WO2008095755A1 - Connection, method and device for the uniform coupling-in of laser beams during laser welding and laser soldering, in particular on highly reflective materials - Google Patents

Connection, method and device for the uniform coupling-in of laser beams during laser welding and laser soldering, in particular on highly reflective materials Download PDF

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Publication number
WO2008095755A1
WO2008095755A1 PCT/EP2008/050497 EP2008050497W WO2008095755A1 WO 2008095755 A1 WO2008095755 A1 WO 2008095755A1 EP 2008050497 W EP2008050497 W EP 2008050497W WO 2008095755 A1 WO2008095755 A1 WO 2008095755A1
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WO
WIPO (PCT)
Prior art keywords
connection
contact
terminal
laser
contact partner
Prior art date
Application number
PCT/EP2008/050497
Other languages
German (de)
French (fr)
Inventor
Herbert Kilian
Clemens Scherer
Original Assignee
Siemens Aktiengesellschaft
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Aktiengesellschaft filed Critical Siemens Aktiengesellschaft
Publication of WO2008095755A1 publication Critical patent/WO2008095755A1/en

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/20—Bonding
    • B23K26/21—Bonding by welding
    • B23K26/211—Bonding by welding with interposition of special material to facilitate connection of the parts
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
    • B23K1/0016—Brazing of electronic components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/005—Soldering by means of radiant energy
    • B23K1/0056—Soldering by means of radiant energy soldering by means of beams, e.g. lasers, E.B.
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
    • H01L23/49548—Cross section geometry
    • H01L23/49551—Cross section geometry characterised by bent parts
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/328—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by welding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/40—Semiconductor devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
    • H01L2224/36—Structure, shape, material or disposition of the strap connectors prior to the connecting process
    • H01L2224/37—Structure, shape, material or disposition of the strap connectors prior to the connecting process of an individual strap connector
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    • H01L2224/371—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
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    • H01L2224/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
    • H01L2224/36—Structure, shape, material or disposition of the strap connectors prior to the connecting process
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    • H01L2224/371—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
    • H01L2224/37117—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof the principal constituent melting at a temperature of greater than or equal to 400°C and less than 950°C
    • H01L2224/37124—Aluminium [Al] as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
    • H01L2224/36—Structure, shape, material or disposition of the strap connectors prior to the connecting process
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    • H01L2224/371—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
    • H01L2224/37138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/37147—Copper [Cu] as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
    • H01L2224/36—Structure, shape, material or disposition of the strap connectors prior to the connecting process
    • H01L2224/37—Structure, shape, material or disposition of the strap connectors prior to the connecting process of an individual strap connector
    • H01L2224/37001—Core members of the connector
    • H01L2224/37099—Material
    • H01L2224/371—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
    • H01L2224/37138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/37155—Nickel [Ni] as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
    • H01L2224/36—Structure, shape, material or disposition of the strap connectors prior to the connecting process
    • H01L2224/37—Structure, shape, material or disposition of the strap connectors prior to the connecting process of an individual strap connector
    • H01L2224/37001—Core members of the connector
    • H01L2224/37099—Material
    • H01L2224/371—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
    • H01L2224/37138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/3716—Iron [Fe] as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
    • H01L2224/36—Structure, shape, material or disposition of the strap connectors prior to the connecting process
    • H01L2224/37—Structure, shape, material or disposition of the strap connectors prior to the connecting process of an individual strap connector
    • H01L2224/3754—Coating
    • H01L2224/37599—Material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/84—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a strap connector
    • H01L2224/842—Applying energy for connecting
    • H01L2224/8421—Applying energy for connecting with energy being in the form of electromagnetic radiation
    • H01L2224/84214—Applying energy for connecting with energy being in the form of electromagnetic radiation using a laser
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/852—Applying energy for connecting
    • H01L2224/8521—Applying energy for connecting with energy being in the form of electromagnetic radiation
    • H01L2224/85214—Applying energy for connecting with energy being in the form of electromagnetic radiation using a laser
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/71—Means for bonding not being attached to, or not being formed on, the surface to be connected
    • H01L24/72—Detachable connecting means consisting of mechanical auxiliary parts connecting the device, e.g. pressure contacts using springs or clips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/0102—Calcium [Ca]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01057—Lanthanum [La]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H01R43/02—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections
    • H01R43/0221—Laser welding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10628—Leaded surface mounted device
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
    • H05K2203/107—Using laser light

Definitions

  • the present invention relates to a mechanical and / or electrical connection according to the preamble of the main claim, as well as a corresponding method and a corresponding device for contacting the terminal according to the independent claims.
  • Elongated means that the terminal or the contact point extends mainly along a longitudinal direction and the propagation of the terminal or the contact point perpendicular or transverse to this longitudinal direction is relatively short.
  • An elongated electrical connection can be created, for example, as a little leg.
  • Flat means that the terminal or pad extends mainly along two directions in a plane and the extension of the terminal or pad perpendicular or transverse to that plane is relatively short.
  • a contact partner is three-dimensional and has a flat or elongated electrical contact point to which the planar or elongated mechanical and / or electrical contact point Final mechanically and / or electrically connected or will.
  • the flat or elongated mechanical and / or electrical connections or contacts of a, in particular electronic, component to compensate for tolerances, in particular arranged on a substrate, contact partners are bent out before, for example, 1 ° to 40 ° to the component level.
  • Conventional components are mechanically and electrically connected to contact partners by laser in the following conventional manner:
  • connection is welded or soldered to the contact partner by means of laser welding at the contact point serving as the desired welding point or nominal laser point.
  • the actual laser welding takes place in a disadvantageous manner at a point at which the connection is spaced from the contact partner by a gap. In this way, a required "O-gap" under the connection is no longer given.
  • the size of the displacement of the contact point depends on the length of the electrical connection. Since the laser beam impinges on surfaces of different angles, there is no uniform coupling of the laser beam, in particular in the case of highly reflective materials. Since the quality of the laser bonding, in particular of the laser welding or laser brazing, is determined mainly by the coupling of the laser beam or the laser radiation into the material, a connection produced by the conventional laser bonding is mechanically and electrically not optimal.
  • Such welding parameters are Einkoppeleigenschaften of Laser beam into the material or angle of incidence of the laser beam to connection surfaces and touching the contact partner by the connection or the generation of an "O-gap".
  • a preferred angle of incidence is vertical and the distance between the terminal and the contact partner should be zero or minimum at the target laser location.
  • the object is achieved by a mechanical and / or electrical connection according to the main claim, by a method and an apparatus according to the subsidiary claims.
  • the terminal or contact is made oblong or flat along the surface of an ellipsoid.
  • the terminal contacts the contact partner at a pad that determines the position of the laser beam.
  • a target laser point or target weld there is a target laser point or target weld.
  • a mechanical welding parameter is the coupling property of the laser beam into the material, ie the angle of the connection surface to the laser beam, as well as the so-called "0 gap". That is to say that the advantageously shaped connection to the nominal laser points automatically offers the same mechanical welding parameters at each position when the nominal laser points are displaced.
  • the contact points in the Aufsetzposition and in the end position of the connection to the contact partner lie along a single
  • Laser beam axis That is, a first and a second contact point are arranged along a single laser beam axis.
  • the laser beam axis always hits the connection surface vertically.
  • Mechanical connections are for example the brackets, straps or brackets for the mechanical fixation of components, in particular of electronic components, such as For example, capacitors, resistors, coils, transistors or integrated circuits or relays are.
  • the invention also includes electrical connections of electronic components.
  • connection is convex to the contact partner. In this way, it is particularly easy to form a contact point, touch on the connection and contact partners.
  • connection is the mechanical and / or electrical connection of an electrical line, an electronic component or a device.
  • Devices are, for example, injection-molded circuit boards, which have, for example, electronic control units. Such control units are abbreviated with ECU.
  • the connection includes connections of all types of components, components, lines or equipment.
  • the contact partner is arranged on a substrate. This fixes the connected connection to a carrier in a simple manner.
  • connection is created to be rotatable about a bending point of the connection from an attachment position into an end position of the connection to the contact partner.
  • connection is provided flexibly, for example, when a component is pressed vertically in the direction of a substrate.
  • the terminal has a shape such that the connection between the bending point and along the surface of a Ellipsoid generated portion, is generated oblong or flat along a side surface of a cuboid. In this simple way, the lever arm for bending the connection is effectively extended.
  • connection has a shape such that the connection is produced at the end of the connection facing away from a component, next to the section generated along the surface of the ellipsoid, oblong or flat along the side surface of a cuboid.
  • a shielding of the laser beam can be provided in a particularly simple and effective manner. That is, potentially laser beams deflected from the terminal surface are reflected or absorbed back from such an end of the electrical terminal in the laser beam axis region. In this way, caused by the laser beam destruction of adjacent components is avoided.
  • connection is generated oblong or flat along the side surface of a cuboid. In this way, this portion of the fitting simply lies in the same plane as a component. In this way, the connection is generated in this area parallel to a substrate, so that, for example, short circuits are avoided.
