WO2009043649A3 - Three-dimensional electronic circuit board structure, and circuit board base comprising said circuit board structure as a functional component and three-dimensional circuit assembly consisting of at least two such three-dimensional circuit board structures - Google Patents
Three-dimensional electronic circuit board structure, and circuit board base comprising said circuit board structure as a functional component and three-dimensional circuit assembly consisting of at least two such three-dimensional circuit board structures Download PDFInfo
- Publication number
- WO2009043649A3 WO2009043649A3 PCT/EP2008/061346 EP2008061346W WO2009043649A3 WO 2009043649 A3 WO2009043649 A3 WO 2009043649A3 EP 2008061346 W EP2008061346 W EP 2008061346W WO 2009043649 A3 WO2009043649 A3 WO 2009043649A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- circuit board
- dimensional
- board structure
- structures
- functional component
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/366—Assembling printed circuits with other printed circuits substantially perpendicularly to each other
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0277—Bendability or stretchability details
- H05K1/0278—Rigid circuit boards or rigid supports of circuit boards locally made bendable, e.g. by removal or replacement of material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
- H05K1/183—Components mounted in and supported by recessed areas of the printed circuit board
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
- H05K1/184—Components including terminals inserted in holes through the printed circuit board and connected to printed contacts on the walls of the holes or at the edges thereof or protruding over or into the holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/04—Assemblies of printed circuits
- H05K2201/046—Planar parts of folded PCBs making an angle relative to each other
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/04—Assemblies of printed circuits
- H05K2201/047—Box-like arrangements of PCBs
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/04—Assemblies of printed circuits
- H05K2201/048—Second PCB mounted on first PCB by inserting in window or holes of the first PCB
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09145—Edge details
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09145—Edge details
- H05K2201/09172—Notches between edge pads
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09145—Edge details
- H05K2201/09181—Notches in edge pads
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10189—Non-printed connector
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10287—Metal wires as connectors or conductors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10401—Eyelets, i.e. rings inserted into a hole through a circuit board
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10409—Screws
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10431—Details of mounted components
- H05K2201/10439—Position of a single component
- H05K2201/10446—Mounted on an edge
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10431—Details of mounted components
- H05K2201/1059—Connections made by press-fit insertion
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/301—Assembling printed circuits with electric components, e.g. with resistor by means of a mounting structure
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/403—Edge contacts; Windows or holes in the substrate having plural connections on the walls thereof
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Combinations Of Printed Boards (AREA)
- Structure Of Printed Boards (AREA)
Abstract
The invention relates to a three-dimensional electrical circuit board structure comprising at least two interconnected planar, two-dimensional substrates that have contact elements and that are preferably equipped on both sides with electronic components, the substrates forming substrate walls that are arranged at an angle of <180° relative to each other, thereby defining a three-dimensional body with interspaces between the substrate walls. Electrically conducting elements expediently conduct the electric current from one substrate wall to an adjacent substrate wall. The invention also relates to a circuit board base having an electrical circuit board structure of the above type and to a three-dimensional circuit assembly that consists of at least two such three-dimensional circuit board structures.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102007046493A DE102007046493A1 (en) | 2007-09-28 | 2007-09-28 | Three-dimensional electronic circuit carrier structure, as well as circuit base carrier having the circuit carrier structure as a functional component and three-dimensional circuit arrangement consisting of at least two such three-dimensional circuit carrier structures |
