WO2008079310A1 - Microelectronic assemblies having compliancy and methods therefor - Google Patents
Microelectronic assemblies having compliancy and methods therefor Download PDFInfo
- Publication number
- WO2008079310A1 WO2008079310A1 PCT/US2007/026103 US2007026103W WO2008079310A1 WO 2008079310 A1 WO2008079310 A1 WO 2008079310A1 US 2007026103 W US2007026103 W US 2007026103W WO 2008079310 A1 WO2008079310 A1 WO 2008079310A1
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- WIPO (PCT)
- Prior art keywords
- conductive
- bumps
- compliant
- compliant bumps
- contacts
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/10—Bump connectors ; Manufacturing methods related thereto
- H01L24/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
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- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/482—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of lead-in layers inseparably applied to the semiconductor body
- H01L23/485—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of lead-in layers inseparably applied to the semiconductor body consisting of layered constructions comprising conductive layers and insulating layers, e.g. planar contacts
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- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
- H01L23/3114—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed the device being a chip scale package, e.g. CSP
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Abstract
Description
Claims
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2007800499747A CN101584033B (en) | 2006-12-20 | 2007-12-19 | Microelectronic assemblies having compliancy and methods therefor |
KR1020097014870A KR101387719B1 (en) | 2006-12-20 | 2007-12-19 | Microelectronic assemblies having compliancy and methods therefor |
JP2009542929A JP5306224B2 (en) | 2006-12-20 | 2007-12-19 | Compliance microelectronic assembly and method therefor |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11/643,021 | 2006-12-20 | ||
US11/643,021 US7749886B2 (en) | 2006-12-20 | 2006-12-20 | Microelectronic assemblies having compliancy and methods therefor |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2008079310A1 true WO2008079310A1 (en) | 2008-07-03 |
Family
ID=39358367
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US2007/026103 WO2008079310A1 (en) | 2006-12-20 | 2007-12-19 | Microelectronic assemblies having compliancy and methods therefor |
Country Status (5)
Country | Link |
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US (3) | US7749886B2 (en) |
JP (1) | JP5306224B2 (en) |
KR (1) | KR101387719B1 (en) |
CN (1) | CN101584033B (en) |
WO (1) | WO2008079310A1 (en) |
Families Citing this family (47)
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US7928582B2 (en) * | 2007-03-09 | 2011-04-19 | Micron Technology, Inc. | Microelectronic workpieces and methods for manufacturing microelectronic devices using such workpieces |
US20090057909A1 (en) * | 2007-06-20 | 2009-03-05 | Flipchip International, Llc | Under bump metallization structure having a seed layer for electroless nickel deposition |
JP5609144B2 (en) * | 2010-02-19 | 2014-10-22 | ソニー株式会社 | Semiconductor device and through electrode test method |
US9548240B2 (en) * | 2010-03-15 | 2017-01-17 | STATS ChipPAC Pte. Ltd. | Semiconductor device and method of forming repassivation layer for robust low cost fan-out semiconductor package |
US8546951B2 (en) | 2011-06-09 | 2013-10-01 | Optiz, Inc. | 3D integration microelectronic assembly for integrated circuit devices |
US8546900B2 (en) | 2011-06-09 | 2013-10-01 | Optiz, Inc. | 3D integration microelectronic assembly for integrated circuit devices |
US8552518B2 (en) | 2011-06-09 | 2013-10-08 | Optiz, Inc. | 3D integrated microelectronic assembly with stress reducing interconnects |
US8829676B2 (en) | 2011-06-28 | 2014-09-09 | Taiwan Semiconductor Manufacturing Company, Ltd. | Interconnect structure for wafer level package |
US8604576B2 (en) | 2011-07-19 | 2013-12-10 | Opitz, Inc. | Low stress cavity package for back side illuminated image sensor, and method of making same |
US9018725B2 (en) | 2011-09-02 | 2015-04-28 | Optiz, Inc. | Stepped package for image sensor and method of making same |
US8796800B2 (en) | 2011-11-21 | 2014-08-05 | Optiz, Inc. | Interposer package for CMOS image sensor and method of making same |
US8432011B1 (en) | 2011-12-06 | 2013-04-30 | Optiz, Inc. | Wire bond interposer package for CMOS image sensor and method of making same |
US8570669B2 (en) | 2012-01-23 | 2013-10-29 | Optiz, Inc | Multi-layer polymer lens and method of making same |
US8692344B2 (en) | 2012-03-16 | 2014-04-08 | Optiz, Inc | Back side illuminated image sensor architecture, and method of making same |
US9245834B2 (en) | 2012-03-16 | 2016-01-26 | Stats Chippac, Ltd. | Semiconductor device and method of forming compliant conductive interconnect structure in flipchip package |
US9233511B2 (en) | 2012-05-10 | 2016-01-12 | Optiz, Inc. | Method of making stamped multi-layer polymer lens |
US8921759B2 (en) | 2012-07-26 | 2014-12-30 | Optiz, Inc. | Integrated image sensor package with liquid crystal lens |
US8759930B2 (en) | 2012-09-10 | 2014-06-24 | Optiz, Inc. | Low profile image sensor package |
US8828762B2 (en) | 2012-10-18 | 2014-09-09 | International Business Machines Corporation | Carbon nanostructure device fabrication utilizing protect layers |
US9059106B2 (en) * | 2012-10-31 | 2015-06-16 | International Business Machines Corporation | Compensating for warpage of a flip chip package by varying heights of a redistribution layer on an integrated circuit chip |
US9219091B2 (en) | 2013-03-12 | 2015-12-22 | Optiz, Inc. | Low profile sensor module and method of making same |
US9190443B2 (en) | 2013-03-12 | 2015-11-17 | Optiz Inc. | Low profile image sensor |
US9368460B2 (en) | 2013-03-15 | 2016-06-14 | Taiwan Semiconductor Manufacturing Company, Ltd. | Fan-out interconnect structure and method for forming same |
CN104051287B (en) * | 2013-03-15 | 2017-06-16 | 台湾积体电路制造股份有限公司 | It is fanned out to interconnection structure and forming method thereof |
US9142695B2 (en) | 2013-06-03 | 2015-09-22 | Optiz, Inc. | Sensor package with exposed sensor array and method of making same |
US9496247B2 (en) | 2013-08-26 | 2016-11-15 | Optiz, Inc. | Integrated camera module and method of making same |
US9461190B2 (en) | 2013-09-24 | 2016-10-04 | Optiz, Inc. | Low profile sensor package with cooling feature and method of making same |
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US8115308B2 (en) | 2012-02-14 |
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US8759973B2 (en) | 2014-06-24 |
US20100230812A1 (en) | 2010-09-16 |
US20120091582A1 (en) | 2012-04-19 |
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US7749886B2 (en) | 2010-07-06 |
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JP2010514218A (en) | 2010-04-30 |
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