  • the pre-bending can be generated particularly advantageous around the bending point.
  • an end of the electrical connection facing away from the component has the shape. That is, particularly advantageous is a relatively small portion of the terminal is formed according to the shapes.
  • the terminal has highly reflective materials, such as copper, nickel, iron and / or aluminum.
  • connection and the contact partner are mechanically and / or electrically connected by means of laser welding and / or laser soldering.
  • At least one mechanical and / or electrical connection at least one mechanical and / or electrical connection, the horizontal position of the nominal laser location in the contact position of the connection to the contact partner to the horizontal Position of the nominal laser point in the end position of the connection to the contact partner identical.
  • a corresponding device for the laser joining of at least one electrical connection, in particular an electronic component, with an associated, in particular arranged on a substrate, contact partner, the horizontal position of the laser beam need only be set once to the target laser location.
  • the quality of the laser-generated connections between terminal and contact partner in contrast to the prior art is very high.
  • Figure 1 shows an embodiment of a terminal according to the prior art
  • Figure 2 shows a first embodiment of a terminal according to the present invention
  • Figure 3 shows a second embodiment of a terminal according to the present invention.
  • Figure 1 shows a conventional electrical connection 1 of an electronic component, not shown here.
  • the electronic component is assumed to be positioned to the right of the terminal 1.
  • An electrical and mechanical connection between the connection 1 and the associated contact partner 3 should be generated.
  • the contact partner 3 is arranged on a substrate 2.
  • the terminal 1 is bent to compensate for tolerances to the contact 3 here, for example, by 33 ° to the component level before.
  • the connection 1 at the laser nominal point in a contact position A has a surface profile from the component side falling from 33 ° to the component plane to rising 23 ° to the component plane.
  • the terminal 1 has the placement position A relative to the electronic component and relative to the contact partner 3. At this placement position A, the terminal 1 contacts the contact partner 3 at a first contact point 5.
  • FIG. 1 shows a displacement of the contact point from the placement position A via an intermediate position B to an end position C by pressing the electronic component perpendicularly and in the direction of the substrate 2 and thus displacing the contact partner 3 arranged on the substrate 2 perpendicular to the substrate 2 in the direction of the terminal 1 such that each of the arranged now in the end position C to the electronic component electrical contact 1 at a second contact point 7 contacts the associated contact partner 3, wherein the second contact point 7 also on the contact partner 3, but in one direction horizontally and parallel to the substrate surface and is displaced away from the electronic component.
  • the first contact point 5 and the second contact point 7 have different spatial coordinates such that the second contact point 7 is positioned approximately 1.0 mm above the first contact point 5 and approximately 0.25 mm horizontally in the direction away from the electronic component is.
  • Touching position A defines the first contact point 5, at which the terminal 1 and the contact partner 3 touch.
  • the end position C determines the second contact point 7 at which the connection 1 and the contact partner 3 touch. Both contact points each determined the nominal laser locations. It is clear from FIG.
  • the reference character x denotes the amount by which the laser beam 11 has to be displaced from its position in the placement position A for the end position C.
  • the second contact point 7 is displaced vertically by approximately 1.0 mm and horizontally by approximately 0.25 mm from the first contact point 5.
  • no gap between port 1 and contact 3 partners If the laser beam 11 remains in its original position, then the connection 1 to the contact partner 3 is spaced such that a required "0-gap" at the contact point is no longer generated. If lasered in this position of the laser 11, the quality of the connection is reduced.
  • the size of the displacement of the nominal laser point or of the contact point depends on the length of the connection 1. According to the prior art shown here, the mechanical welding parameters for the laser beam 11 change when the first contact point is moved to the second contact point.
  • the position of the bending point 9 or a pivot point can be calculated.
  • Electronic components are, for example, resistors, capacitors, inductors, transistors, semiconductor chips and the like.
  • Figure 2 shows a first embodiment of a terminal 1 of an electronic device, not shown, which is intended to be arranged on the right side of Figure 2.
  • the connector 1 can electrically and / or mechanically connect all possible types of components, lines and devices.
  • A denotes an attachment position. In this placement position A, the terminal 1 contacts the contact partner 3 at a contact point 5, which is arranged on a substrate 2. The terminal 1 is bent to compensate for tolerances to the contact partner 3 before.
  • the exemplary electronic component is placed with the connection 1 on the contact partner 3 at a first contact point 5 assigned to the placement position A. At the first contact point 5, the connection 1 and the contact partner 3 touch each other.
  • the first contact point 5 determines the desired laser location at which the laser beam 11 is positioned.
  • FIG. 2 likewise shows an end position C.
  • connection 1 By pressing the electronic component perpendicularly in the direction 21 to the substrate 2 and moving the connection 1 to the contact partner 3 to a second contact point 7 assigned to the end position C, the connection 1 is bent relative to the electronic component. At the endposi tion C contact terminal 1 and contact 3 at the second contact point 7.
  • the terminal 1 is rotated about the bending point 9 of the terminal 1 from the placement position A in the end position C.
  • the connection 1 In the region of incidence of the laser beam 11, the connection 1 has a course which is elongated or flat along the surface 13 of an ellipsoid and convex to the contact partner 3. By means of this surface 13 of an ellipsoid, the same mechanical welding parameters are created for each position of the movement of the nominal laser spot.
  • the incident angle of the laser beam 11 at the touchdown position A and at the end position C is the same.
  • the position of the first pad 5 to the second pad 7 shifts only in the vertical direction, whereas the position in the horizontal direction remains the same , In this way, the laser quality remains the same in both the placement position A and in the end position C.
  • the connection 1 is produced between the bending point 9 and the section produced along the surface 13 of the ellipsoid, oblong or flat along the side surface 15 of a cuboid. As a result, the lever arm of the surface 13 can be adjusted to the bending point 9.
  • the terminal 1 is further generated such that from the bending point 9 to the electronic component facing the end, the terminal 1 is generated oblong or flat along the side surface 19 of a cuboid. In this way, the terminal 1 is formed in this area parallel to the substrate 2, so that short circuits are avoided.
  • Reference numeral 23 shows the direction in which the substrate 2 is relatively displaced toward the terminal 1.
  • Reference numeral 21 shows the direction of relative displacement of the terminal 1 to the contact partner 3 and the substrate 2, respectively. These directions are in the vertical.
  • FIG. 3 shows a second exemplary embodiment of a connection 1 according to the invention. In contrast to the exemplary embodiment according to FIG.
  • connection 1 has a shape such that the connection 1 adjoins the end of the electrical connection 1 facing away from the electronic component and alongside the surface 13 of the ellipsoid-generated portion is generated oblong or flat along the side surface 17 of a cuboid.
  • Oblong or flat along the side surfaces 15, 17 and 19 means only along a side surface of a cuboid. Edge areas of a cuboid are excluded here. That is, the course of the surfaces 15, 17, and 19 is straight and not kinked along an edge.
  • a molded connection 1 is produced which, with the end facing away from the component, serves with the side face 17 as a laser beam reflection protection. That is, by this shaping, a laser beam deflected in the direction of the end of the terminal 1 facing away from the component is again reflected back in the direction of the laser beam axis 11 in such a way that no surrounding components are destroyed.
  • connection 1 is generated in such a way that the laser beam 11 always impinges perpendicularly on the surface of the connection 1 and always impinges on the points at which connection 1 and contact partner 3 come into contact.
  • An example of an ellipsoid may be a compressed ellipsoid of revolution.

Abstract

According to the present invention, when a fixedly positioned laser beam (11) is used for connecting, in particular laser welding or laser soldering, mechanical and/or electrical contacts (1), in particular of an electronic component, to respective contact partners (3), in particular arranged on a substrate (2), the same mechanical welding parameters are to be constantly provided for the laser beam (11) at each position of a movement of the desired laser location from a setting-down position (A) to an end position (C) of the connection (1) with respect to the contact partner (3) that is brought about by pressing of the connection (1) perpendicularly in the direction of the contact partner (3). In particular in the case of connections (1) with highly reflective materials, this achieves the object that the connection (1) is shaped in such a way that the connection (1) is created over a longitudinal extent or over a two-dimensional area along the surface (13) of an ellipse and convexly with respect to the contact partner (3).

Description

Beschreibungdescription
Anschluss, Verfahren und Vorrichtung zur gleichmäßigen Ein- kopplung von Laserstrahlen beim Laserschweißen und Laserlö- ten, insbesondere an hoch reflektierenden MaterialienConnection, method and device for the uniform coupling of laser beams during laser welding and laser brazing, in particular on highly reflective materials
Die vorliegende Erfindung betrifft einen mechanischen und/oder elektrischen Anschluss gemäß dem Oberbegriff des Hauptanspruchs, sowie ein entsprechendes Verfahren und eine entsprechende Vorrichtung zur Kontaktierung des Anschlusses gemäß den Nebenansprüchen.The present invention relates to a mechanical and / or electrical connection according to the preamble of the main claim, as well as a corresponding method and a corresponding device for contacting the terminal according to the independent claims.
