WO2008100101A1

WO2008100101A1 - Probe card including a plurality of connectors and method of bonding the connectors to a substrate of the probe card

Info

Publication number: WO2008100101A1
Application number: PCT/KR2008/000890
Authority: WO
Inventors: Jung-Hoon Lee
Original assignee: Phicom Corporation
Priority date: 2007-02-16
Filing date: 2008-02-15
Publication date: 2008-08-21
Also published as: CN101611486B; KR20080076457A; JP2010519508A; KR100855302B1; TWI363456B; TW200840150A; CN101611486A

Abstract

In a probe card for inspecting a semiconductor device and a flat panel display device, first and second substrate structures and a plurality of connectors are provided. The first substrate structure has a plurality of connection holes. A conductive layer is located on an inner surface of each of the connection holes and connected to a signal line in the first substrate. The second substrate structure has a contact pad at an upper portion thereof and a plurality of probes that make contact with an inspection object at a lower portion thereof. Each of the connectors includes a first contact portion secured to the contact pad of the second substrate structure and a second contact portion inserted into each of the connection holes and making contact with the conductive layer. Accordingly, the second substrate structure may be prevented from being deformed by a vertical external force due to the connectors.

Description

PROBE CARD INCLUDING A PLURALITY OF CONNECTORS

AND METHOD OF BONDING THE CONNECTORS TO A

SUBSTRATE OF THE PROBE CARD

Technical Field

[1] Example embodiments of the present invention relate to a probe card for inspecting a semiconductor device and/or a flat panel display device and a method of bonding connectors in the probe card, and more particularly, relate to a probe card including a plurality of connectors and a method of bonding the connectors to a substrate of the probe card. Background Art

[2] Semiconductor devices are generally manufactured through a series of unit processes such as a fab process, an electrical die sorting (EDS) process and a packaging process. Various electric circuits and devices are fabricated on a semiconductor substrate such as a silicon wafer in the fab process, and electrical characteristics of the electric circuits are inspected and defective chips are detected in the wafer in the EDS process. Then, the devices are individually separated from the wafer and each device is sealed in an epoxy resin and packaged into an individual semiconductor device in the packaging process.

[3] A repairable defective chip is regenerated in a repair process and an irreparable defective chip is removed from the wafer prior to an assembly process of the packaging process. Accordingly, the EDS process significantly reduces the cost of the assembly process, to thereby increase production yields of semiconductor devices. A well-known apparatus for the EDS process includes a probe card in which a plurality of probes is installed. Each of the probes makes contact with a conductive pad of an inspection object, such as a wafer, and detects electrical signals from the inspection object.

[4] FIG. 1 is a cross-sectional view illustrating a conventional probe card.

[5] Referring to FIG. 1, a conventional probe card 1 includes a first substrate structure 10 having a connection hole 14, a second substrate structure 20 having a contact pad 22 at an upper portion thereof and a plurality of probes (not shown) making direct contact with an inspection object, and a connector 30 connecting the first and second substrate structures 10 and 20.

[6] The connector 30 includes an elastic portion 32 that is capable of being elastically deformed and makes point contact with the contact pad 22, and a securing portion 34 that is inserted into the connection hole 14 and is secured to the first substrate structure 10. The elastic portion 32 of the connector 30 makes contact with the contact pad 22 in a direction perpendicular to a top surface of the contact pad 22. The conventional probe card includes a plurality of the connectors 30, and the heights of the connectors 30 are different from one another in accordance with the horizontal level of the first structure 10, the horizontal level of the second structure 20 and a surface profile of the inspection object with which the probe comes into contact. A compression force is applied to the connectors 30 toward the contact pad 22, and thus the connectors 30 are forced to make contact with the contact pad 22.

[7] However, there is a problem in that the compression force applied to the connectors

30 applies pressure to the second structure 20 that is arranged perpendicular to the connectors 30 and may cause deformation of the second structure 20. As the size of the first and second structures 10 and 20 is increased and the number of the connectors 30 is increased, the compression force applied to the second structure 20 is increased, to thereby cause much larger deformation of the second structure 20. In addition, contaminants and/or pollutants at an end portion of the elastic portion 32 may frequently cause contact failures between the connectors 30 and the contact pad 22. Further, the elastic deformation of the connectors 30 requires elongation of the elastic portion 32, and the elongation of the elastic portion 32 may lead to an increase in electrical resistance and a reduction in the electrical performance of the connectors 30. Disclosure of Invention

Technical Problem

[8] Accordingly, the present invention provides a probe card in which a lower substrate may be prevented from being deformed by a vertical external force caused through a connector.

