WO2009006186A3 - Multi-offset die head - Google Patents
Multi-offset die head Download PDFInfo
- Publication number
- WO2009006186A3 WO2009006186A3 PCT/US2008/068296 US2008068296W WO2009006186A3 WO 2009006186 A3 WO2009006186 A3 WO 2009006186A3 US 2008068296 W US2008068296 W US 2008068296W WO 2009006186 A3 WO2009006186 A3 WO 2009006186A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- micro
- offset
- holes
- hole
- die head
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/07357—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with flexible bodies, e.g. buckling beams
Abstract
An upper die portion of a die head for aligning probes having different offsets in a first array of first micro-holes formed in a lower die portion of the die head. The upper die portion includes a spacer portion and a first assembly aid film. The spacer portion includes first and second surfaces. The first surface contacts the lower die portion. The first assembly aid film is attached with the second surface and has a second array of second micro-holes for receiving the probes having different offsets. The second micro-holes include at least a first micro-hole that is configured to be offset from a corresponding micro-hole of the first micro-holes by a first offset and at least a second micro-hole that is configured to be offset from a corresponding micro-hole of the first micro-holes by a second offset that is not the same as the first offset.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11/770,896 US7554348B2 (en) | 2007-06-29 | 2007-06-29 | Multi-offset die head |
US11/770,896 | 2007-06-29 |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2009006186A2 WO2009006186A2 (en) | 2009-01-08 |
WO2009006186A3 true WO2009006186A3 (en) | 2009-02-19 |
Family
ID=40159628
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US2008/068296 WO2009006186A2 (en) | 2007-06-29 | 2008-06-26 | Multi-offset die head |
Country Status (3)
Country | Link |
---|---|
US (1) | US7554348B2 (en) |
TW (1) | TWI451093B (en) |
WO (1) | WO2009006186A2 (en) |
Families Citing this family (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9851378B2 (en) | 2008-09-29 | 2017-12-26 | Wentworth Laboratories Inc. | Methods of fabricating probe cards including nanotubes |
US8222912B2 (en) * | 2009-03-12 | 2012-07-17 | Sv Probe Pte. Ltd. | Probe head structure for probe test cards |
TWI435083B (en) * | 2010-07-27 | 2014-04-21 | Mpi Corp | Combination probe head for vertical probe card and its assembly alignment method |
US9267968B2 (en) | 2010-12-09 | 2016-02-23 | Wentworth Laboratories, Inc. | Probe card assemblies and probe pins including carbon nanotubes |
US8994393B2 (en) | 2012-09-06 | 2015-03-31 | International Business Machines Corporation | High-frequency cobra probe |
ITMI20130561A1 (en) * | 2013-04-09 | 2014-10-10 | Technoprobe Spa | HEAD OF MEASUREMENT OF ELECTRONIC DEVICES |
TW201537181A (en) * | 2014-03-25 | 2015-10-01 | Mpi Corp | Vertical probe device and supporter used in the same |
TW201623976A (en) * | 2014-12-24 | 2016-07-01 | Mpi Corp | Vertical probe device with positioning plates |
TWI530691B (en) * | 2015-02-04 | 2016-04-21 | 旺矽科技股份有限公司 | Probe head and upper guider plate |
SG11201707864TA (en) * | 2015-03-31 | 2017-10-30 | Technoprobe Spa | Vertical contact probe and corresponding testing head with vertical contact probes, particularly for high frequency applications |
MY186784A (en) | 2015-05-07 | 2021-08-20 | Technoprobe Spa | Testing head having vertical probes, in particular for reduced pitch applications |
IT201600079679A1 (en) | 2016-07-28 | 2018-01-28 | Technoprobe Spa | Measurement board for electronic devices |