Herkömmliche elektrische Leitungen und elektronische Bauelemente weisen längliche oder flächige Anschlüsse oder Kontakte auf.Conventional electrical lines and electronic components have elongated or planar connections or contacts.
Herkömmliche Einrichtungen oder elektronische Bauelemente mit flächig oder länglichen elektrischen Anschlüssen, werden mittels Laserverbinden, insbesondere Laserschweißen oder Laser- löten, mechanisch und elektrisch jeweils an eine flächige oder längliche Kontaktstelle eines Kontaktpartners angeschlossen .Conventional devices or electronic components with flat or elongated electrical connections are mechanically and electrically connected to a flat or elongated contact point of a contact partner by means of laser bonding, in particular laser welding or laser soldering.
Länglich heißt, dass der Anschluss oder die Kontaktstelle sich hauptsächlich entlang einer Längsrichtung erstreckt und die Ausbreitung des Anschlusses oder der Kontaktstelle senkrecht oder quer zu dieser Längsrichtung relativ kurz ist. Ein länglicher elektrischer Anschluss kann beispielsweise als ein Beinchen geschaffen sein.Elongated means that the terminal or the contact point extends mainly along a longitudinal direction and the propagation of the terminal or the contact point perpendicular or transverse to this longitudinal direction is relatively short. An elongated electrical connection can be created, for example, as a little leg.
Flächig heißt, dass der Anschluss oder die Kontaktstelle sich hauptsächlich entlang zweier Richtungen in einer Ebene erstreckt und die Ausdehnung des Anschlusses oder der Kontaktstelle senkrecht oder quer zu dieser Ebene relativ kurz ist.Flat means that the terminal or pad extends mainly along two directions in a plane and the extension of the terminal or pad perpendicular or transverse to that plane is relatively short.
Ein Kontaktpartner ist dreidimensional und weist eine flächige oder längliche elektrische Kontaktstelle auf, an die der flächige oder längliche mechanische und/oder elektrische An- Schluss mechanisch und/oder elektrisch angeschlossen ist oder wird.A contact partner is three-dimensional and has a flat or elongated electrical contact point to which the planar or elongated mechanical and / or electrical contact point Final mechanically and / or electrically connected or will.
Herkömmlicherweise sind die flächigen oder länglichen mecha- nischen und/oder elektrischen Anschlüsse oder Kontakte eines, insbesondere elektronischen, Bauelements zum Ausgleich von Toleranzen zu, insbesondere auf einem Substrat angeordneten, Kontaktpartnern hin vor gebogen, beispielsweise von 1° bis 40° zur Bauelementebene. Herkömmliche Bauelemente werden auf folgende herkömmliche Weise an Kontaktpartnern mittels Laser mechanisch und elektrisch angeschlossen:Conventionally, the flat or elongated mechanical and / or electrical connections or contacts of a, in particular electronic, component to compensate for tolerances, in particular arranged on a substrate, contact partners are bent out before, for example, 1 ° to 40 ° to the component level. Conventional components are mechanically and electrically connected to contact partners by laser in the following conventional manner:
Aufsetzen des Bauelements auf auf einem Substrat angeordneten Kontaktpartner derart, dass jeweils ein in einer Aufsetzposi- tion zu dem Bauelement angeordneter mechanischer und/oder elektrischer Anschluss an einer ersten Kontaktstelle den dazugehörigen Kontaktpartner berührt.Placing the device on arranged on a substrate contact partner such that each one in a Aufsetzposi- tion to the component arranged mechanical and / or electrical connection to the first contact point touches the associated contact partner.
Andrücken des Bauelements senkrecht und in Richtung zum Sub- strat und auf diese Weise erfolgendes Verschieben des auf dem Substrat angeordneten Kontaktpartners senkrecht zum Substrat in Richtung des Anschlusses derart, dass jeweils der nun in einer Endposition zu dem elektronischen Bauelement angeordnete Anschluss an einer zweiten Kontaktstelle den dazugehörigen Kontaktpartner berührt, wobei die zweite Kontaktstelle ebenso auf dem Kontaktpartner, aber in einer Richtung parallel zur Substratoberfläche und von dem elektronischen Bauelement weg verschoben positioniert ist.Pressing of the component perpendicular and in the direction of the substrate and in this way, shifting the substrate arranged on the substrate perpendicular to the substrate in the direction of the terminal such that in each case the now arranged in an end position to the electronic component connection to a second contact point associated contact partner touches, wherein the second contact point is also positioned on the contact partner, but in a direction parallel to the substrate surface and moved away from the electronic component away.
Der Anschluss wird mittels Laserschweißen an der als Sollschweißstelle oder Solllaserstelle dienenden Kontaktstelle an den Kontaktpartner geschweißt oder gelötet. Die zweite Kontaktstelle ist um einen Betrag x von der ersten Kontaktstelle parallel zu der Substratoberfläche und von dem elektronischen Bauelement weg verschoben. Wird der Laserstrahl vor dem Andrücken des elektronischen Bauelements in Verlängerung senkrecht auf die erste Kontaktstelle auftreffend mit einem Wert x = 0 positioniert, so ist dieser feststehende Laserstrahl nach dem Andrücken des elektronischen Bauelements von der zweiten Kontaktstelle um einen Betrag x parallel zur Substratoberfläche zum elektronischen Bauelement hin abweichend positioniert. Das heißt, durch das Andrücken verschieben sich die Kontaktstelle und damit die richtige Solllaserstelle, Laserschweißstelle oder Laserlötstelle in Richtung parallel zur Substratoberfläche weg vom elektronischen Bauelement.The connection is welded or soldered to the contact partner by means of laser welding at the contact point serving as the desired welding point or nominal laser point. The second contact point is shifted by an amount x from the first contact point parallel to the substrate surface and away from the electronic component. If the laser beam is positioned in the extension perpendicular to the first contact point before the electronic component is pressed with a value x = 0, then this is a stationary laser beam after pressing the electronic component of the second contact point by an amount x parallel to the substrate surface to the electronic component out differently positioned. That is, by pressing the contact point and thus the correct target laser point, laser welding point or laser solder point move in the direction parallel to the substrate surface away from the electronic component.
Bleibt die Laserstrahlposition nach dem Andrücken des elekt- ronischen Bauelements unverändert auf die erste Kontaktstelle eingestellt, erfolgt das tatsächliche Laserschweißen in nachteiliger Weise an einer Stelle, an der der Anschluss um einen Spalt von dem Kontaktpartner beabstandet ist. Auf diese Weise ist ein geforderter "O-Spalt" unter dem Anschluss nicht mehr gegeben. Die Größe der Verschiebung der Kontaktstelle hängt von der Länge des elektrischen Anschlusses ab. Da der Laserstrahl auf winkelunterschiedliche Oberflächen trifft, ist ebenso eine gleichmäßige Einkopplung des Laserstrahls, insbesondere bei hoch reflektierenden Materialien, nicht ge- geben. Da die Qualität des Laserverbindens, insbesondere des Laserschweißens oder Laserlötens, hauptsächlich von der Einkopplung des Laserstrahls beziehungsweise der Laserstrahlung ins Material bestimmt wird, ist eine durch das herkömmliche Laserverbinden erzeugte Verbindung mechanisch und elektrisch nicht optimal.If the laser beam position remains unchanged after the pressing of the electronic component on the first contact point, the actual laser welding takes place in a disadvantageous manner at a point at which the connection is spaced from the contact partner by a gap. In this way, a required "O-gap" under the connection is no longer given. The size of the displacement of the contact point depends on the length of the electrical connection. Since the laser beam impinges on surfaces of different angles, there is no uniform coupling of the laser beam, in particular in the case of highly reflective materials. Since the quality of the laser bonding, in particular of the laser welding or laser brazing, is determined mainly by the coupling of the laser beam or the laser radiation into the material, a connection produced by the conventional laser bonding is mechanically and electrically not optimal.
Es ist Aufgabe der vorliegenden Erfindung bei einem mittels eines fest positionierten Laserstrahls erfolgenden Verbinden, insbesondere beim Laserschweißen oder Laserlöten, von mecha- nischen und/oder elektrischen Anschlüssen, insbesondere eines elektronischen Bauelements, mit jeweiligen, insbesondere auf einem Substrat angeordneten, Kontaktpartnern, für den Laserstrahl an jeder Position einer durch ein Andrücken des Kontaktpartners senkrecht in Richtung zum Anschluss bewirkten Bewegung der Solllaserstelle von einer Aufsetzposition zu einer Endposition des Anschluss zum Kontaktpartner konstant die gleichen mechanischen Schweißparameter bereit zu stellen. Derartige Schweißparameter sind Einkoppeleigenschaften des Laserstrahls ins Material beziehungsweise Einfallswinkel des Laserstrahls zu Anschlussoberflächen und das Berühren des Kontaktpartners durch den Anschluss beziehungsweise das Erzeugen eines "O-Spalts". Ein bevorzugter Einfallswinkel ist senkrecht und der Abstand zwischen Anschluss und Kontaktpartner soll an der Solllaserstelle null oder minimal sein.It is an object of the present invention with a connection taking place by means of a fixedly positioned laser beam, in particular in laser welding or laser soldering, of mechanical and / or electrical connections, in particular of an electronic component, with respective contact partners, in particular arranged on a substrate Laser beam at each position of a caused by a pressing of the contact partner perpendicular in the direction of the connection movement of the target laser point from a touchdown position to an end position of the connection to the contact partner constantly provide the same mechanical welding parameters. Such welding parameters are Einkoppeleigenschaften of Laser beam into the material or angle of incidence of the laser beam to connection surfaces and touching the contact partner by the connection or the generation of an "O-gap". A preferred angle of incidence is vertical and the distance between the terminal and the contact partner should be zero or minimum at the target laser location.