[9] The present invention also provides a method of bonding the connector to the lower substrate of the probe card. Technical Solution

[10] According to an aspect of the present invention, there is provided a probe card comprising a first substrate structure, a second substrate structure and a plurality of connectors. The first substrate structure has a plurality of first connection holes and a first conductive layer is located on an inner surface of each of the first connection holes and is connected to a signal line in the first substrate structure. The second substrate structure has a contact pad at an upper portion thereof and a plurality of probes that make contact with an inspection object at a lower portion thereof. Each of the connectors includes a first contact portion and a second contact portion. The first contact portion is secured to the contact pad of the second substrate structure and the second contact portion is inserted into each of the first connection holes and makes contact with the first conductive layer in each of the first connection holes.

[11] In an example embodiment, the first contact portion is secured to the contact pad by a solder. The second contact portion is shaped into a ring, so that the first conductive layer makes point contact with the second contact portion at least two locations thereof. Particularly, the second contact portion is shaped into an O -ring.

[12] In an example embodiment, the probe card may further include a socket positioned at a lower surface of the first substrate structure and having a second connection hole into which each of the connectors is inserted. The second conductive layer is located on an inner surface of the second connection hole and is connected to a signal line in the first substrate. The socket includes a first sub-socket secured to the lower surface of the first substrate structure, and a second sub-socket coupled to the first sub-socket and sliding with respect to the first sub-socket, so that the connectors inserted into the first connection holes are secured to the first substrate structure due to the sliding of the second sub-socket with respect to the first sub-socket.

[13] In an example embodiment, each of the first connection holes is connected to the second connection hole.

[14] In an example embodiment, the second contact portion has substantially the same size as the first and the second contact holes.

[15] In an example embodiment, the diameter of the second connection hole of the socket is smaller than that of each of the connectors.

[16] According to another aspect of the present invention, there is provided another probe card comprising a first substrate structure having a plurality of signal lines, a second substrate structure, a plurality of connectors and a socket. The second substrate structure has a contact pad at an upper portion thereof and a plurality of probes that make contact with an inspection object at a lower portion thereof. The connectors are secured to the contact pad of the second substrate structure. The socket is positioned at a lower surface of the first substrate structure and has a plurality of connection holes into which the connectors are inserted, respectively. A conductive layer is located on an inner surface of each of the connection holes and is connected to a signal line in the first substrate structure.

[17] In an example embodiment, the socket includes a first sub-socket secured to the lower surface of the first substrate structure and a second sub-socket coupled to the first sub-socket and sliding with respect to the first sub-socket, so that each of the connectors inserted into the connection holes are secured to the first substrate structure due to the sliding of the second sub-socket with respect to the first sub-socket.

[18] In an example embodiment, the connection hole is shaped into a bar, and the diameters of the connection holes are larger than those of the connectors.

[19] According to the example embodiments, the connector is firmly secured to the second substrate and is movingly secured to the first substrate in such a manner that the connector may slide along the connection hole penetrating through the first substrate, so that no external force may be applied to the second substrate structure by the connector despite the displacement of the first and second substrate structures, to thereby prevent the deformation of the second substrate structure. In addition, the connector is secured to the contact pad by the solder, to thereby minimize contact failures between the connector and the contact pad. Furthermore, the connector may not need to be elastically deformed, and thus the connector may have a larger cross- sectional area with a shorter length to thereby reduce electrical resistance. As a result, the electrical performance of a probe card may be sufficiently increased.

[20] According to still another aspect of the present invention, there is provided a method of bonding a connector to a substrate of a probe card. A guide plate including a plurality of stacked plates is provided. The guide plate includes a plurality of penetrating holes penetrating through each of the plates. A plurality of connectors is inserted into the penetrating holes, respectively. The connectors are coupled to the guiding plate by sliding one of the plates with respect to other plates, and the connectors coupled to the guiding plate is secured to an upper surface of a substrate including a plurality of probes at a lower surface thereof.

