A JP2010514187A (en) 2006-12-21 2007-12-14 Light emitting device having tangible wavelength converter

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP06126787.8 2006-12-21
EP06126787 2006-12-21

Publications (2)

Publication Number Publication Date
WO2008078235A2 WO2008078235A2 (en) 2008-07-03
WO2008078235A3 true WO2008078235A3 (en) 2008-08-21

Family

ID=39420349

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/IB2007/055109 WO2008078235A2 (en) 2006-12-21 2007-12-14 Light-emitting apparatus with shaped wavelength converter

Country Status (7)

Country Link
US (1) US8410500B2 (en)
EP (1) EP2097935B1 (en)
JP (1) JP2010514187A (en)
KR (1) KR101484461B1 (en)
CN (1) CN101569020B (en)
TW (1) TWI449206B (en)
WO (1) WO2008078235A2 (en)

Families Citing this family (31)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2010044240A1 (en) 2008-10-15 2010-04-22 株式会社小糸製作所 Light-emitting module, manufacturing method for light-emitting module, and light fixture unit
JPWO2010044239A1 (en) * 2008-10-17 2012-03-15 株式会社小糸製作所 Light emitting module, method for manufacturing light emitting module, and lamp unit
US8994051B2 (en) * 2008-11-28 2015-03-31 Koito Manufacturing Co., Ltd. Light emission module, light emission module manufacturing method, and lamp unit
CA2763244A1 (en) 2009-05-28 2010-12-02 Koninklijke Philips Electronics N.V. Illumination device and method for assembly of an illumination device
CN102449374B (en) * 2009-05-28 2016-05-11 皇家飞利浦电子股份有限公司 Ceramic illumination device
CA2763241C (en) 2009-05-28 2018-02-27 Koninklijke Philips Electronics N.V. Illumination device with an envelope enclosing a light source
US9300015B2 (en) 2010-05-04 2016-03-29 Dell Products Lp Systems and methods for monitoring and characterizing information handling system use behavior
JP2012033823A (en) * 2010-08-02 2012-02-16 Stanley Electric Co Ltd Light emitting device and method for manufacturing the same
KR20120024104A (en) * 2010-09-06 2012-03-14 서울옵토디바이스주식회사 Light emitting element
CN102130108A (en) * 2010-12-14 2011-07-20 黄金鹿 Transparent ceramic packaged light emitting diode (LED) light source
DE102011080179A1 (en) * 2011-08-01 2013-02-07 Osram Ag Wavelength conversion body and method for its production
US9335017B2 (en) 2011-12-20 2016-05-10 Stanley Electric Co., Ltd. Light emitting device that can realize reduction in thickness of vehicle light fitting, vehicle light fitting using the light emitting device and vehicle provided with the vehicle light
US9595636B2 (en) 2012-03-28 2017-03-14 Sensor Electronic Technology, Inc. Light emitting device substrate with inclined sidewalls
US10096742B2 (en) 2012-03-28 2018-10-09 Sensor Electronic Technology, Inc. Light emitting device substrate with inclined sidewalls
JP5816127B2 (en) * 2012-04-27 2015-11-18 株式会社東芝 Semiconductor light emitting device and manufacturing method thereof
JP6305999B2 (en) * 2012-08-24 2018-04-04 フィリップス ライティング ホールディング ビー ヴィ Light emitting assembly, lamp and lighting fixture
DE102013204291A1 (en) * 2013-03-12 2014-10-02 Osram Opto Semiconductors Gmbh Optoelectronic component
DE102013206133B4 (en) * 2013-04-08 2021-09-30 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Method for producing a conversion element and conversion element
DE102013107010A1 (en) * 2013-07-03 2015-01-22 Thyssenkrupp Steel Europe Ag Plant and method for hot rolling steel strip
WO2015004577A1 (en) * 2013-07-08 2015-01-15 Koninklijke Philips N.V. Wavelength converted semiconductor light emitting device
US10109774B2 (en) * 2013-08-20 2018-10-23 Lumileds Llc Shaped phosphor to reduce repeated reflections
JP2015056652A (en) * 2013-09-13 2015-03-23 株式会社東芝 Nitride semiconductor light-emitting device
CN105874616B (en) * 2014-01-02 2019-05-10 飞利浦照明控股有限公司 Luminaire including releasable wavelength shifter
JP6749240B2 (en) * 2014-01-09 2020-09-02 ルミレッズ ホールディング ベーフェー Light emitting device with reflective sidewalls
DE102014117440B3 (en) * 2014-11-27 2016-04-07 Seaborough IP IV BV Light emitting remote phosphor device
US9970629B2 (en) * 2015-10-19 2018-05-15 GE Lighting Solutions, LLC Remote phosphor lighting devices and methods
CN107123713B (en) * 2016-02-25 2019-12-27 上海芯元基半导体科技有限公司 Device structure suitable for monochromatic light LED wafer level packaging
US20180323354A1 (en) * 2017-05-07 2018-11-08 Yang Wang Light emitting device and method for manufacturing light emitting device
US11296262B2 (en) * 2017-12-21 2022-04-05 Lumileds Llc Monolithic segmented LED array architecture with reduced area phosphor emission surface
DE102018200023A1 (en) * 2018-01-02 2019-07-04 Osram Gmbh CONVERSION DEVICE WITH HISTORED LADDER STRUCTURE
EP3831911B1 (en) * 2019-12-05 2022-06-08 Friedrich-Alexander-Universität Erlangen-Nürnberg Composite wavelength converter