Die Aufgabe wird durch einen mechanischen und/oder elektrischen Anschluss gemäß dem Hauptanspruch, durch ein Verfahren und eine Vorrichtung gemäß den Nebenansprüchen gelöst.The object is achieved by a mechanical and / or electrical connection according to the main claim, by a method and an apparatus according to the subsidiary claims.
Der Anschluss oder Kontakt ist länglich oder flächig entlang der Oberfläche eines Ellipsoids erzeugt. In diesem Bereich der Formgebung berührt der Anschluss den Kontaktpartner an einer Kontaktstelle, die die Position des Laserstrahls bestimmt. Entsprechend ergibt sich eine Solllaserstelle bzw. Sollschweißstelle. Dadurch, dass der Anschluss entlang der Oberfläche eines Ellipsoids, insbesondere eines zusammengedrückten oder lang gestrecktes Rotationsellipsoids, ausge- formt ist, kann dieser an jeder Position der Bewegung der Solllasserstelle die gleichen mechanischen Scheißparameter anbieten. Ein mechanischer Schweißparameter ist die Einkoppeleigenschaft des Laserstrahls ins Material, das heißt der Winkel von Anschlussoberfläche zum Laserstrahl, sowie der so genannte "0-Spalt". Das heißt, durch den vorteilhaft ausgeformten Anschluss an den Solllaserstellen werden an jeder Position bei Verschiebung der Solllaserstellen die gleichen mechanischen Schweißparameter automatisch angeboten. Die Kontaktstellen in der Aufsetzposition und in der Endposition des Anschluss zum Kontaktpartner liegen entlang einer einzigenThe terminal or contact is made oblong or flat along the surface of an ellipsoid. In this area of the molding, the terminal contacts the contact partner at a pad that determines the position of the laser beam. Accordingly, there is a target laser point or target weld. The fact that the connection is formed along the surface of an ellipsoid, in particular of a compressed or elongated ellipsoid of revolution, allows it to offer the same mechanical shattering parameters at each position of the movement of the target position. A mechanical welding parameter is the coupling property of the laser beam into the material, ie the angle of the connection surface to the laser beam, as well as the so-called "0 gap". That is to say that the advantageously shaped connection to the nominal laser points automatically offers the same mechanical welding parameters at each position when the nominal laser points are displaced. The contact points in the Aufsetzposition and in the end position of the connection to the contact partner lie along a single
Laserstrahlachse. Das heißt, eine erste und eine zweite Kontaktstelle sind entlang einer einzigen Laserstrahlachse angeordnet. Dabei trifft die Laserstrahlachse immer senkrecht auf die Anschlussoberfläche auf.Laser beam axis. That is, a first and a second contact point are arranged along a single laser beam axis. The laser beam axis always hits the connection surface vertically.
Mechanische Anschlüsse sind beispielsweise die Halterungen, Laschen oder Bügel zur mechanischen Fixierung von Bauelementen, insbesondere von elektronischen Bauelementen, wie dies beispielsweise Kondensatoren, Widerstände, Spulen, Transistoren oder integrierte Schaltungen oder Relais sind. Von der Erfindung sind ebenso elektrische Anschlüsse von elektronischen Bauelementen umfasst.Mechanical connections are for example the brackets, straps or brackets for the mechanical fixation of components, in particular of electronic components, such as For example, capacitors, resistors, coils, transistors or integrated circuits or relays are. The invention also includes electrical connections of electronic components.
Gemäß einer vorteilhaften Ausgestaltung ist der Anschluss konvex zum Kontaktpartner ausgebildet. Auf diese Weise ist es besonders einfach eine Kontaktstelle auszubilden, an der Anschluss und Kontaktpartner sich berühren.According to an advantageous embodiment, the connection is convex to the contact partner. In this way, it is particularly easy to form a contact point, touch on the connection and contact partners.
Weitere vorteilhafte Ausgestaltungen finden sich in den Unteransprüchen .Further advantageous embodiments can be found in the subclaims.
Gemäß einer vorteilhaften Ausgestaltung ist der Anschluss der mechanische und/oder elektrische Anschluss einer elektrischen Leitung, eines elektronischen Bauelements oder einer Einrichtung. Einrichtungen sind beispielsweise spritzumgossene Leiterplatten, die beispielsweise elektronische Steuereinheiten aufweisen. Derartige Steuereinheiten werden mit ECU abge- kürzt. Als Anschluss sind Anschlüsse aller Arten von Bauteilen, Bauelementen, Leitungen oder Einrichtungen mit einbezogen .According to an advantageous embodiment, the connection is the mechanical and / or electrical connection of an electrical line, an electronic component or a device. Devices are, for example, injection-molded circuit boards, which have, for example, electronic control units. Such control units are abbreviated with ECU. The connection includes connections of all types of components, components, lines or equipment.
Gemäß einer weiteren vorteilhaften Ausgestaltung ist der Kon- taktpartner auf einem Substrat angeordnet. Damit wird auf einfache Weise der verbundene Anschluss an einem Träger fixiert .According to a further advantageous embodiment, the contact partner is arranged on a substrate. This fixes the connected connection to a carrier in a simple manner.
Gemäß einer weiteren vorteilhaften Ausgestaltung ist der An- Schluss um eine Biegestelle des Anschluss von einer Aufsetzposition in eine Endposition des Anschluss zum Kontaktpartner drehbar geschaffen. Auf diese Weise ist der Anschluss, beispielsweise beim Niederdrücken eines Bauelements senkrecht in Richtung eines Substrats, flexibel bereitgestellt.According to a further advantageous embodiment, the connection is created to be rotatable about a bending point of the connection from an attachment position into an end position of the connection to the contact partner. In this way, the connection is provided flexibly, for example, when a component is pressed vertically in the direction of a substrate.
Gemäß einer weiteren vorteilhaften Ausgestaltung weist der Anschluss eine Formgebung derart auf, dass der Anschluss zwischen der Biegestelle und dem entlang der Oberfläche eines Ellipsoids erzeugten Abschnitts, länglich oder flächig entlang einer Seitenfläche eines Quaders erzeugt ist. Auf diese einfache Weise ist der Hebelarm zum Biegen des Anschluss wirksam verlängert.According to a further advantageous embodiment, the terminal has a shape such that the connection between the bending point and along the surface of a Ellipsoid generated portion, is generated oblong or flat along a side surface of a cuboid. In this simple way, the lever arm for bending the connection is effectively extended.
Gemäß einer weiteren vorteilhaften Ausgestaltung weist der Anschluss eine Formgebung derart auf, dass der Anschluss an dem einem Bauelement abgewandten Ende des Anschluss, neben dem entlang der Oberfläche des Ellipsoids erzeugten Ab- schnitt, länglich oder flächig entlang der Seitenfläche eines Quaders erzeugt ist. Auf diese Weise kann besonders einfach und wirksam eine Abschirmung des Laserstrahls bereitgestellt werden. Das heißt, potentiell von der Anschlussoberfläche umgelenkte Laserstrahlen werden von einem derartigen Ende des elektrischen Anschluss in den Laserstrahlachsenbereich zurückreflektiert oder absorbiert. Auf diese Weise wird eine durch den Laserstrahl bewirkte Zerstörung benachbarter Komponenten vermieden.According to a further advantageous embodiment, the connection has a shape such that the connection is produced at the end of the connection facing away from a component, next to the section generated along the surface of the ellipsoid, oblong or flat along the side surface of a cuboid. In this way, a shielding of the laser beam can be provided in a particularly simple and effective manner. That is, potentially laser beams deflected from the terminal surface are reflected or absorbed back from such an end of the electrical terminal in the laser beam axis region. In this way, caused by the laser beam destruction of adjacent components is avoided.
Gemäß einer weiteren vorteilhaften Ausgestaltung weist derAccording to a further advantageous embodiment, the
Anschluss eine Formgebung derart auf, dass der Anschluss von der Biegestelle bis zu dem einem Bauelement zugewandten Ende, länglich oder flächig entlang der Seitenfläche eines Quaders erzeugt ist. Auf diese Weise liegt dieser Abschnitt des An- Schluss auf einfache Weise in derselben Ebene wie ein Bauelement. Auf diese Weise ist der Anschluss in diesem Bereich parallel zu einem Substrat erzeugt, so dass beispielsweise Kurzschlüsse vermieden werden.Connecting a shaping such that the connection from the bending point to the end facing a component, is generated oblong or flat along the side surface of a cuboid. In this way, this portion of the fitting simply lies in the same plane as a component. In this way, the connection is generated in this area parallel to a substrate, so that, for example, short circuits are avoided.
