WO2008118677A3 - Stiffening connector and probe card assembly incorporating same - Google Patents

Stiffening connector and probe card assembly incorporating same Download PDF

Info

Publication number
WO2008118677A3
WO2008118677A3 PCT/US2008/057284 US2008057284W WO2008118677A3 WO 2008118677 A3 WO2008118677 A3 WO 2008118677A3 US 2008057284 W US2008057284 W US 2008057284W WO 2008118677 A3 WO2008118677 A3 WO 2008118677A3
Authority
WO
WIPO (PCT)
Prior art keywords
connector
probe card
card assembly
assembly incorporating
incorporating same
Prior art date
Application number
PCT/US2008/057284
Other languages
French (fr)
Other versions
WO2008118677A2 (en
Inventor
Eric D. Hobbs
Gaetan L. Mathieu
Original Assignee
Formfactor, Inc.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Formfactor, Inc. filed Critical Formfactor, Inc.
Publication of WO2008118677A2 publication Critical patent/WO2008118677A2/en
Publication of WO2008118677A3 publication Critical patent/WO2008118677A3/en

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2889—Interfaces, e.g. between probe and tester
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07342—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being at an angle other than perpendicular to test object, e.g. probe card

Abstract

A stiffening connector assembly and methods of use are provided herein. In some embodiments a stiffening connector assembly includes a connector configured to be coupled to a substrate; and a mechanism coupled to the connector and configured to restrict rotational movement of the connector with respect to the substrate when coupled thereto. The mechanism may further provide a lateral degree of freedom of movement in a direction substantially parallel to the substrate.
PCT/US2008/057284 2007-03-23 2008-03-17 Stiffening connector and probe card assembly incorporating same WO2008118677A2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US11/690,139 2007-03-23
US11/690,139 US20080231258A1 (en) 2007-03-23 2007-03-23 Stiffening connector and probe card assembly incorporating same

Publications (2)

Publication Number Publication Date
WO2008118677A2 WO2008118677A2 (en) 2008-10-02
WO2008118677A3 true WO2008118677A3 (en) 2009-12-30

Family

ID=39774032

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2008/057284 WO2008118677A2 (en) 2007-03-23 2008-03-17 Stiffening connector and probe card assembly incorporating same

Country Status (3)

Country Link
US (1) US20080231258A1 (en)
TW (1) TW200846672A (en)
WO (1) WO2008118677A2 (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8760187B2 (en) * 2008-12-03 2014-06-24 L-3 Communications Corp. Thermocentric alignment of elements on parts of an apparatus
US7772863B2 (en) * 2008-12-03 2010-08-10 Formfactor, Inc. Mechanical decoupling of a probe card assembly to improve thermal response
US7960989B2 (en) * 2008-12-03 2011-06-14 Formfactor, Inc. Mechanical decoupling of a probe card assembly to improve thermal response
US8736294B2 (en) 2010-12-14 2014-05-27 Formfactor, Inc. Probe card stiffener with decoupling

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6535606B2 (en) * 2000-03-21 2003-03-18 James Cox Mobile telephone shoulder rest
US6722905B2 (en) * 2002-02-04 2004-04-20 Yazaki Corporation Board connector

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Publication number Priority date Publication date Assignee Title
US3691506A (en) * 1971-04-05 1972-09-12 Cts Corp Resistors and stacked plurality thereof
US4330163A (en) * 1979-12-05 1982-05-18 E. I. Du Pont De Nemours And Company Zero insertion force connector for LSI circuit package
US4715682A (en) * 1986-07-11 1987-12-29 Eastman Kodak Company Mount for imaging lens array on optical print head
US4779463A (en) * 1987-01-13 1988-10-25 Systron Donner Corporation Servo accelerometer
US5422574A (en) * 1993-01-14 1995-06-06 Probe Technology Corporation Large scale protrusion membrane for semiconductor devices under test with very high pin counts
US5806181A (en) * 1993-11-16 1998-09-15 Formfactor, Inc. Contact carriers (tiles) for populating larger substrates with spring contacts
US5772451A (en) * 1993-11-16 1998-06-30 Form Factor, Inc. Sockets for electronic components and methods of connecting to electronic components
US7064566B2 (en) * 1993-11-16 2006-06-20 Formfactor, Inc. Probe card assembly and kit
US6429029B1 (en) * 1997-01-15 2002-08-06 Formfactor, Inc. Concurrent design and subsequent partitioning of product and test die
US6690185B1 (en) * 1997-01-15 2004-02-10 Formfactor, Inc. Large contactor with multiple, aligned contactor units
US6201629B1 (en) * 1997-08-27 2001-03-13 Microoptical Corporation Torsional micro-mechanical mirror system
US6644982B1 (en) * 1998-12-04 2003-11-11 Formfactor, Inc. Method and apparatus for the transport and tracking of an electronic component
US7215131B1 (en) * 1999-06-07 2007-05-08 Formfactor, Inc. Segmented contactor
JP4152083B2 (en) * 2001-02-22 2008-09-17 日本圧着端子製造株式会社 Electrical connector
US7071714B2 (en) * 2001-11-02 2006-07-04 Formfactor, Inc. Method and system for compensating for thermally induced motion of probe cards
US6972578B2 (en) * 2001-11-02 2005-12-06 Formfactor, Inc. Method and system for compensating thermally induced motion of probe cards
US7188391B2 (en) * 2001-12-24 2007-03-13 Lg Electronics, Inc. Hinge assembly for flat panel display appliance
US6683787B1 (en) * 2002-02-14 2004-01-27 Mercury Computer Systems, Inc. Circuit board assembly with integrated air plenum chamber using self-aligning heat sinks
US6999317B2 (en) * 2003-08-12 2006-02-14 Delphi Technologies, Inc. Thermally enhanced electronic module with self-aligning heat sink
JP4425005B2 (en) * 2004-01-19 2010-03-03 帝国通信工業株式会社 Electronic component mounting structure on board
US7230437B2 (en) * 2004-06-15 2007-06-12 Formfactor, Inc. Mechanically reconfigurable vertical tester interface for IC probing
US7285968B2 (en) * 2005-04-19 2007-10-23 Formfactor, Inc. Apparatus and method for managing thermally induced motion of a probe card assembly
US7471094B2 (en) * 2005-06-24 2008-12-30 Formfactor, Inc. Method and apparatus for adjusting a multi-substrate probe structure
US7419313B2 (en) * 2007-01-16 2008-09-02 Stratos International, Inc. Optoelectronic device in combination with a push-in cage

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6535606B2 (en) * 2000-03-21 2003-03-18 James Cox Mobile telephone shoulder rest
US6722905B2 (en) * 2002-02-04 2004-04-20 Yazaki Corporation Board connector

Also Published As

Publication number Publication date
US20080231258A1 (en) 2008-09-25
TW200846672A (en) 2008-12-01
WO2008118677A2 (en) 2008-10-02

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