JP2018179721A (en) * | 2017-04-12 | 2018-11-15 | 株式会社日本マイクロニクス | Electrical connection device |
AT522235B1 (en) | 2019-02-15 | 2021-06-15 | Tgw Mechanics Gmbh | Conveyor device for gapless and pressureless or low-pressure accumulation of objects and operating methods therefor |
IT201900024889A1 (en) * | 2019-12-19 | 2021-06-19 | Technoprobe Spa | Contact probe for high frequency applications with improved current carrying capacity |
TWI798127B (en) * | 2021-07-07 | 2023-04-01 | 旺矽科技股份有限公司 | vertical probe head |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6297657B1 (en) * | 1999-01-11 | 2001-10-02 | Wentworth Laboratories, Inc. | Temperature compensated vertical pin probing device |
US20050110510A1 (en) * | 2003-11-14 | 2005-05-26 | Wentworth Laboratories, Inc., A Corporation Of The State Of Connecticut | Die design with integrated assembly aid |
US20060066328A1 (en) * | 2004-09-30 | 2006-03-30 | Probelogic, Inc. | Buckling beam probe test assembly |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5534784A (en) * | 1994-05-02 | 1996-07-09 | Motorola, Inc. | Method for probing a semiconductor wafer |
US5977787A (en) * | 1997-06-16 | 1999-11-02 | International Business Machines Corporation | Large area multiple-chip probe assembly and method of making the same |
US5952843A (en) * | 1998-03-24 | 1999-09-14 | Vinh; Nguyen T. | Variable contact pressure probe |
US6163162A (en) * | 1999-01-11 | 2000-12-19 | Wentworth Laboratories, Inc. | Temperature compensated vertical pin probing device |
US6927586B2 (en) * | 2000-03-06 | 2005-08-09 | Wentworth Laboratories, Inc. | Temperature compensated vertical pin probing device |
US6633175B1 (en) * | 2000-03-06 | 2003-10-14 | Wenworth Laboratories, Inc. | Temperature compensated vertical pin probing device |
US6566898B2 (en) * | 2000-03-06 | 2003-05-20 | Wentworth Laboratories, Inc. | Temperature compensated vertical pin probing device |
JP3486841B2 (en) * | 2000-08-09 | 2004-01-13 | 日本電子材料株式会社 | Vertical probe card |
US6977515B2 (en) * | 2001-09-20 | 2005-12-20 | Wentworth Laboratories, Inc. | Method for forming photo-defined micro electrical contacts |
US6906540B2 (en) * | 2001-09-20 | 2005-06-14 | Wentworth Laboratories, Inc. | Method for chemically etching photo-defined micro electrical contacts |
EP1751557B1 (en) * | 2004-03-10 | 2012-08-15 | Wentworth Laboratories, Inc. | Flexible microcircuit space transformer assembly |
US7180318B1 (en) * | 2004-10-15 | 2007-02-20 | Xilinx, Inc. | Multi-pitch test probe assembly for testing semiconductor dies having contact pads |
US7345492B2 (en) * | 2005-12-14 | 2008-03-18 | Microprobe, Inc. | Probe cards employing probes having retaining portions for potting in a retention arrangement |
-
2007
- 2007-06-29 US US11/770,896 patent/US7554348B2/en active Active
-
2008
- 2008-06-20 TW TW097123242A patent/TWI451093B/en active
- 2008-06-26 WO PCT/US2008/068296 patent/WO2009006186A2/en active Application Filing
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6297657B1 (en) * | 1999-01-11 | 2001-10-02 | Wentworth Laboratories, Inc. | Temperature compensated vertical pin probing device |
US20050110510A1 (en) * | 2003-11-14 | 2005-05-26 | Wentworth Laboratories, Inc., A Corporation Of The State Of Connecticut | Die design with integrated assembly aid |
US20060066328A1 (en) * | 2004-09-30 | 2006-03-30 | Probelogic, Inc. | Buckling beam probe test assembly |
Also Published As
Publication number | Publication date |
---|---|
US20090002009A1 (en) | 2009-01-01 |
TWI451093B (en) | 2014-09-01 |
US7554348B2 (en) | 2009-06-30 |
WO2009006186A2 (en) | 2009-01-08 |
TW200918900A (en) | 2009-05-01 |
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