[21] In an example embodiment, after securing the connectors to the upper surface of the substrate, the guiding plate is uncoupled from the connectors, and the guiding plate is separated from the connectors.

[22] In an example embodiment, the connectors are secured to the upper surface of the substrate through the following steps. A plurality of solders is formed on an upper surface of the substrate, and the connectors coupled with the guiding plate are brought into contact with the solders, respectively. The solders are heated, to thereby be reflowed, and then are cooled by a cooling process.

[23] In an example embodiment, a gap distance between the solders is substantially the same as a gap distance between the penetrating holes.

Advantageous Effects

[24] According to the example embodiments of the present invention, a connector is firmly secured to a second substrate and is movingly secured to a first substrate in such a manner that the connector may slide along a connection hole penetrating the first substrate. That is, the connector may be restricted in a horizontal direction of the first substrate, and move without any constraints in a vertical direction of the first substrate. Therefore, no external force may be applied to the second substrate structure by the connector despite the displacement of the first and second substrate structures, to thereby prevent the deformation of the second substrate structure. In addition, the connector is secured to a contact pad by a solder, to thereby minimize contact failures between the connector and the contact pad. Furthermore, the connector may not need to be elastically deformed, and thus the connector may have a larger cross-sectional area with a shorter length to thereby reduce electrical resistance. As a result, the electrical performance of a probe card may be sufficiently increased.

[25] Further, a plurality of connectors may be simultaneously bonded to accurate locations on a contact pad on a bottom substrate, thereby improving the efficiency and reliability of the bonding process of the connector.

[26] According to example embodiments of the present invention, the connectors may be accurately bonded to desired positions, respectively, using the guide plate. Brief Description of the Drawings

[27] The above and other features and advantages of the invention will become readily apparent by reference to the following detailed description when considered in conjunction with the accompanying drawings wherein:

[28] FIG. 1 is a cross-sectional view illustrating a conventional probe card;

[29] FIG. 2 is a cross-sectional view illustrating a probe card in accordance with an example embodiment of the present invention;

[30] FIG. 3 is a partially enlarged view of a portion A in FIG. 2;

[31] FIG. 4 is a cross-sectional view illustrating a probe card in accordance with another example embodiment of the present invention;

[32] FIG. 5 is a partially enlarged view of a portion A' in FIG. 4;

[33] FIG. 6 is a cross-sectional view illustrating a probe card in accordance with still another example embodiment of the present invention;

[34] FIG. 7 is a partially enlarged view of a portion A" in FIG. 6; and

[35] FIGS. 8 to 13are cross-sectional views illustrating a method of bonding the connector in the probe card in accordance with an example embodiment of the present invention. Best Mode for Carrying Out the Invention

[36] It should be understood that the example embodiments of the present invention described below may be modified in many different ways without departing from the inventive principles disclosed herein, and the scope of the present invention is therefore not limited to these particular following embodiments. Rather, these embodiments are provided so that this disclosure will be through and complete, and will fully convey the concept of the invention to those skilled in the art by way of example and not of limitation.

[37] Hereinafter, the present invention will be described in detail with reference to the accompanying drawings.

[38] FIG. 2 is a cross-sectional view illustrating a probe card in accordance with an example embodiment of the present invention, and FIG. 3 is a partially enlarged view of a portion A in FIG. 2.

[39] Referring to FIGS. 2 and 3, a probe card 100 according to an example embodiment of the present invention includes first and second substrate structures 110 and 120, a connector 130, a securing plate 140 and a horizontal level-controlling member 150.

[40] In an example embodiment, the first substrate structure 110 includes a plurality of signal lines (not shown) in the interior thereof and includes a plurality of connection holes 112. The connection holes 112 connect to the signal lines and penetrate through the first substrate structure 110. A conductive layer 114 is formed on an inner surface of the connection holes. The conductive layer 114 may comprise a conductive material such as copper (Cu). The signal lines are electrically connected to an additional tester (not shown).

[41] The second substrate structure 120 is positioned below the first substrate structure

110, and includes a bottom substrate 122, a contact pad 124, a probe 126 and a signal line 128.

