WO2008127970A3 - Circuit materials, multilayer circuits, and methods of manufacture thereof - Google Patents

Circuit materials, multilayer circuits, and methods of manufacture thereof Download PDF

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Publication number
WO2008127970A3
WO2008127970A3 PCT/US2008/059869 US2008059869W WO2008127970A3 WO 2008127970 A3 WO2008127970 A3 WO 2008127970A3 US 2008059869 W US2008059869 W US 2008059869W WO 2008127970 A3 WO2008127970 A3 WO 2008127970A3
Authority
WO
WIPO (PCT)
Prior art keywords
circuit
methods
manufacture
bond ply
ghz
Prior art date
Application number
PCT/US2008/059869
Other languages
French (fr)
Other versions
WO2008127970A2 (en
Inventor
Scott D Kennedy
Original Assignee
World Properties Inc
Scott D Kennedy
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by World Properties Inc, Scott D Kennedy filed Critical World Properties Inc
Priority to JP2010503200A priority Critical patent/JP2010524265A/en
Priority to DE112008000932T priority patent/DE112008000932T5/en
Priority to CN2008800117272A priority patent/CN101683005B/en
Publication of WO2008127970A2 publication Critical patent/WO2008127970A2/en
Publication of WO2008127970A3 publication Critical patent/WO2008127970A3/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0129—Thermoplastic polymer, e.g. auto-adhesive layer; Shaping of thermoplastic polymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0141—Liquid crystal polymer [LCP]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/015—Fluoropolymer, e.g. polytetrafluoroethylene [PTFE]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0209—Inorganic, non-metallic particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49128—Assembling formed circuit to base
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12528—Semiconductor component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • Y10T428/24917—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including metal layer

Abstract

A circuit assembly (110) comprises two or more circuit laminates (112, 118), each comprising a conductive metal layer (116, 122, 124) disposed on a poly(arylene ether ketone) substrate layer, wherein at least one of the conductive metal layers has been patterned to form a circuit, and a bond ply layer (126) comprising a thermoplastic or thermosetting material. The thermoplastic bond ply has a melting point between 250°C and 37O°C, a decomposition temperature greater than about 290°C and a dissipation factor of less than 0.01 at 10 GHz. The thermoset bond ply has a dissipation factor les than 0.01 at 10 GHz and a decomposition temperature greater than about 2900C after lamination. Methods of forming the above circuit assemblies are also disclosed.
PCT/US2008/059869 2007-04-11 2008-04-10 Circuit materials, multilayer circuits, and methods of manufacture thereof WO2008127970A2 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2010503200A JP2010524265A (en) 2007-04-11 2008-04-10 Circuit material, multilayer circuit, and method for manufacturing the same
DE112008000932T DE112008000932T5 (en) 2007-04-11 2008-04-10 Circuit materials, multilayer circuits and methods of making the same
CN2008800117272A CN101683005B (en) 2007-04-11 2008-04-10 Circuit materials, multilayer circuits, and methods of manufacture thereof

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US91116407P 2007-04-11 2007-04-11
US60/911,164 2007-04-11

Publications (2)

Publication Number Publication Date
WO2008127970A2 WO2008127970A2 (en) 2008-10-23
WO2008127970A3 true WO2008127970A3 (en) 2008-12-24

Family

ID=39760682

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2008/059869 WO2008127970A2 (en) 2007-04-11 2008-04-10 Circuit materials, multilayer circuits, and methods of manufacture thereof

Country Status (5)

Country Link
US (1) US7790268B2 (en)
JP (1) JP2010524265A (en)
CN (1) CN101683005B (en)
DE (1) DE112008000932T5 (en)
WO (1) WO2008127970A2 (en)