Gemäß einer weiteren vorteilhaften Ausgestaltung weist derAccording to a further advantageous embodiment, the
Anschluss eine Formgebung derart auf, dass der Anschluss zum Ausgleich von Toleranzen zu dem Kontaktpartner vor gebogen ist. Das Vorbiegen kann dabei besonders vorteilhaft um die Biegestelle herum erzeugt sein.Connecting a shaping such that the terminal is bent to compensate for tolerances to the contact partner before. The pre-bending can be generated particularly advantageous around the bending point.
Gemäß einer weiteren vorteilhaften Ausgestaltung weist ein einem Bauelement abgewandtes Ende des elektrischen Anschluss die Formgebung auf. Das heißt, besonders vorteilhaft ist Ie- diglich ein relativ kleiner Abschnitt des Anschluss entsprechend den Formgebungen ausgebildet.According to a further advantageous embodiment, an end of the electrical connection facing away from the component has the shape. That is, particularly advantageous is a relatively small portion of the terminal is formed according to the shapes.
Gemäß einer weiteren vorteilhaften Ausgestaltung weist der Anschluss hoch reflektierende Materialien, wie beispielsweise Kupfer, Nickel, Eisen und/oder Aluminium auf.According to a further advantageous embodiment, the terminal has highly reflective materials, such as copper, nickel, iron and / or aluminum.
Gemäß einer weiteren vorteilhaften Ausgestaltung werden der Anschluss und der Kontaktpartner mittels Lasserschweißen und/ oder Laserlöten mechanisch und/oder elektrisch verbunden.According to a further advantageous embodiment, the connection and the contact partner are mechanically and / or electrically connected by means of laser welding and / or laser soldering.
Gemäß dem Verfahren und der Vorrichtung, zum mittels eines Laserstrahls erfolgenden Laserverbinden mindestens eines mechanischen und/oder elektrischen Anschluss mit einem dazuge- hörigen, insbesondere auf einem Substrat angeordneten, Kontaktpartner, ist die horizontale Position der Solllaserstelle in der Aufsetzposition des Anschluss zum Kontaktpartner zur horizontalen Position der Solllaserstelle in der Endposition des Anschluss zum Kontaktpartner identisch. Eine entsprechen- de Vorrichtung zum mittels eines Laserstrahls erfolgenden Laserverbinden mindestens eines elektrischen Anschluss, insbesondere eines elektronischen Bauelements, mit einem dazugehörigen, insbesondere auf einem Substrat angeordneten, Kontaktpartner braucht die horizontale Position des Laserstrahls nur einmal auf die Solllaserstelle eingestellt werden.In accordance with the method and the device for connecting at least one mechanical and / or electrical connection to a laser contact, at least one mechanical and / or electrical connection, the horizontal position of the nominal laser location in the contact position of the connection to the contact partner to the horizontal Position of the nominal laser point in the end position of the connection to the contact partner identical. A corresponding device for the laser joining of at least one electrical connection, in particular an electronic component, with an associated, in particular arranged on a substrate, contact partner, the horizontal position of the laser beam need only be set once to the target laser location.
Gemäß allen Ausführungsformen ist die Qualität der mittels Laser erzeugten Verbindungen zwischen Anschluss und Kontaktpartner im Unterschied zum Stand der Technik sehr hoch.According to all embodiments, the quality of the laser-generated connections between terminal and contact partner in contrast to the prior art is very high.
Die Erfindung wird anhand von Ausführungsbeispielen in Verbindung mit den Figuren näher beschrieben. Es zeigen:The invention will be described in more detail by means of exemplary embodiments in conjunction with the figures. Show it:
Figur 1 ein Ausführungsbeispiel eines Anschlusses gemäß dem Stand der Technik;Figure 1 shows an embodiment of a terminal according to the prior art;
Figur 2 ein erstes Ausführungsbeispiel eines Anschlusses gemäß der vorliegenden Erfindung; Figur 3 ein zweites Ausführungsbeispiel eines Anschlusses gemäß der vorliegenden Erfindung.Figure 2 shows a first embodiment of a terminal according to the present invention; Figure 3 shows a second embodiment of a terminal according to the present invention.
Figur 1 zeigt einen herkömmlichen elektrischen Anschluss 1 eines hier nicht dargestellten elektronischen Bauelements. Das elektronische Bauelement ist rechts von dem Anschluss 1 positioniert angenommen. Es soll eine elektrische und mechanische Verbindung zwischen dem Anschluss 1 und dem dazugehö- rigen Kontaktpartner 3 erzeugt werden. Der Kontaktpartner 3 ist auf einem Substrat 2 angeordnet. Der Anschluss 1 ist zum Ausgleich von Toleranzen zu dem Kontaktpartner 3 hier beispielsweise um 33 ° zur Bauelementebene vor gebogen. Der Anschluss 1 weißt an der Lasersollstelle in einer Aufsetzposi- tion A einen Oberflächenverlauf von der Bauelementseite von fallend 33° zur Bauelementebene zu steigend 23° zur Bauelementebene auf. Der Anschluss 1 weist die Aufsetzposition A relativ zum elektronischen Bauelement und relativ zum Kontaktpartner 3 auf. An dieser Aufsetzposition A berührt der Anschluss 1 den Kontaktpartner 3 an einer ersten Kontaktstelle 5. Das heißt, in der Aufsetzposition A berührt der Anschluss 1 den Kontaktpartner 3 an einer ersten Kontaktstelle 5, die die Sollschweißstelle beziehungsweise Solllaserstelle festlegt. In der Aufsetzposition A hat die Kontaktstelle 5 eine erste Position im Raum. Figur 1 zeigt ein sich Verschieben der Kontaktstelle von der Aufsetzposition A über eine Zwischenposition B zu einer Endposition C durch ein Andrücken des elektronischen Bauelements senkrecht und in Richtung zum Substrat 2 und auf diese Weise erfolgendes Verschieben des auf dem Substrat 2 angeordneten Kontaktpartners 3 senkrecht zum Substrat 2 in Richtung des Anschlusses 1 derart, dass jeweils der nun in der Endposition C zu dem elektronischen Bauelement angeordnete elektrische Anschluss 1 an einer zweiten Kontaktstelle 7 den dazugehörigen Kontaktpartner 3 berührt, wobei die zweite Kontaktstelle 7 ebenso auf dem Kontaktpartner 3, aber in einer Richtung horizontal und parallel zur Substratoberfläche und von dem elektronischen Bauelement weg verschoben positioniert ist. Damit bestimmt die zweite Kon- taktstelle 7 an der der Anschluss 1 den Kontaktpartner 3 berührt eine neu positionierte Solllaserstelle. Die erste Kontaktstelle 5 und die zweite Kontaktstelle 7 weisen unterschiedliche Raumkoordinaten derart auf, dass die zweite Kon- taktstelle 7 ca. 1,0 mm oberhalb der ersten Kontaktstelle 5 und um ca. 0,25 mm horizontal in Richtung weg von dem elektronischen Bauelement positioniert ist. Aufsetzposition A definiert die erste Kontaktstelle 5, an der sich der Anschluss 1 und der Kontaktpartner 3 berühren. Die Endposition C be- stimmt die zweite Kontaktstelle 7, an der sich der Anschluss 1 und der Kontaktpartner 3 berühren. Beide Kontaktstellen bestimmten jeweils die Solllaserstellen. Aus Figur 1 geht deutlich hervor, dass ein Laserstrahl 11 beziehungsweise dessen Laserstrahlachse für die Endposition C um ca. 0,25 mm vom elektronischen Bauelement weg verschoben werden muss, damit eine gleich bleibende Schweiß- bzw. Lötqualität geschaffen werden kann. Das Bezugszeichen x bezeichnet den Betrag, mit dem der Laserstrahl 11 ausgehend von seiner Position in der Aufsetzposition A für die Endposition C verschoben werden muss.Figure 1 shows a conventional electrical connection 1 of an electronic component, not shown here. The electronic component is assumed to be positioned to the right of the terminal 1. An electrical and mechanical connection between the connection 1 and the associated contact partner 3 should be generated. The contact partner 3 is arranged on a substrate 2. The terminal 1 is bent to compensate for tolerances to the contact 3 here, for example, by 33 ° to the component level before. The connection 1 at the laser nominal point in a contact position A has a surface profile from the component side falling from 33 ° to the component plane to rising 23 ° to the component plane. The terminal 1 has the placement position A relative to the electronic component and relative to the contact partner 3. At this placement position A, the terminal 1 contacts the contact partner 3 at a first contact point 5. That is, in the placement position A, the terminal 1 contacts the contact partner 3 at a first contact point 5, which defines the desired welding point or target laser point. In the placement position A, the contact point 5 has a first position in space. FIG. 1 shows a displacement of the contact point from the placement position A via an intermediate position B to an end position C by pressing the electronic component perpendicularly and in the direction of the substrate 2 and thus displacing the contact partner 3 arranged on the substrate 2 perpendicular to the substrate 2 in the direction of the terminal 1 such that each of the arranged now in the end position C to the electronic component electrical contact 1 at a second contact point 7 contacts the associated contact partner 3, wherein the second contact point 7 also on the contact partner 3, but in one direction horizontally and parallel to the substrate surface and is displaced away from the electronic component. This determines the second con- 7 at which the connection 1 contacts the contact partner 3 a newly positioned target laser point. The first contact point 5 and the second contact point 7 have different spatial coordinates such that the second contact point 7 is positioned approximately 1.0 mm above the first contact point 5 and approximately 0.25 mm horizontally in the direction away from the electronic component is. Touching position A defines the first contact point 5, at which the terminal 1 and the contact partner 3 touch. The end position C determines the second contact point 7 at which the connection 1 and the contact partner 3 touch. Both contact points each determined the nominal laser locations. It is clear from FIG. 1 that a laser beam 11 or its laser beam axis for the end position C has to be displaced away from the electronic component by approximately 0.25 mm, so that a constant welding or soldering quality can be created. The reference character x denotes the amount by which the laser beam 11 has to be displaced from its position in the placement position A for the end position C.
