WO2009015084A3 - Methods for generating a standard reference die for use in a die to standard reference die inspection and methods for inspecting a wafer - Google Patents

Methods for generating a standard reference die for use in a die to standard reference die inspection and methods for inspecting a wafer Download PDF

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Publication number
WO2009015084A3
WO2009015084A3 PCT/US2008/070647 US2008070647W WO2009015084A3 WO 2009015084 A3 WO2009015084 A3 WO 2009015084A3 US 2008070647 W US2008070647 W US 2008070647W WO 2009015084 A3 WO2009015084 A3 WO 2009015084A3
Authority
WO
WIPO (PCT)
Prior art keywords
die
standard reference
methods
wafer
generating
Prior art date
Application number
PCT/US2008/070647
Other languages
French (fr)
Other versions
WO2009015084A2 (en
Inventor
Kris Bhaskar
Mark Mccord
Santosh Bhattacharyya
Ardis Liang
Richard Wallingford
Hubert Altendorfer
Kais Maayah
Original Assignee
Kla Tencor Corp
Kris Bhaskar
Mark Mccord
Santosh Bhattacharyya
Ardis Liang
Richard Wallingford
Hubert Altendorfer
Kais Maayah
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kla Tencor Corp, Kris Bhaskar, Mark Mccord, Santosh Bhattacharyya, Ardis Liang, Richard Wallingford, Hubert Altendorfer, Kais Maayah filed Critical Kla Tencor Corp
Priority to KR1020147015882A priority Critical patent/KR101553866B1/en
Priority to JP2010517203A priority patent/JP5758121B2/en
Publication of WO2009015084A2 publication Critical patent/WO2009015084A2/en
Publication of WO2009015084A3 publication Critical patent/WO2009015084A3/en
Priority to IL202857A priority patent/IL202857A/en
Priority to IL227797A priority patent/IL227797A/en

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70605—Workpiece metrology
    • G03F7/70616—Monitoring the printed patterns
    • G03F7/7065—Defects, e.g. optical inspection of patterned layer for defects
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/93—Detection standards; Calibrating baseline adjustment, drift correction
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects
    • G01N21/95607—Inspecting patterns on the surface of objects using a comparative method
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/68—Preparation processes not covered by groups G03F1/20 - G03F1/50
    • G03F1/82—Auxiliary processes, e.g. cleaning or inspecting
    • G03F1/84—Inspecting
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/0002—Inspection of images, e.g. flaw detection
    • G06T7/0004—Industrial image inspection
    • G06T7/001—Industrial image inspection using an image reference approach
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/30—Subject of image; Context of image processing
    • G06T2207/30108—Industrial image inspection
    • G06T2207/30148—Semiconductor; IC; Wafer

Abstract

Methods for generating a standard reference die for use in a die to standard reference die inspection and methods for inspecting a wafer are provided. One computer-implemented method for generating a standard reference die for use in a die to standard reference die inspection includes acquiring output of an inspection system for a centrally located die on a wafer and one or more dies located on the wafer. The method also includes combining the output for the centrally located die and the one or more dies based on within die positions of the output. In addition, the method includes generating the standard reference die based on results of the combining step.
PCT/US2008/070647 2007-07-20 2008-07-21 Methods for generating a standard reference die for use in a die to standard reference die inspection and methods for inspecting a wafer WO2009015084A2 (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
KR1020147015882A KR101553866B1 (en) 2007-07-20 2008-07-21 Methods for generating a standard reference die for use in a die to standard reference die inpection and methods for inspecting a wafer
JP2010517203A JP5758121B2 (en) 2007-07-20 2008-07-21 Method for generating a standard reference die for use in standard reference die comparison inspection and method for inspecting a wafer
IL202857A IL202857A (en) 2007-07-20 2009-12-20 Methods for generating a standard reference die for use in a die to standard reference die inspection and method for inspecting a wafer
IL227797A IL227797A (en) 2007-07-20 2013-08-05 Methods for generating a standard reference die for use in a die to standard reference die inspection and methods for inspecting a wafer

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US95097407P 2007-07-20 2007-07-20
US60/950,974 2007-07-20
US12/176,095 2008-07-18
US12/176,095 US7796804B2 (en) 2007-07-20 2008-07-18 Methods for generating a standard reference die for use in a die to standard reference die inspection and methods for inspecting a wafer

Publications (2)

Publication Number Publication Date
WO2009015084A2 WO2009015084A2 (en) 2009-01-29
WO2009015084A3 true WO2009015084A3 (en) 2009-06-18

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2008/070647 WO2009015084A2 (en) 2007-07-20 2008-07-21 Methods for generating a standard reference die for use in a die to standard reference die inspection and methods for inspecting a wafer

Country Status (5)

Country Link
US (2) US7796804B2 (en)
JP (3) JP5758121B2 (en)
KR (2) KR101471950B1 (en)
IL (2) IL202857A (en)
WO (1) WO2009015084A2 (en)

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