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WO2008020984A2 (en) 2006-08-08 2008-02-21 World Properties, Inc. Circuit materials with improved bond, method of manufacture thereof, and articles formed therefrom
US7951447B2 (en) * 2007-01-31 2011-05-31 Kyocera Corporation Method and apparatus for manufacturing prepreg sheet and prepreg sheet
CN101611660B (en) * 2007-02-14 2012-01-25 住友电木株式会社 Interlayer insulating film having carrier material, and multilayer printed circuit board using the interlayer insulating film
JP2011517112A (en) 2008-04-10 2011-05-26 ワールド・プロパティーズ・インコーポレイテッド CIRCUIT MATERIAL WITH IMPROVED BONDING, ITS MANUFACTURING METHOD AND PRODUCT
CN101631425B (en) * 2008-07-15 2012-08-29 鸿富锦精密工业（深圳）有限公司 Circuit board and coexistence wiring method thereof
DE102008054288A1 (en) * 2008-11-03 2010-05-06 Osram Gesellschaft mit beschränkter Haftung Method for producing a flexible light strip
US8607926B2 (en) 2009-04-21 2013-12-17 E I Du Pont De Nemours And Company Composite flame barrier laminate for a thermal and acoustic insulation blanket
US8292027B2 (en) * 2009-04-21 2012-10-23 E I Du Pont De Nemours And Company Composite laminate for a thermal and acoustic insulation blanket
US8607928B2 (en) 2009-04-21 2013-12-17 E I Du Pont De Nemours And Company Composite flame barrier laminate for a thermal and acoustic insulation blanket
US8607927B2 (en) 2009-04-21 2013-12-17 E I Du Pont De Nemours And Company Composite flame barrier laminate for a thermal and acoustic insulation blanket
WO2010144792A1 (en) 2009-06-11 2010-12-16 Rogers Corporation Dielectric materials, methods of forming subassemblies therefrom, and the subassemblies formed therewith
US8143530B1 (en) * 2010-09-17 2012-03-27 Endicott Interconnect Technologies, Inc. Liquid crystal polymer layer for encapsulation and improved hermiticity of circuitized substrates
JP5541122B2 (en) 2010-11-30 2014-07-09 山一電機株式会社 Flexible wiring board
DE102011007837A1 (en) * 2011-04-21 2012-10-25 Evonik Degussa Gmbh Adhesive-free composite of a polyarylene ether ketone and a metal foil
CN102757229A (en) * 2012-07-03 2012-10-31 深圳光启创新技术有限公司 Conformal ceramic metamaterial and preparation method thereof
CN103717016B (en) * 2013-12-31 2017-06-13 深圳市深联电路有限公司 A kind of anti-hierarchical process of silver-plated circuit board of multilayer high-frequency electrical
TWI667276B (en) 2014-05-29 2019-08-01 美商羅傑斯公司 Circuit materials with improved fire retardant system and articles formed therefrom
US9818682B2 (en) * 2014-12-03 2017-11-14 International Business Machines Corporation Laminate substrates having radial cut metallic planes
US10233365B2 (en) 2015-11-25 2019-03-19 Rogers Corporation Bond ply materials and circuit assemblies formed therefrom
US20190104612A1 (en) * 2017-09-29 2019-04-04 Iteq Corporation Polymer matrix composite for eliminating skew and fiber weave effect
EP3724947A4 (en) * 2017-12-14 2021-08-18 Trak Microwave Limited Broadband circulator and method of manufacturing the same
US10645808B2 (en) * 2018-02-22 2020-05-05 Apple Inc. Devices with radio-frequency printed circuits
US11917753B2 (en) * 2019-09-23 2024-02-27 Ticona Llc Circuit board for use at 5G frequencies
US10827602B1 (en) * 2020-03-02 2020-11-03 Abb Power Electronics Inc. Printed circuit boards for power supplies
KR20220143070A (en) * 2020-03-16 2022-10-24 교세라 가부시키가이샤 wiring board
TWI807216B (en) * 2020-09-01 2023-07-01 佳勝科技股份有限公司 Composite substrate and manufacturing method thereof
CN113232383B (en) * 2021-05-25 2022-04-15 武汉理工大学 PTFE composite medium substrate and preparation method thereof

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US3668057A (en) * 1970-06-10 1972-06-06 Du Pont Laminar structures of metal and crystalline copolyketones and method of forming same
EP0087051A2 (en) * 1982-02-17 1983-08-31 Siemens Aktiengesellschaft Substrate material for flexible printed circuits
EP0148379A1 (en) * 1983-12-02 1985-07-17 Siemens Aktiengesellschaft Multilayer circuits made of a thermoplastic composite
JP2000200976A (en) * 1999-01-05 2000-07-18 Mitsubishi Plastics Ind Ltd Multilayer printed wiring substrate and its manufacture
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Also Published As

Publication number Publication date
CN101683005B (en) 2012-12-05
WO2008127970A2 (en) 2008-10-23
CN101683005A (en) 2010-03-24
JP2010524265A (en) 2010-07-15
US7790268B2 (en) 2010-09-07
US20080254313A1 (en) 2008-10-16
DE112008000932T5 (en) 2010-02-18

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