[42] For example, the bottom substrate 122 may be shaped into a plate and have a smaller size than the first substrate structure 110.

[43] A plurality of the contact pads 124 is arranged on a top surface of the bottom substrate 122, and comprises conductive materials.

[44] A plurality of the probes 126 is protruded from a bottom surface of the bottom substrate 122. The probe 122 may be formed separately from the bottom substrate 122, and may be installed onto the bottom surface of the bottom substrate 122. Otherwise, the probe 122 may be formed on the bottom surface of the bottom substrate 122 in one body. While the present example embodiment discloses a cantilever-type probe, a vertical-type probe or any other configuration known to one of the ordinary skill in the art may also be utilized in place of or in conjunction with the cantilever-type probe.

[45] The signal line 128 is positioned in the interior of the bottom substrate 122, and the probe 126 is electrically connected to the contact pad 124. For example, the signal line 128 may include multilayer wirings, each of which is electrically connected with one another through a contact plug or a via.

[46] A capacitor (not shown) may be connected to the signal line 128. For example, the capacitor may be positioned on a top surface or the bottom surface of the bottom substrate 122. Otherwise, the capacitor may also be positioned in the interior of the bottom substrate 122. Noise in an electrical signal or distorted signals passing through the signal line 128 may be grounded by the capacitor, to thereby prevent the noise and distortion of the electrical signal. In addition, when input power is insufficiently applied to an inspection object, the capacitor may also compensate for the shortage of the input power. [47] The connector 130 electrically connects the first and second substrate structures 110 and 120 with each other. In an example embodiment, the connector 130 may electrically connect the conductive layer 114 of each of the connection holes 112 and the contact pad 124, and may comprise a conductive material such as a metal.

[48] In an example embodiment, the connector 130 may include a first contact portion

132 that is secured to the contact pad 124 of the second substrate structure 120 and a second contact portion 134 that is connected to the first contact portion 132 and is inserted into each of the connection holes 112 of the first substrate structure 110. For example, the first contact portion 132 may be shaped into a square block, and the second contact portion 134 may be shaped into a hook, as shown in FIGS. 2 and 3. Alternatively, although not shown in figures, the second contact portion 134 may be shaped into an O -ring.

[49] The first contact portion 132 is secured to the contact pad 124 by a solder, and thus the connector 130 is secured to the second substrate structure 120. The second contact portion 134 is inserted into each of the connection holes 112. In the present embodiment, the hook-shaped second contact portion 134 is inserted into each of the connection holes 112 using a shrink-fit method, to thereby be compressed in the connection holes 112. Once the second contact portion 134 is installed in each of the connection holes 112 using the shrink-fit method, a restoring force is applied to the second contact portion 134 due to elasticity thereof and the conductive layer 114 of the connection holes 112 makes contact with the second contact portion 134 of the connector 130. In the present embodiment, the conductive layer 114 makes contact with the second contact portion 134 at least two points, because the second contact portion 134 is shaped into a hook. Any modifications of the shape of the second contact portion 134 would lead to an increase of the number of contact points of the second contact portion 134 and the conductive layer 114, as would be known to one of the ordinary skill in the art.

[50] Accordingly, the connector 130 is secured to the second substrate structure 120 and is movably connected to the first substrate structure 110, so that the connector 130 may move up and down while maintaining the contact with the first substrate structure 110. That is, although the first and second substrate structures 110 and 120 are not parallel with each other or one of the first and second substrate structures 110 and 120 moves up and down, the second contact portion 134 of the connector 130 maintains the physical contact with the conductive layer 114 while moving up and down. As a result, no external vertical force is applied to the second substrate structure 120 by the connector 130 because the connector 130 slides along the conductive layer 114, to thereby prevent deformation of the second substrate structure 120. In addition, the connector 130 is secured to the contact pad 124 by the solder 136, thereby minimizing contact failures between the connector 130 and the contact pad 124. Furthermore, the connector 130 may not need to be elastically deformed, thereby reducing the length of the connector 130. As a result, the electrical resistance of the connector 130 may be sufficiently reduced, to thereby improve the electrical performance of the probe card 100.