DE102007046493.4 | 2007-09-28 |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2009043649A2 WO2009043649A2 (en) | 2009-04-09 |
WO2009043649A3 true WO2009043649A3 (en) | 2009-10-29 |
Family
ID=40404039
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/EP2008/061346 WO2009043649A2 (en) | 2007-09-28 | 2008-08-28 | Three-dimensional electronic circuit board structure, and circuit board base comprising said circuit board structure as a functional component and three-dimensional circuit assembly consisting of at least two such three-dimensional circuit board structures |
Country Status (2)
Country | Link |
---|---|
DE (1) | DE102007046493A1 (en) |
WO (1) | WO2009043649A2 (en) |
Families Citing this family (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102010062758A1 (en) | 2010-12-09 | 2012-06-14 | Zf Friedrichshafen Ag | Printed circuit board arrangement for electronic control device used in motor car, has contacting element overmolded with overmold material, which is provided at end face of upper circuit board contacted with lower circuit board |
DE102010062759A1 (en) | 2010-12-09 | 2012-06-14 | Zf Friedrichshafen Ag | Printed circuit board arrangement e.g. high-density interconnect printed circuit board arrangement, for gear box control device of motor car, has two printed circuit boards extending adjacent to each other in common plane |
DE102010062757A1 (en) | 2010-12-09 | 2012-06-14 | Zf Friedrichshafen Ag | Printed circuit board arrangement for electronic control device used in motor car, has engaging elements which are provided with discrete contacting elements for electrically contacting with complementarily formed contact areas |
DE102011111488A1 (en) * | 2011-08-30 | 2013-02-28 | Schoeller-Electronics Gmbh | PCB System |
US8971048B2 (en) * | 2013-03-06 | 2015-03-03 | Alliant Techsystems Inc. | Self-locating electronics package precursor structure, method for configuring an electronics package, and electronics package |
DE102013216493A1 (en) * | 2013-08-20 | 2015-02-26 | Zf Friedrichshafen Ag | Printed circuit board having a first rigid circuit board portion and a second rigid circuit board portion and method of providing the circuit board |
DE102014117536B4 (en) * | 2014-11-28 | 2019-04-18 | Sick Ag | Method for the lateral connection of two printed circuit boards and optoelectronic sensor with two angularly connected printed circuit boards |
DE102015216419B4 (en) | 2015-08-27 | 2022-06-15 | Vitesco Technologies GmbH | Electronic device having a housing with a printed circuit board arranged therein |
US10820416B2 (en) | 2015-11-27 | 2020-10-27 | Sony Corporation | Substrate apparatus and method of manufacturing the same |
DE102016003325B4 (en) | 2016-03-21 | 2018-08-02 | Gebr. Krallmann Gmbh | Method for producing a plastic component having a plurality of carrier parts with at least one electrical conductor track and thus produced plastic component |
JP2019057606A (en) * | 2017-09-20 | 2019-04-11 | 株式会社村田製作所 | Electronic module |
RU2688581C1 (en) * | 2018-06-18 | 2019-05-21 | Юрий Борисович Соколов | Method for manufacturing three-dimensional electronic module with high density of components and device |
KR102337901B1 (en) * | 2018-08-28 | 2021-12-08 | 주식회사 엘지에너지솔루션 | Printed Circuit Board Assembly and Method for Manufacturing the Same |
EP3709777A1 (en) * | 2019-03-11 | 2020-09-16 | AT & S Austria Technologie & Systemtechnik Aktiengesellschaft | Solder-free component carrier connection using an elastic element, and method |
DE102021102220A1 (en) | 2020-02-10 | 2021-08-12 | Ged Gesellschaft Für Elektronik Und Design Mbh | Printed circuit board and printed circuit board composite |
CN111627897A (en) * | 2020-05-28 | 2020-09-04 | 上海先方半导体有限公司 | Three-dimensional packaging structure and preparation method thereof |
US20220322532A1 (en) * | 2021-04-05 | 2022-10-06 | Indiana Integrated Circuits, LLC | Three-Dimensional Printed Circuit Substrate Assembly |
JP2022178257A (en) * | 2021-05-19 | 2022-12-02 | タイコエレクトロニクスジャパン合同会社 | circuit board assembly |
JP7057957B1 (en) | 2021-07-12 | 2022-04-21 | 太陽インキ製造株式会社 | Connection type three-dimensional molded circuit parts and circuit connection structure |
DE202022100279U1 (en) | 2022-01-19 | 2023-04-21 | WAGO Verwaltungsgesellschaft mit beschränkter Haftung | PCB assembly |