Das heißt, bei herkömmlichen Anschlüssen 1 werden diese beim Niederdrücken von Bauelementen, an denen die Anschlüsse 1 beziehungsweise Beinchen zum Ausgleich von Toleranzen zum Kon- taktpartner 3 hin vor gebogen sind, in zwei Bewegungsrichtungen horizontal (x) und vertikal (y) verschoben. Das Bezugszeichen y stellt die Verschiebung der Kontaktstelle, das heißt die Verschiebung der ersten Kontaktstelle 5 zur zweiten Kontaktstelle 7 in vertikaler Richtung dar. X bezeichnet die Verschiebung in horizontaler Richtung zum Substrat 2. Auf diese Weise wandert die Lage der feststehenden Laserschweißstelle in Bezug auf den Anschluss 1 in Richtung zum elektronischen Bauelement, wenn das elektronische Bauelement nieder- oder zum Substrat 2 angedrückt wird. Gemäß Figur 1 ist der Anschluss 1 um 33 ° zur Bauelementebene vor gebogen. Bei Erreichen der Endposition C ist die zweite Kontaktstelle 7 um ca. 1,0 mm vertikal und um ca. 0,25 mm horizontal von der ersten Kontaktstelle 5 verschoben. Für ein hochwertiges La- serverbinden soll kein Spalt zwischen Anschluss 1 und Kontaktpartner 3 ausgebildet sein. Verbleibt der Laserstrahl 11 in seiner ursprünglichen Position so ist der Anschluss 1 zum Kontaktpartner 3 derart beabstandet, dass ein geforderter "0- Spalt" an der Kontaktstelle nicht mehr erzeugt ist. Wird in dieser Position des Lasers 11 gelasert, ist die Qualität der Verbindung reduziert. Die Größe der Verschiebung der Solllaserstelle beziehungsweise der Kontaktstelle ist abhängig von der Länge des Anschluss 1. Gemäß des hier dargestellten Stan- des der Technik ändern sich für den Laserstrahl 11 die mechanischen Schweißparameter beim Verschieben der ersten Kontaktstelle zur zweiten Kontaktstelle. Die Position der Biegestelle 9 beziehungsweise eines Drehpunktes kann berechnet werden. Elektronische Bauelemente sind beispielsweise Widerstände, Kondensatoren, Induktivitäten, Transistoren, Halbleiterchips und dergleichen.That is, in conventional terminals 1, these are displaced in two directions of movement horizontally (x) and vertically (y) when depressing components in which the terminals 1 or legs are bent in order to compensate tolerances for the contact partner 3. The reference symbol y represents the displacement of the contact point, that is, the displacement of the first contact point 5 to the second contact point 7 in the vertical direction. X denotes the displacement in the horizontal direction to the substrate 2. In this way, the position of the fixed laser welding point moves with respect to the Terminal 1 in the direction of the electronic component, when the electronic component is pressed down or to the substrate 2. According to Figure 1, the terminal 1 is bent by 33 ° to the component plane before. When the end position C is reached, the second contact point 7 is displaced vertically by approximately 1.0 mm and horizontally by approximately 0.25 mm from the first contact point 5. For a high quality serverbinden should be formed no gap between port 1 and contact 3 partners. If the laser beam 11 remains in its original position, then the connection 1 to the contact partner 3 is spaced such that a required "0-gap" at the contact point is no longer generated. If lasered in this position of the laser 11, the quality of the connection is reduced. The size of the displacement of the nominal laser point or of the contact point depends on the length of the connection 1. According to the prior art shown here, the mechanical welding parameters for the laser beam 11 change when the first contact point is moved to the second contact point. The position of the bending point 9 or a pivot point can be calculated. Electronic components are, for example, resistors, capacitors, inductors, transistors, semiconductor chips and the like.
Figur 2 zeigt ein erstes Ausführungsbeispiels eines Anschluss 1 eines nicht dargestellten elektronischen Bauelements, das auf der rechten Seite der Figur 2 angeordnet gedacht ist. Der Anschluss 1 kann alle möglichen Arten von Bauteilen, Leitungen und Einrichtungen elektrisch und/oder mechanisch anschließen. A bezeichnet eine Aufsetzposition. Bei dieser Aufsetzposition A berührt der Anschluss 1 an einer Kontaktstelle 5 den Kontaktpartner 3, der auf einem Substrat 2 angeordnet ist. Der Anschluss 1 ist zum Ausgleich von Toleranzen zu dem Kontaktpartner 3 vor gebogen. Das beispielhafte elektronische Bauelement ist mit dem Anschluss 1 auf den Kontaktpartner 3 an einer der Aufsetzposition A zugeordneten ersten Kontakt- stelle 5 aufgesetzt. An der ersten Kontaktstelle 5 berühren sich der Anschluss 1 und der Kontaktpartner 3. Die erste Kontaktstelle 5 bestimmt die Solllaserstelle, an der der Laserstrahl 11 positioniert ist. Figur 2 zeigt ebenso eine Endposition C. Durch Andrücken des elektronischen Bauelements senkrecht in Richtung 21 zum Substrat 2 und durch Bewegen des Anschlusses 1 zum Kontaktpartner 3 zu einer der Endposition C zugeordneten zweiten Kontaktstelle 7 wird der Anschluss 1 relativ zum elektronischen Bauelement verbogen. An der Endposi tion C berühren sich Anschluss 1 und Kontaktpartner 3 an der zweiten Kontaktstelle 7. Beim Andrücken des elektronischen Bauelements zum Substrat 2 wird der Anschluss 1 um die Biegestelle 9 des Anschlusses 1 von der Aufsetzposition A in die Endposition C gedreht. Der Anschluss 1 weist im Einfallsbereich des Laserstrahls 11 eine länglich oder flächig entlang der Oberfläche 13 eines Ellipsoids und konvex zum Kontaktpartner 3 erzeugten Verlauf auf. Durch diese Oberfläche 13 eines Ellipsoids werden für jede Position der Bewegung der Solllaserstelle gleiche mechanische Schweißparameter geschaffen. Das heißt, der Einfallwinkel des Laserstrahls 11 bei der Aufsetzposition A und bei der Endposition C ist gleich. Ebenso liegen die erste Kontaktstelle 5 und die zweite Kontaktstelle 7 auf derselben Achse des Laserstrahls 11. Das heißt, gemäß der vorliegenden Erfindung verschiebt sich die Position der ersten Kontaktstelle 5 zur zweiten Kontaktstelle 7 lediglich in vertikaler Richtung, wohingegen die Position in horizontaler Richtung gleich bleibt. Auf diese Weise bleibt die Laserqualität sowohl in der Aufsetzposition A als auch in der Endposition C gleich hoch. Gemäß Figur 2 ist der Anschluss 1 zwischen der Biegestelle 9 und dem entlang der Oberfläche 13 des Ellipsoids erzeugten Abschnitts, länglich oder flächig entlang der Seitenfläche 15 eines Quaders erzeugt. Dadurch kann der Hebelarm der Oberfläche 13 zur Biegestelle 9 einge- stellt werden. Gemäß Figur 2 ist der Anschluss 1 weiterhin derart erzeugt, dass von der Biegestelle 9 bis zu dem dem elektronischen Bauelement zugewandten Ende, der Anschluss 1 länglich oder flächig entlang der Seitenfläche 19 eines Quaders erzeugt ist. Auf diese Weise ist der Anschluss 1 in die- sem Bereich parallel zum Substrat 2 ausgebildet, sodass Kurzschlüsse vermieden werden. Bezugzeichen 23 zeigt die Richtung in der das Substrat 2 in Richtung zu dem Anschluss 1 relativ verschoben wird. Bezugszeichen 21 zeigt die Richtung der relativen Verschiebung des Anschlusses 1 zum Kontaktpartner 3 beziehungsweise zum Substrat 2. Diese Richtungen liegen in der Vertikalen. Figur 3 zeigt ein zweites Ausführungsbeispiel eines erfindungsgemäßen Anschluss 1. Im Unterschied zum Ausführungsbeispiel gemäß Figur 2 weist der Anschluss 1 eine Formgebung derart auf, dass der Anschluss 1, an dem dem elektronischen Bauelement abgewandten Ende des elektrischen Anschluss 1 und neben dem entlang der Oberfläche 13 des Ellipsoids erzeugten Abschnitts, länglich oder flächig entlang der Seitenfläche 17 eines Quaders erzeugt ist. Länglich oder flächig entlang den Seitenflächen 15, 17 und 19 bedeutet lediglich entlang einer Seitenfläche eines Quaders. Kantenbereiche eines Quaders sind hier ausgeschlossen. Das heißt, der Verlauf der Oberflächen 15, 17, und 19 ist gerade und nicht entlang einer Kante geknickt. Mit der Formgebung gemäß Figur 3 ist ein ausgeformter Anschluss 1 erzeugt, der mit dem dem Bauelement abgewandten Ende mit der Seitenfläche 17 als ein Laserstrahlreflexions- Schutz dient. Das heißt, durch diese Formgebung wird ein in Richtung des dem Bauelement abgewandten Ende des Anschlusses 1 abgelenkter Laserstrahl wieder in Richtung der Laserstrahlachse 