[51] Although the above example embodiment discusses the second contact portion 134 having a hook shape, the second contact portion 134 may have any other modifications in shape, such as an O -ring, only if the second contact portion 134 makes contact with the conductive layer 114, as would be known to one of the ordinary skill in the art.

[52] The securing plate 140 secures the first and second substrate structures 110 and 120 with each other, and includes a first plate 141, a second plate 142, a third plate 143, a leaf spring 144 and a plurality of bolts (not shown).

[53] The first plate 141 is shaped into a disk, and is positioned on an upper surface of the first substrate structure 110. The second plate 142 is shaped into a ring, and is positioned at a peripheral portion of a lower surface of the first substrate structure 110. The first plate 141, the first substrate structure 110 and the second plate 142 are secured to one another by a first bolt 145. The third plate 143 is shaped into a ring smaller than the second plate 142, and surrounds a sidewall of the second substrate structure 120. The leaf spring 144 makes contact with the second and third plates 142 and 143. The second plate 142 and the leaf spring 144 are secured to each other by a second bolt 146, and the third plate 143 and the leaf spring 144 are secured to each other by a third bolt 147.

[54] The horizontal level-controlling member 150 penetrates the first plate 141 and the first substrate structure 110, and makes contact with an upper surface of the second substrate structure 120. When a thickness of the bottom substrate 122 of the second substrate structure 120 is varied in a longitudinal direction, the probes 126 may be difficult to position at the same level even though the first and second substrate structures 110 and 120 are positioned at the same level. The horizontal level- controlling member 150 controls an amount of external force applied to the upper surface of the second substrate structure 120 in such a manner that the tips of the probes 126 are positioned at the same level, to thereby control the horizontal level of the lower surface of the second substrate structure 120.

[55] FIG. 4 is a cross-sectional view illustrating a probe card in accordance with another example embodiment of the present invention, and FIG. 5 is a partially enlarged view of a portion A' in FIG. 4.

[56] Referring to FIGS. 4 and 5, a probe card 200 according to another example embodiment of the present invention includes first and second substrate structures 210 and 220, a connector 230, a securing plate 240, a horizontal level-controlling member 250 and a socket 260.

[57] The probe card 200 of the present embodiment has substantially the same structure as the probe card 100 described with reference to FIGS. 2 and 3, except for the connector 230 and the socket 260, and thus any further detailed descriptions on the first and second substrate structures 210 and 220, the securing plate 240 and the horizontal level-controlling member 250 are omitted hereinafter.

[58] In an example embodiment, the connector 230 electrically connects the first and second substrate structures 210 and 220 with each other. For example, the connector 230 may electrically connect a first conductive layer 214 of a first connection hole 212 and the contact pad 224, and may comprise a conductive material such as a metal.

[59] In the present embodiment, the connector 230 may include a first contact portion 232 that is secured to the contact pad 224 of the second substrate structure 220 and a second contact portion 234 that is inserted into the first connection hole 212 of the first substrate structure 210 and into a second connection hole 262 of the socket 260. For example, the first contact portion 232 may be shaped into a block and is secured to the contact pad 224 by a solder 236, so that the connector 230 is secured to the second substrate structure 230. The second contact portion 234 is shaped into a bar of which the size is smaller than the first and second connection holes 212 and 262.

[60] The socket 260 is positioned at a lower surface of the first substrate structure 210 and has the second connection hole 262 corresponding to the first connection hole 212. In the present embodiment, the second connection hole 262 is connected to the first connection hole 212, and has a diameter that is substantially the same as that of the first connection hole 212. A second conductive layer 264 is positioned on an inner surface of the second connection hole 262, and is electrically connected to a signal line in the first substrate structure 210. The second conductive layer 264 may comprise a conductive material such as copper (Cu).

[61] The socket 260 includes a first sub-socket 260a and a second sub-socket 260b. The first sub-socket 260a is secured to a bottom surface of the first substrate structure 210, and the second sub-socket 260b is movingly positioned at a lower portion of the first sub-socket 260a with respect to the first sub-socket 260a. Therefore, the second contact portion 234 of the connector 230 is inserted into the first connection hole 212 and the second connection hole 262, and the second sub-socket 260b slides with respect to the first sub-socket 260a, to thereby secure the second contact portion 234 to the socket 260, as shown in FIG. 5. As a result, the second contact portion 234 makes contact with the first and second conductive layers 214 and 264.