Citations (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB840762A (en) * | 1955-08-11 | 1960-07-13 | Emi Ltd | Improvements in or relating to electrical apparatus |
US3673669A (en) * | 1970-11-19 | 1972-07-04 | Sperry Rand Corp | Method of making side entry card guides |
US4571663A (en) * | 1982-06-19 | 1986-02-18 | Ferranti Plc | Electrical circuit assemblies |
JPH01121287U (en) * | 1988-02-12 | 1989-08-17 | ||
JPH1079560A (en) * | 1996-09-05 | 1998-03-24 | Toshiba Fa Syst Eng Kk | Piled printed board |
JPH11220264A (en) * | 1998-02-02 | 1999-08-10 | Denso Corp | On-vehicle electronic device |
US5994648A (en) * | 1997-03-27 | 1999-11-30 | Ford Motor Company | Three-dimensional molded sockets for mechanical and electrical component attachment |
JP2002134869A (en) * | 2000-10-19 | 2002-05-10 | Daikin Ind Ltd | Electrical part unit |
WO2004015775A1 (en) * | 2002-08-09 | 2004-02-19 | Nederlandse Organisatie Voor Toegepast- Natuurwetenschappelijk Onderzoek Tno | Stacking substrate for at least one ic and system comprising such a substrate |
DE10337443A1 (en) * | 2003-08-14 | 2005-03-24 | Siemens Ag | Circuit layout for a motor vehicle's passenger safety system has a main board (MB) with circuit components (CC) and an additional board to carry other CC and to fit on the MB with a support |
US20050180120A1 (en) * | 2004-02-13 | 2005-08-18 | Levi Robert W. | Compact navigation device assembly |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3938865A1 (en) * | 1989-11-24 | 1991-05-29 | Reinshagen Kabelwerk Gmbh | ELECTRICAL CONTROL DEVICE WITH HOUSING, IN PARTICULAR MODULE FOR A DECENTRALIZED WIRING SYSTEM |
DE4400985C1 (en) | 1994-01-14 | 1995-05-11 | Siemens Ag | Method for producing a three-dimensional circuit arrangement |
DE4427516A1 (en) | 1994-08-03 | 1996-02-15 | Siemens Ag | 3-Dimensional IC mfg. process |
DE4427515C1 (en) | 1994-08-03 | 1995-08-24 | Siemens Ag | Production of three=dimensional solid state circuit |
KR100270869B1 (en) * | 1997-10-10 | 2001-01-15 | 윤종용 | Three dimensional composite cubic circuit board |
DE10313622B3 (en) | 2003-03-26 | 2005-01-13 | Siemens Ag | Method for the electrical and mechanical connection of two printed circuit boards |
JP2005197493A (en) * | 2004-01-08 | 2005-07-21 | Ihi Aerospace Co Ltd | Circuit board assembly |
DE102004057422A1 (en) * | 2004-11-27 | 2006-06-08 | Hiss, Eckart, Dr. | Printed circuit board, has thermal shield module including thermal fuse, which is in thermal contact with passive/active/electronic component area, and interrupts current supply to module when temperature limit of module is exceeded |
-
2007
- 2007-09-28 DE DE102007046493A patent/DE102007046493A1/en not_active Withdrawn
-
2008
- 2008-08-28 WO PCT/EP2008/061346 patent/WO2009043649A2/en active Application Filing
Patent Citations (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB840762A (en) * | 1955-08-11 | 1960-07-13 | Emi Ltd | Improvements in or relating to electrical apparatus |
US3673669A (en) * | 1970-11-19 | 1972-07-04 | Sperry Rand Corp | Method of making side entry card guides |
US4571663A (en) * | 1982-06-19 | 1986-02-18 | Ferranti Plc | Electrical circuit assemblies |
JPH01121287U (en) * | 1988-02-12 | 1989-08-17 | ||
JPH1079560A (en) * | 1996-09-05 | 1998-03-24 | Toshiba Fa Syst Eng Kk | Piled printed board |
US5994648A (en) * | 1997-03-27 | 1999-11-30 | Ford Motor Company | Three-dimensional molded sockets for mechanical and electrical component attachment |
JPH11220264A (en) * | 1998-02-02 | 1999-08-10 | Denso Corp | On-vehicle electronic device |
JP2002134869A (en) * | 2000-10-19 | 2002-05-10 | Daikin Ind Ltd | Electrical part unit |
WO2004015775A1 (en) * | 2002-08-09 | 2004-02-19 | Nederlandse Organisatie Voor Toegepast- Natuurwetenschappelijk Onderzoek Tno | Stacking substrate for at least one ic and system comprising such a substrate |
DE10337443A1 (en) * | 2003-08-14 | 2005-03-24 | Siemens Ag | Circuit layout for a motor vehicle's passenger safety system has a main board (MB) with circuit components (CC) and an additional board to carry other CC and to fit on the MB with a support |
US20050180120A1 (en) * | 2004-02-13 | 2005-08-18 | Levi Robert W. | Compact navigation device assembly |
Non-Patent Citations (3)
Title |
---|
DATABASE WPI Week 199822, Derwent World Patents Index; AN 1998-247510 * |
DATABASE WPI Week 199942, Derwent World Patents Index; AN 1999-504649 * |
DATABASE WPI Week 200249, Derwent World Patents Index; AN 2002-459615 * |
Also Published As
Publication number | Publication date |
---|---|
WO2009043649A2 (en) | 2009-04-09 |
DE102007046493A1 (en) | 2009-04-09 |
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