11 derart zurück reflektiert, dass keine umliegenden Bauteile zerstört werden.Figure 2 shows a first embodiment of a terminal 1 of an electronic device, not shown, which is intended to be arranged on the right side of Figure 2. The connector 1 can electrically and / or mechanically connect all possible types of components, lines and devices. A denotes an attachment position. In this placement position A, the terminal 1 contacts the contact partner 3 at a contact point 5, which is arranged on a substrate 2. The terminal 1 is bent to compensate for tolerances to the contact partner 3 before. The exemplary electronic component is placed with the connection 1 on the contact partner 3 at a first contact point 5 assigned to the placement position A. At the first contact point 5, the connection 1 and the contact partner 3 touch each other. The first contact point 5 determines the desired laser location at which the laser beam 11 is positioned. FIG. 2 likewise shows an end position C. By pressing the electronic component perpendicularly in the direction 21 to the substrate 2 and moving the connection 1 to the contact partner 3 to a second contact point 7 assigned to the end position C, the connection 1 is bent relative to the electronic component. At the endposi tion C contact terminal 1 and contact 3 at the second contact point 7. When pressing the electronic component to the substrate 2, the terminal 1 is rotated about the bending point 9 of the terminal 1 from the placement position A in the end position C. In the region of incidence of the laser beam 11, the connection 1 has a course which is elongated or flat along the surface 13 of an ellipsoid and convex to the contact partner 3. By means of this surface 13 of an ellipsoid, the same mechanical welding parameters are created for each position of the movement of the nominal laser spot. That is, the incident angle of the laser beam 11 at the touchdown position A and at the end position C is the same. Likewise, according to the present invention, the position of the first pad 5 to the second pad 7 shifts only in the vertical direction, whereas the position in the horizontal direction remains the same , In this way, the laser quality remains the same in both the placement position A and in the end position C. According to FIG. 2, the connection 1 is produced between the bending point 9 and the section produced along the surface 13 of the ellipsoid, oblong or flat along the side surface 15 of a cuboid. As a result, the lever arm of the surface 13 can be adjusted to the bending point 9. According to Figure 2, the terminal 1 is further generated such that from the bending point 9 to the electronic component facing the end, the terminal 1 is generated oblong or flat along the side surface 19 of a cuboid. In this way, the terminal 1 is formed in this area parallel to the substrate 2, so that short circuits are avoided. Reference numeral 23 shows the direction in which the substrate 2 is relatively displaced toward the terminal 1. Reference numeral 21 shows the direction of relative displacement of the terminal 1 to the contact partner 3 and the substrate 2, respectively. These directions are in the vertical. FIG. 3 shows a second exemplary embodiment of a connection 1 according to the invention. In contrast to the exemplary embodiment according to FIG. 2, the connection 1 has a shape such that the connection 1 adjoins the end of the electrical connection 1 facing away from the electronic component and alongside the surface 13 of the ellipsoid-generated portion is generated oblong or flat along the side surface 17 of a cuboid. Oblong or flat along the side surfaces 15, 17 and 19 means only along a side surface of a cuboid. Edge areas of a cuboid are excluded here. That is, the course of the surfaces 15, 17, and 19 is straight and not kinked along an edge. With the shaping according to FIG. 3, a molded connection 1 is produced which, with the end facing away from the component, serves with the side face 17 as a laser beam reflection protection. That is, by this shaping, a laser beam deflected in the direction of the end of the terminal 1 facing away from the component is again reflected back in the direction of the laser beam axis 11 in such a way that no surrounding components are destroyed.
Gemäß den Ausführungsbeispielen gemäß Figur 2 und Figur 3 ist es nicht erforderlich die einmal festgelegte Position eines Laserstrahls 11 zu verändern. Der Anschluss 1 ist derart er- zeugt, dass der Laserstrahl 11 immer senkrecht auf die Oberfläche des Anschlusses 1 auftrifft und immer an den Stellen auftrifft, an denen Anschluss 1 und Kontaktpartner 3 sich berühren. Ein Beispiel für ein Ellipsoid kann ein zusammengedrücktes Rotationsellipsoid ein. According to the embodiments according to FIG. 2 and FIG. 3, it is not necessary to change the once fixed position of a laser beam 11. The connection 1 is generated in such a way that the laser beam 11 always impinges perpendicularly on the surface of the connection 1 and always impinges on the points at which connection 1 and contact partner 3 come into contact. An example of an ellipsoid may be a compressed ellipsoid of revolution.

Claims

Patentansprüche claims
1. Mechanischer und/oder elektrischer Anschluss (1), der mit einem dazugehörigen Kontaktpartner (3) mittels Laser (11) me- chanisch und/oder elektrisch verbindbar ist, dadurch gekennzeichnet, dass der Anschluss (1) eine Formgebung derart aufweist, dass der Anschluss (1) länglich oder flächig entlang der Oberfläche (13) eines Ellipsoids und konvex zum Kontaktpartner (3) er- zeugt ist.1. Mechanical and / or electrical connection (1) which is mechanically and / or electrically connectable to a corresponding contact partner (3) by means of laser (11), characterized in that the connection (1) has a shape such that the connection (1) is generated oblong or flat along the surface (13) of an ellipsoid and convex to the contact partner (3).
2. Anschluss (1) nach Anspruch 1, dadurch gekennzeichnet, dass der Anschluss (1) der mechanische und/oder elektrische An- Schluss einer elektrischen Leitung, eines elektronischen Bauelements oder einer Einrichtung ist.2. Connection (1) according to claim 1, characterized in that the connection (1) is the mechanical and / or electrical connection of an electrical line, an electronic component or a device.
3. Anschluss (1) nach Anspruch 1 oder 2, dadurch gekennzeichnet, dass der Kontaktpartner (3) auf einem Substrat (2) angeordnet ist.3. connection (1) according to claim 1 or 2, characterized in that the contact partner (3) on a substrate (2) is arranged.
4. Anschluss (1) nach einem oder mehreren der vorangehenden Ansprüche 1 bis 3, dadurch gekennzeichnet, dass der Anschluss (1) eine Formgebung derart aufweist, dass der4. terminal (1) according to one or more of the preceding claims 1 to 3, characterized in that the terminal (1) has a shape such that the
Anschluss (1) um eine Biegestelle (9) des Anschlusses (1) von einer einer Aufsetzposition (A) zugeordneten ersten Kontaktstelle (5), an der sich Anschluss (1) und Kontaktpartner (3) berühren, in eine einer Endposition (C) zugeordneten zweiten Kontaktstelle (7), an der sich Anschluss (1) und Kontaktpartner (3) berühren, drehbar erzeugt ist.Connection (1) about a bending point (9) of the terminal (1) from a first contact point (5), which is assigned to a contact position (A), at which terminal (1) and contact partner (3) touch one another in one of an end position (C). associated second contact point (7) at which contact terminal (1) and contact partner (3) touch, is rotatably generated.
5. Anschluss (1) nach Anspruch 4, dadurch gekennzeichnet, dass der Anschluss (1) eine Formgebung derart aufweist, dass der Anschluss (1), zwischen der Biegestelle (9) und dem entlang der Oberfläche (13) des Ellipsoids erzeugten Abschnitts, länglich oder flächig entlang der Seitenfläche (15) eines Quaders erzeugt ist.A terminal (1) according to claim 4, characterized in that the terminal (1) has a shape such that the terminal (1), between the bending point (9) and the portion generated along the surface (13) of the ellipsoid, is generated oblong or flat along the side surface (15) of a cuboid.