[62] In addition, the gap distance between the first and second substrate structures 210 and 220 may be decreased by the socket 260.

[63] Accordingly, when the first and second substrate structures 210 and 220 are not parallel with each other, or move relatively to each other, the connector 230 may move along the first and second connection holes 212 and 262 while maintaining electrical contact with the first substrate structure 210 and the socket 260. That is, an external force may not be applied to the second substrate structure 220 by the connector 230 despite the displacement of the first and second substrate structures 220 and 230, to thereby prevent the deformation of the second substrate structure 220. In addition, the connector 230 is secured to the contact pad 224 by the solder, to thereby minimize contact failures between the connector 230 and the contact pad 224. Furthermore, the connector 230 may not need to be elastically deformed, so that the connector 230 may have a larger cross-sectional area with a shorter length to thereby reduce electrical resistance. As a result, the electrical performance of the probe card 200 may be sufficiently increased.

[64] Although the connector 230 moves downward along the first connection hole 212 and the second contact portion 234 is taken off from the first connection hole 212, the second contact portion 234 still remains in the second connection hole 262, and thus the connector 230 still makes electrical contact with the second conductive layer 264.

[65] FIG. 6 is a cross-sectional view illustrating a probe card in accordance with still another example embodiment of the present invention, and FIG. 7 is a partially enlarged view of a portion A"in FIG. 6.

[66] Referring to FIGS. 6 and 7, a probe card 300 according to still another example embodiment of the present invention includes first and second substrate structures 310 and 320, a connector 330, a securing plate 340, a horizontal level-controlling member 350 and a socket 360.

[67] The probe card 300 of the present embodiment has substantially the same structure as the probe card 200 described with reference to FIGS. 4 and 5, except for the first substrate structure 310, and thus any further detailed descriptions on the second substrate structures 320, the connector 330, the securing plate 340, the horizontal level- controlling member 350 and the socket 360 are omitted hereinafter.

[68] In an example embodiment, no connection hole and conductive layer are installed in the first substrate structure 310, as compared with the first substrate structure 210 in FIGS. 4 and 5 including the first connection hole and the conductive layer. Therefore, the second contact portion 334 of the connector 330 is inserted into the connection hole 362 of the socket 360 and makes contact with a conductive layer 364. The diameter of the second contact portion 334 is smaller than that of the connection hole 362.

[69] Accordingly, when the first and second substrate structures 310 and 320 are not parallel with each other, or move relatively to each other, the connector 330 may move along the connection hole 362 while maintaining the electrical contact with the first substrate structure 310 and the socket 360. That is, an external force may not be applied to the second substrate structure 320 by the connector 330 despite the displacement of the first and second substrate structures 320 and 330, to thereby prevent the deformation of the second substrate structure 320. In addition, the connector 330 is secured to the contact pad 324 by the solder, to thereby minimize contact failures between the connector 330 and the contact pad 324. Furthermore, the connector 330 may not need to be elastically deformed, and thus the connector 330 may have a larger cross-sectional area with a shorter length to thereby reduce electrical resistance. As a result, the electrical performance of the probe card 300 may be sufficiently increased.

[70] FIGS. 8 to 13are cross-sectional views illustrating a method of bonding the connector in the probe card in accordance with an example embodiment of the present invention.

[71] Referring to FIG. 8, a guide plate 500 is prepared as a multilayer structure, and a plurality of penetrating holes 510 penetrates the guide plate 500. In the present embodiment, three plates are stacked in the guide plate 500 for stable bonding of the connector in the probe card. Two plates or four or more plates may also be stacked in the guide plate 500, as would be known to one of the ordinary skill in the art. A gap distance between neighboring penetrating holes is substantially the same as the gap distance between neighboring connectors. The penetrating hole 510 is located to the same position at each of the plates of the guide plate 500, so that the penetrating hole 510 is connected through all of the plates of the guide plate 500.

[72] Referring to FIG. 9, a plurality of the connectors 130 is inserted into the penetrating holes 510 of the guide plate 500, respectively. The height of the guide plate 500 is smaller than that of the connector 130, to thereby allow easy inspection of the insertion of the connector 130 into the penetrating hole 510. That is, the first contact portion 132 of the connector 130, which is shaped into a block, is protruded from a top surface of the guide plate 500, and the second contact portion 134 of the connector 130, which is shaped into a ring, is protruded from a bottom surface of the guide plate 500.