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040145308A1 (en) * 2002-10-22 2004-07-29 Osram Opto Semiconductors Gmbh Light source having an LED and a luminescence conversion body and method for producing the luminescence conversion body
US20040227148A1 (en) * 1997-06-03 2004-11-18 Camras Michael D. III-Phosphide and III-Arsenide flip chip light-emitting devices
US20050151141A1 (en) * 2003-10-31 2005-07-14 Osram Opto Semiconductors Gmbh Luminescence diode chip
US20050269582A1 (en) * 2004-06-03 2005-12-08 Lumileds Lighting, U.S., Llc Luminescent ceramic for a light emitting device
US20060091411A1 (en) * 2004-10-29 2006-05-04 Ouderkirk Andrew J High brightness LED package
US20060091784A1 (en) * 2004-10-29 2006-05-04 Conner Arlie R LED package with non-bonded optical element
WO2006103582A1 (en) * 2005-03-29 2006-10-05 Koninklijke Philips Electronics N.V. Wide emitting lens for led useful for backlighting

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3709827A (en) 1970-02-10 1973-01-09 F Auzel Fluorescent materials for optical frequency conversion
US6229160B1 (en) * 1997-06-03 2001-05-08 Lumileds Lighting, U.S., Llc Light extraction from a semiconductor light-emitting device via chip shaping
US6429583B1 (en) 1998-11-30 2002-08-06 General Electric Company Light emitting device with ba2mgsi2o7:eu2+, ba2sio4:eu2+, or (srxcay ba1-x-y)(a1zga1-z)2sr:eu2+phosphors
US6621211B1 (en) 2000-05-15 2003-09-16 General Electric Company White light emitting phosphor blends for LED devices
DE10148227B4 (en) * 2001-09-28 2015-03-05 Osram Opto Semiconductors Gmbh Radiation-emitting semiconductor chip, method for its production and radiation-emitting component
KR20040092512A (en) * 2003-04-24 2004-11-04 (주)그래픽테크노재팬 A semiconductor light emitting device with reflectors having a cooling function
US7009213B2 (en) 2003-07-31 2006-03-07 Lumileds Lighting U.S., Llc Light emitting devices with improved light extraction efficiency
JP2005079167A (en) 2003-08-28 2005-03-24 Kyocera Corp Light emitting element housing package and light emitting device
JP4140042B2 (en) 2003-09-17 2008-08-27 スタンレー電気株式会社 LED light source device using phosphor and vehicle headlamp using LED light source device
JP4604488B2 (en) * 2003-12-26 2011-01-05 日亜化学工業株式会社 Nitride semiconductor light emitting device and manufacturing method thereof
JP3898721B2 (en) * 2004-01-28 2007-03-28 京セラ株式会社 Light emitting device and lighting device
JP4020092B2 (en) * 2004-03-16 2007-12-12 住友電気工業株式会社 Semiconductor light emitting device
TW200614548A (en) * 2004-07-09 2006-05-01 Matsushita Electric Ind Co Ltd Light-emitting device
EP1794814A1 (en) * 2004-09-23 2007-06-13 Koninklijke Philips Electronics N.V. Light-emitting device
JP2006093399A (en) * 2004-09-24 2006-04-06 Kyocera Corp Light-emitting device, its manufacturing method and luminaire
US8134292B2 (en) * 2004-10-29 2012-03-13 Ledengin, Inc. Light emitting device with a thermal insulating and refractive index matching material
JP4604763B2 (en) * 2005-02-24 2011-01-05 ソニー株式会社 Backlight device and liquid crystal display device
JP5288792B2 (en) * 2005-03-01 2013-09-11 株式会社東芝 Light emitting device

