WO2009009306A3 - Multilayer barrier stacks and methods for making them - Google Patents

Multilayer barrier stacks and methods for making them Download PDF

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Publication number
WO2009009306A3
WO2009009306A3 PCT/US2008/068337 US2008068337W WO2009009306A3 WO 2009009306 A3 WO2009009306 A3 WO 2009009306A3 US 2008068337 W US2008068337 W US 2008068337W WO 2009009306 A3 WO2009009306 A3 WO 2009009306A3
Authority
WO
WIPO (PCT)
Prior art keywords
layer
methods
substrate
making
inorganic layer
Prior art date
Application number
PCT/US2008/068337
Other languages
French (fr)
Other versions
WO2009009306A2 (en
Inventor
Lorenza Moro
Xi Chu
Original Assignee
Vitex Systems Inc
Lorenza Moro
Xi Chu
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Vitex Systems Inc, Lorenza Moro, Xi Chu filed Critical Vitex Systems Inc
Priority to JP2010516124A priority Critical patent/JP5536646B2/en
Priority to EP08772022.3A priority patent/EP2173920B1/en
Priority to KR1020107003148A priority patent/KR101513871B1/en
Publication of WO2009009306A2 publication Critical patent/WO2009009306A2/en
Publication of WO2009009306A3 publication Critical patent/WO2009009306A3/en

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/02—Pretreatment of the material to be coated
    • C23C14/024—Deposition of sublayers, e.g. to promote adhesion of the coating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K30/00—Organic devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation
    • H10K30/80—Constructional details
    • H10K30/88—Passivation; Containers; Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/844—Encapsulations
    • H10K50/8445—Encapsulations multilayered coatings having a repetitive structure, e.g. having multiple organic-inorganic bilayers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/873—Encapsulations
    • H10K59/8731—Encapsulations multilayered coatings having a repetitive structure, e.g. having multiple organic-inorganic bilayers
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy
    • Y02E10/549—Organic PV cells
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31652—Of asbestos
    • Y10T428/31663—As siloxane, silicone or silane
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31678—Of metal

Abstract

An improved barrier stack. The barrier stack (315) is made by the process of depositing the polymeric.decoupling layer (320) on a substrate (305); depositing a first inorganic layer (330) on the decoupling layer under a first set of conditions wherein an ion and neutral energy arriving at the substrate is less than about 20 eV so that the first inorganic layer is not a barrier layer, wherein a temperature of the substrate is less than about 150 -C; and depositing a second inorganic layer (335) on the first inorganic layer under a second set of conditions wherein an ion and neutral energy arriving at the substrate is greater than about 50 eV so that the second inorganic layer is a barrier layer. Methods of reducing damage to a polymeric layer in a barrier stack are also described.
PCT/US2008/068337 2007-07-12 2008-06-26 Multilayer barrier stacks and methods for making them WO2009009306A2 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2010516124A JP5536646B2 (en) 2007-07-12 2008-06-26 Multilayer barrier stack and method of manufacturing multilayer barrier stack
EP08772022.3A EP2173920B1 (en) 2007-07-12 2008-06-26 Methods for making multilayer barrier stacks
KR1020107003148A KR101513871B1 (en) 2007-07-12 2008-06-26 Multilayer barrier stacks and methods for making them

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US11/776,616 US7648925B2 (en) 2003-04-11 2007-07-12 Multilayer barrier stacks and methods of making multilayer barrier stacks
US11/776,616 2007-07-12

Publications (2)

Publication Number Publication Date
WO2009009306A2 WO2009009306A2 (en) 2009-01-15
WO2009009306A3 true WO2009009306A3 (en) 2009-04-23

Family

ID=40076705

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2008/068337 WO2009009306A2 (en) 2007-07-12 2008-06-26 Multilayer barrier stacks and methods for making them

Country Status (6)

Country Link
US (1) US7648925B2 (en)
EP (1) EP2173920B1 (en)
JP (1) JP5536646B2 (en)
KR (1) KR101513871B1 (en)
TW (1) TWI373867B (en)
WO (1) WO2009009306A2 (en)

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