[73] Referring to FIG. 10, one of the plates slides with respect to the other plates in the guide plate 500. In the present embodiment, a central plate slides with respect to upper and lower plates. However, the upper or lower plate may also slide with the other plates, as would be known to one the ordinary skill in the art. Non-sliding plates are maintained to be stationary when one of the plates slides. Hereinafter, the non- sliding plates are referred to as stationary plates. The sliding plate makes contact with a first sidewall of the connector 130, and an external force is applied to the connector 130 in a first direction parallel with the sliding direction by the sliding plate. In contrast, the stationary plate makes contact with a second sidewall of the connector 130, opposite to the first sidewall of the connector 130, and a reaction force is applied to the connector 130 in a second direction opposite to the first direction by the stationary plate. As a result, the connector 130 is coupled to the guide plate 500 by a coupling force of the external force and the reaction force.

[74] Referring to FIG. 11, a plurality of contact pads 124 is arranged on a top surface of the bottom substrate 122, and a plurality of solders 136 is coated on the contact pads 124, respectively. For example, a paste may be used as the solder 136. A plurality of probes 126 is located at a bottom surface of the bottom substrate 122. A gap distance of the contact pads 124 is substantially the same as that of the penetrating holes 510 of the guide plate 500. In the present embodiment, the solders 136 may be coated on the contact pad 124 using a mask pattern or an auto dispenser.

[75] Referring to FIG. 12, the bottom substrate 122 and the guide plate 500 are aligned with each other in such a manner that the connectors 130 in the guide plate 500 are located over the contact pads 124 on the bottom substrate 122, respectively. Then, the guide plate 500 moves downward, and thus the connectors 130 make contact with the solders 136 on the contact pads 124, respectively. Each of the solders 136 is heated by heat transfer, to thereby be reflowed by heat, and then is sufficiently cooled. The solder 136 may be cooled by a passive cooling process or by a cooling gas injected thereto. As a result, the connectors are firmly bonded to the contact pads 124 by the solder 136, respectively.

[76] Referring to FIG. 13, the sliding plate of the guide plate 500 returns back to the original location, and the connector 130 is spaced apart from an inner surface of the penetration hole 510 of the guide plate 500, so that the connector 130 is uncoupled from the guide plate 500. Then, the guide plate 500 moves upward, and the connectors 130 are separated from the guide plate 500, thereby completing the bonding of the connectors to the bottom substrate 122. The connector 130 is secured to the bottom substrate 122 through the above bonding process.

[77] While the present example embodiment discusses the method of bonding the connectors 130 described with reference to FIGS. 2 and 3 to the bottom substrate 122, the other connectors 230 and 330 described with reference to FIGS. 4 to 7 may also be bonded to the bottom substrate 222 and 322 in substantially the same way, as would be known to one of the ordinary skill in the art.

[78] Accordingly, a plurality of connectors 130 may be simultaneously bonded to the bottom substrate 122. Further, the connector 130 may be bonded to an accurate contact pad 124 on the bottom substrate 122, thereby improving the efficiency and reliability of the bonding process of the connector 130.

[79]

Industrial Applicability

[80] According to the example embodiments of the present invention, a connector is firmly secured to a second substrate and is movingly secured to a first substrate in such a manner that the connector may slide along a connection hole penetrating the first substrate. That is, the connector may be restricted in a horizontal direction of the first substrate, and move without any constraints in a vertical direction of the first substrate. Therefore, no external force may be applied to the second substrate structure by the connector despite the displacement of the first and second substrate structures, to thereby prevent the deformation of the second substrate structure. In addition, the connector is secured to a contact pad by a solder, to thereby minimize contact failures between the connector and the contact pad. Furthermore, the connector may not need to be elastically deformed, and thus the connector may have a larger cross-sectional area with a shorter length to thereby reduce electrical resistance. As a result, the electrical performance of a probe card may be sufficiently increased.

[81] Further, a plurality of connectors may be simultaneously bonded to an accurate location on a contact pad on a bottom substrate, thereby improving the efficiency and reliability of the bonding process of the connector.