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040227148A1 (en) * 1997-06-03 2004-11-18 Camras Michael D. III-Phosphide and III-Arsenide flip chip light-emitting devices
US20040145308A1 (en) * 2002-10-22 2004-07-29 Osram Opto Semiconductors Gmbh Light source having an LED and a luminescence conversion body and method for producing the luminescence conversion body
US20050151141A1 (en) * 2003-10-31 2005-07-14 Osram Opto Semiconductors Gmbh Luminescence diode chip
US20050269582A1 (en) * 2004-06-03 2005-12-08 Lumileds Lighting, U.S., Llc Luminescent ceramic for a light emitting device
US20060091411A1 (en) * 2004-10-29 2006-05-04 Ouderkirk Andrew J High brightness LED package
US20060091784A1 (en) * 2004-10-29 2006-05-04 Conner Arlie R LED package with non-bonded optical element
WO2006103582A1 (en) * 2005-03-29 2006-10-05 Koninklijke Philips Electronics N.V. Wide emitting lens for led useful for backlighting

Also Published As

Publication number Publication date
EP2097935B1 (en) 2016-10-05
WO2008078235A2 (en) 2008-07-03
TW200836378A (en) 2008-09-01
US8410500B2 (en) 2013-04-02
CN101569020B (en) 2011-05-18
CN101569020A (en) 2009-10-28
KR101484461B1 (en) 2015-01-20
JP2010514187A (en) 2010-04-30
TWI449206B (en) 2014-08-11
US20100019265A1 (en) 2010-01-28
KR20090096630A (en) 2009-09-11
EP2097935A2 (en) 2009-09-09

Similar Documents

Publication Publication Date Title
WO2008078235A3 (en) Light-emitting apparatus with shaped wavelength converter
USD634863S1 (en) Light source of light emitting diode
EP1840977A4 (en) Light-emitting device and illuminating device
MY168492A (en) Light emitting device
WO2008026347A8 (en) Illuminating device
MY140301A (en) Light-emitting element storing packages and a method of manufacturing the same
WO2011007277A3 (en) Lighting device with light sources positioned near the bottom surface of a waveguide
WO2010027672A3 (en) Phosphor-converted led
WO2007146709A3 (en) Adapted led device with re-emitting semiconductor construction
WO2009109974A3 (en) Illumination apparatus and methods of forming the same
WO2007072268A8 (en) Side emitting light -emitting device
WO2009075972A3 (en) Down-converted light emitting diode with simplified light extraction
WO2009085500A3 (en) Light distribution using a light emitting diode assembly
TW200739964A (en) Light emitting device
EP1562238A3 (en) Light emitting diode
WO2007130928A3 (en) Led package with converging optical element
EP1536487A4 (en) Light emitting element, light emitting device and surface emission illuminating device using it
TW200732583A (en) LED lamp
EP1691425A4 (en) Light emitting device using light emitting diode chip
TW200623467A (en) Light emitting device with improved conversion layer
TW200700825A (en) Bottom lighting module
EP2466367A3 (en) Light emitting module and backlight unit using the same
TW200729547A (en) Light-emitting device
JP2009540618A5 (en)
EP2461380A3 (en) Light emitting device package and manufacturing method thereof

Legal Events

Date Code Title Description
WWE Wipo information: entry into national phase

Ref document number: 200780047604.X

Country of ref document: CN

121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 07849489

Country of ref document: EP

Kind code of ref document: A2

REEP Request for entry into the european phase

Ref document number: 2007849489

Country of ref document: EP

WWE Wipo information: entry into national phase

Ref document number: 2007849489

Country of ref document: EP

WWE Wipo information: entry into national phase

Ref document number: 12519439

Country of ref document: US

ENP Entry into the national phase

Ref document number: 2009542317

Country of ref document: JP

Kind code of ref document: A

NENP Non-entry into the national phase

Ref country code: DE

WWE Wipo information: entry into national phase

Ref document number: 1020097014974

Country of ref document: KR