6. Anschluss (1) nach einem oder mehreren der vorangehenden Ansprüche 1 bis 5, dadurch gekennzeichnet, dass der Anschluss (1) eine Formgebung derart aufweist, dass der Anschluss (1), an einem Ende des elektrischen Anschluss (1) und neben dem entlang der Oberfläche (13) des Ellipsoids er- zeugten Abschnitt, länglich oder flächig entlang der Seitenfläche (17) eines Quaders erzeugt ist.6. terminal (1) according to one or more of the preceding claims 1 to 5, characterized in that the terminal (1) has a shape such that the terminal (1), at one end of the electrical connection (1) and adjacent to the along the surface (13) of the ellipsoid generated section, is generated oblong or flat along the side surface (17) of a cuboid.
7. Anschluss (1) nach einem oder mehreren der vorangehenden Ansprüche 4 bis 6, dadurch gekennzeichnet, dass der Anschluss (1) eine Formgebung derart aufweist, dass der Anschluss (1), von der Biegestelle (9) in Richtung weg von dem entlang der Oberfläche (13) des Ellipsoids erzeugten Abschnitt, länglich oder flächig entlang der Seitenfläche (19) eines Quaders erzeugt ist.7. connection (1) according to one or more of the preceding claims 4 to 6, characterized in that the terminal (1) has a shape such that the terminal (1), from the bending point (9) in the direction away from along the surface (13) of the ellipsoid generated portion, oblong or flat along the side surface (19) of a cuboid is generated.
8. Anschluss (1) nach einem oder mehreren der vorangehenden Ansprüche 2 bis 7, dadurch gekennzeichnet, dass der Anschluss (1) eine Formgebung derart aufweist, dass der Anschluss (1) zum Ausgleich von Toleranzen zu dem Kontaktpartner (3), beispielsweise 1° bis 40° zur Ebene der Leitung, des Bauelements oder der Einrichtung vor gebogen ist.8. Terminal (1) according to one or more of the preceding claims 2 to 7, characterized in that the terminal (1) has a shape such that the terminal (1) to compensate for tolerances to the contact partner (3), for example 1 ° is bent to 40 ° to the level of the line, the device or the device before.
9. Anschluss (1) nach einem oder mehreren der vorangehenden9. Connection (1) according to one or more of the preceding
Ansprüche 1 bis 8, dadurch gekennzeichnet, dass ein Ende des elektrischen Anschluss (1) die Formgebung aufweist.Claims 1 to 8, characterized in that one end of the electrical connection (1) has the shape.
10. Anschluss (1) nach einem oder mehreren der vorangehenden10. Connection (1) according to one or more of the preceding
Ansprüche 1 bis 9, dadurch gekennzeichnet, dass der Anschluss (1) hoch reflektierende Materialien, beispielsweise Kupfer Cu, Nickel Ni, Eisen Fe und/oder Aluminium Al aufweist .Claims 1 to 9, characterized in that the connection (1) has highly reflective materials, for example copper Cu, nickel Ni, iron Fe and / or aluminum Al.
11. Anschluss (1) nach einem oder mehreren der vorangehenden Ansprüche 1 bis 10, dadurch gekennzeichnet, dass11. Connection (1) according to one or more of the preceding claims 1 to 10, characterized in that
Anschluss (1) und Kontaktpartner (3) mittels Laserschweißen und/oder Laserlöten verbindbar sind.Connection (1) and contact partners (3) can be connected by means of laser welding and / or laser soldering.
12. Verfahren zum mittels eines Laserstrahls (11) erfolgenden Laserverbinden mindestens eines mechanischen und/oder elektrischen Anschluss (1) nach einem oder mehreren der vorangehenden Ansprüche 1 bis 11 mit einem dazugehörigen Kontakt- partner (3) , mit den Schritten12. A method for taking place by means of a laser beam (11) laser connecting at least one mechanical and / or electrical connection (1) according to one or more of the preceding claims 1 to 11 with an associated contact partner (3), with the steps
- Aufsetzen des Anschlusses (1) auf den Kontaktpartner (3) an einer einer Aufsetzposition (A) zugeordneten ersten Kontaktstelle (5), an der sich Anschluss (1) und Kontaktpartner (3) berühren, - Positionieren einer Einrichtung zur Erzeugung des Laserstrahls (11) auf die der ersten Kontaktstelle (5) zugeordneten Solllaserstelle auf der konkaven Seite des Anschlusses- placing the terminal (1) onto the contact partner (3) at a first contact point (5) assigned to an attachment position (A), at which terminal (1) and contact partner (3) come in contact, - positioning a device for generating the laser beam ( 11) on the first contact point (5) associated Solllaserstelle on the concave side of the terminal
(D,(D,
- Andrücken des Kontaktpartners (3) senkrecht in Richtung (23) zum Anschluss (1) und Bewegen des Kontaktpartners (3) zum Anschluss (1) zu einer einer Endposition (C) zugeordneten zweiten Kontaktstelle (7), an der sich Anschluss (1) und Kontaktpartner (3) berühren, gekennzeichnet durchPressing the contact partner (3) perpendicularly in the direction (23) to the connection (1) and moving the contact partner (3) to the connection (1) to a second contact point (7) assigned to an end position (C), at which connection (1 ) and contact partners (3), characterized by
- Drehen des Anschlusses (1) um eine Biegestelle (9) des An- Schlusses (1), von der Aufsetzposition (A) in die Endposition- Turning the connection (1) about a bending point (9) of the connection (1), from the placement position (A) in the end position
(C), wobei der Anschluss (1) länglich oder flächig entlang der Oberfläche (13) eines Ellipsoids, konvex zum Kontaktpartner (3) erzeugt ist, und(C), wherein the terminal (1) is generated oblong or flat along the surface (13) of an ellipsoid, convex to the contact partner (3), and
- mittels des positionierten Laserstrahls (11) erfolgendes Lasern des Anschlusses (1) an den Kontaktpartner (3) in der- By means of the positioned laser beam (11) taking place lasing the terminal (1) to the contact partner (3) in the
Endposition (C) . End position (C).
13. Vorrichtung zum mittels eines Laserstrahls (11) erfolgenden Laserverbinden mindestens eines mechanischen und/oder elektrischen Anschluss (1) nach einem oder mehreren der vorangehenden Ansprüche 1 bis 11 mit einem dazugehörigen Kon- taktpartner (3) , mit13. An apparatus for laser-connecting by means of a laser beam (11) at least one mechanical and / or electrical connection (1) according to one or more of the preceding claims 1 to 11 with an associated contact partner (3), with
- einer Einrichtung zum Aufsetzen des Anschlusses (1) auf den Kontaktpartner (3) an einer einer Aufsetzposition (A) zugeordneten ersten Kontaktstelle (5), an der sich Anschluss (1) und Kontaktpartner (3) berühren, - einer Einrichtung zum Positionieren des Laserstrahls (11) auf die der ersten Kontaktstelle (5) zugeordneten Solllaserstelle auf der konkaven Seite des Anschlusses (1),a device for placing the connection (1) on the contact partner (3) at a first contact point (5) assigned to a contact position (A), at which contact (1) and contact partner (3) touch, - a device for positioning the Laser beam (11) on the first contact point (5) associated with the target laser point on the concave side of the terminal (1),
- einer Einrichtung zum Andrücken des Kontaktpartners (3) senkrecht in Richtung (23) zum Anschluss (1) und Bewegen des Kontaktpartners (3) zum zu einer einer Endposition (C) zugeordneten zweiten Kontaktstelle (7), an der sich Anschluss (1) und Kontaktpartner (3) berühren und zum dabei erfolgenden Drehen des Anschlusses (1) um eine Biegestelle (9) des Anschlusses (1), von der Aufsetzposition (A) in die Endposition (C), wobei der Anschluss (1) länglich oder flächig entlang der Oberfläche (13) eines Ellipsoids, konvex zum Kontaktpartner (3) erzeugt ist, und- A device for pressing the contact partner (3) perpendicular in the direction (23) for connection (1) and moving the contact partner (3) to one of an end position (C) associated with the second contact point (7) to which connection (1) and the contact partner (3) and for thereby rotating the connection (1) about a bending point (9) of the connection (1), from the placement position (A) into the end position (C), wherein the connection (1) is elongated or planar along the surface (13) of an ellipsoid, convex to the contact partner (3) is generated, and
- eine Einrichtung zum erfolgenden Lasern des Anschlusses (1) mittels des positionierten Laserstrahls (11) an den Kontakt- partner (3) in der Endposition (C) . - A device for successive lasing of the terminal (1) by means of the positioned laser beam (11) to the contact partner (3) in the end position (C).
PCT/EP2008/050497 2007-02-09 2008-01-17 Connection, method and device for the uniform coupling-in of laser beams during laser welding and laser soldering, in particular on highly reflective materials WO2008095755A1 (en)

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DE102007006601A DE102007006601B4 (en) 2007-02-09 2007-02-09 Connection, method and device for the uniform coupling of laser beams during laser welding and laser soldering, in particular on highly reflective materials

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