[82] Although the exemplary embodiments of the present invention have been described, it is understood that the present invention should not be limited to these exemplary embodiments but various changes and modifications can be made by one skilled in the art within the spirit and scope of the present invention as hereinafter claimed.

[83]

Claims

[ 1 ] A probe card comprising: a first substrate structure having a plurality of first connection holes, a first conductive layer being located on an inner surface of each of the first connection holes and being connected to a signal line in the first substrate structure; a second substrate structure having a contact pad at an upper portion thereof and a plurality of probes that make contact with an inspection object at a lower portion thereof; and a plurality of connectors, each of which includes a first contact portion and a second contact portion, the first contact portion being secured to the contact pad of the second substrate structure and the second contact portion being inserted into each of the first connection holes and making contact with the first conductive layer in each of the first connection holes.

[2] The probe card of claim 1, wherein the first contact portion is secured to the contact pad by a solder.

[3] The probe card of claim 1, wherein the second contact portion is shaped into a ring, so that the first conductive layer makes point contact with the second contact portion at least two locations thereof.

[4] The probe card of claim 1, wherein the second contact portion is shaped into an

O -ring, so that the first conductive layer makes point contact with the second contact portion at least two locations thereof.

[5] The probe card of claim 1, further comprising a socket positioned at a lower surface of the first substrate structure and having a second connection hole into which each of the connectors is inserted, a second conductive layer being located on an inner surface of the second connection hole and being connected to a signal line in the first substrate.

[6] The probe card of claim 5, wherein the socket includes: a first sub-socket secured to the lower surface of the first substrate structure; and a second sub-socket coupled to the first sub-socket and sliding with respect to the first sub-socket, so that each of the connectors inserted into each of the first connection holes is secured to the first substrate structure due to the sliding of the second sub-socket with respect to the first sub-socket.

[7] The probe card of claim 5, wherein each of the first connection holes is connected to the second connection hole.

[8] The probe card of claim 7, wherein the second contact portion has substantially the same size as the first and the second contact holes.

[9] The probe card of claim 7, wherein the diameters of the second connection holes of the socket are smaller than those of the connectors.

[10] A probe card comprising: a first substrate structure having a plurality of signal lines; a second substrate structure having a contact pad at an upper portion thereof and a plurality of probes that make contact with an inspection object at a lower portion thereof; a plurality of connectors secured to the contact pad of the second substrate structure; and a socket positioned at a lower surface of the first substrate structure and having a plurality of connection holes into which the connectors are inserted, respectively, a conductive layer being located on an inner surface of each of the connection holes and being connected to the signal lines in the first substrate structure.

[11] The probe card of claim 10, wherein the socket includes: a first sub-socket secured to the lower surface of the first substrate structure; and a second sub-socket coupled to the first sub-socket and sliding with respect to the first sub-socket, so that the connectors inserted into the connection holes are secured to the first substrate structure due to the sliding of the second sub-socket with respect to the first sub-socket.

[12] The probe card of claim 10, wherein each of the connection holes is shaped into a bar.

[13] The probe card of claim 10, wherein the diameters of the connection holes are larger than those of the connectors.

[14] A method of bonding a connector to a substrate, comprising: providing a guide plate in which a plurality of plates is stacked, the guide plate including a plurality of penetrating holes penetrating through each of the plates; inserting a plurality of connectors into the penetrating holes, respectively; coupling the connectors to the guiding plate by sliding one of the plates with respect to other plates; and securing the connectors that are coupled to the guiding plate to an upper surface of a substrate including a plurality of probes at a lower surface thereof.

[15] The method of claim 14, after securing the connectors to the upper surface of the substrate, further comprising: uncoupling the guiding plate and the connectors; and separating the guiding plate from the connectors.

[16] The method of claim 14, wherein securing the connectors to the upper surface of the substrate includes: forming a plurality of solders on an upper surface of the substrate; bringing the connectors coupled with the guiding plate into contact with the solders, respectively; heating the solders to thereby reflow the solders; and cooling the solders by a cooling process.

[17] The method of claim 14, wherein a gap distance between the solders is substantially the same as a gap distance between the penetrating holes.