WO2009043653A1 - Method for adjusting measuring probes - Google Patents

Method for adjusting measuring probes Download PDF

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Publication number
WO2009043653A1
WO2009043653A1 PCT/EP2008/061381 EP2008061381W WO2009043653A1 WO 2009043653 A1 WO2009043653 A1 WO 2009043653A1 EP 2008061381 W EP2008061381 W EP 2008061381W WO 2009043653 A1 WO2009043653 A1 WO 2009043653A1
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WIPO (PCT)
Prior art keywords
measuring
needles
optical sensor
measuring probes
measuring needles
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PCT/EP2008/061381
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German (de)
French (fr)
Inventor
Detlef Gerhard
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Siemens Aktiengesellschaft
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Publication of WO2009043653A1 publication Critical patent/WO2009043653A1/en

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2891—Features relating to contacting the IC under test, e.g. probe heads; chucks related to sensing or controlling of force, position, temperature

Definitions

  • the invention relates to a method for adjusting measuring needles for accurately contacting electrically to be tested components by means of several measuring needle tips simultaneously.
  • the object to be tested is contacted with the measuring needle tips of a measuring instrument and the measurement is started.
  • One application of the measurement method is the wafer test. On a wafer, for example, a plurality of semiconductor devices, the so-called chips applied. Each chip has measuring points for the electrical measurement, so-called pads.
  • the measuring needles are placed on the pads provided for this purpose and then the function of the electronic component is checked.
  • the wafer is raised in such a way that the measuring needles of the measuring system electrically contact the pads of the measuring object. All contacted pads are electrically contacted by the measuring needles.
  • the measuring needles are positioned in relation to the chip layer and to the position of the chip matrix in such a way that a fault-free contacting of all the chips of the wafer is possible.
  • the invention is based on the object to provide a method for adjusting measuring needles for contacting in the electrical testing of electronic assemblies or wafers, with incorrect positioning in the testing process can be avoided.
  • the invention is based on the finding that the position of measuring needle tips or in general a group of measuring needles can be detected at a specific predeterminable time before the actual testing operations or after inserting a new measuring needle spider with a plurality of measuring needles using a two-dimensional camera system and by means of at least one actuating drive is, a malposition is recognizable and tracking in an optimal position is feasible.
  • the group of measuring needles is optimally positioned and aligned.
  • Optimal means that a large number of simultaneously movable measuring needles with corresponding measuring needle tips can simultaneously be placed on a surface to be tested on test specimens.
  • the measuring needle tips are illuminated essentially in the incident light below the measuring station and their image is generated after transmission with corresponding mirror units in a camera, analyzed and examined with regard to a rotational misalignment about the Z axis.
  • a measuring needle card is detected in an existing rotary misalignment and corrected in the positioning by being rotated about the Z-axis.
  • FIG. 1 shows a measuring needle spider consisting of a measuring needle ring on which measuring needles are applied
  • FIG. 2 shows a measuring plate with a measuring needle card rotatably mounted therein and with a measuring needle spider contained therein.
  • FIG. 3 shows a measuring setup for measuring the rotation about the z-axis.
  • Figure 1 shows a measuring needle spider 1, which consists of a metal connecting ring 2, which receives measuring needles 3, wherein the measuring needles protrude with their needle tips in the inner region of the ring and stand down.
  • the measuring needle tips 4 are aligned in a predetermined mutual arrangement, in particular the measuring needle tips 4 are as possible on a straight line.
  • the coordinate system 8 of the measuring needles is indicated in Figure 1, wherein the z-axis is perpendicular to the image plane.
  • FIG. 2 shows the measuring spider 1, which is accommodated in a so-called measuring needle card 6, the coordinate system 8 of the measuring needles being correspondingly indicated by broken lines.
  • the measuring needle card 6 is received in a measuring plate 7, the coordinate system 9 is shown with the coordinates xp and yp in Figure 2.
  • the metal connection ring 2 can be twisted together with the measuring needle card 6 relative to the measuring plate 7, as shown in FIG. This means a misalignment of the measuring needles in test methods that are performed with the measuring needles on chips.
  • FIG. 3 shows, in a side view, that the measuring plate 7 is oriented generally parallel to the workpiece carrier with a measuring object located thereon, for example a wafer 11.
  • FIG. 3 shows the overall measuring system, wherein a so-called measuring needle monitoring on the one hand monitors the system for rotational misalignments and thus takes into account data from an image analysis.
  • the image analysis uses data from the optical sensor, in particular a two-dimensionally resolving camera 18, which is part of the optical sensor. Indicated is the coordinate system 8 of the measuring needles 3.
  • the object illumination is done according to the incident light principle.
  • the optical sensor has an illumination 13, which images the measuring needles 4 in the transmitted-light system by means of a measuring beam 17 and via a deflecting mirror 14 into the camera 18.
  • the image analysis gives data regarding the check whether there is a twist or not.
  • a correction of the needles is made and achieved an accurate rotational alignment.
  • a two-dimensionally resolving CCD camera is used for optical imaging.
  • the illustration of the needles and their tips is done in the incident light principle.
  • a light source 13 illuminates the measuring needles 3 and their tips 4.
  • the light source can be operated by means of light-emitting diodes.
  • the chuck 12 is moved in such a way that the measuring needles are illuminated by means of the sensor according to the reflected-light principle and a rotation of a needle group occurs before the test Process. Due to the automatic readjustment, the contact runs can be shortened during the test procedure. The chip surfaces and the measuring needles are less heavily loaded, resulting in the reduction of chip failures. Furthermore, the measuring needle wear is minimized.
  • the adjustment ranges are in the ⁇ m range.
  • At least one deflection mirror may be contained in the beam path of the optical sensor. Decisive for the parallel orientation is the surface, for example a wafer or an assembly.
  • a measuring needle spider 1 is supported on a measuring needle card 6 and the measuring needle card 6 is in turn mounted in a measuring plate 7.
  • the measuring needle spider or the measuring needle card is corrected in the rotary position.
  • a correction angle 15 for correcting an angle-related misalignment by means of an actuator is taken into account in each case, so that in particular the measuring needle tips 4 in a coordinate system of the overlapping system are aligned in such a way that they can optimally rest on components to be tested during test procedures.
  • FIG. 3 shows the essential components of the optical sensor in the form of the illumination 13, an additional illumination 16 and 19, the camera 18 and the corresponding beam path 17, image processing being used for the adjustment of the measuring card 6 or of the measuring needle tips.
  • the optical sensor checks a malposition of the measuring needle tips, in particular below the measuring arrangement.
  • At least one deflecting mirror is used for imaging the measuring needle tips or larger parts of the measuring needles, which directly or indirectly is fixedly connected to the upper linear axis of the chuck drive is connected.
  • At least one deflection mirror can also be connected to the axis of rotation seated on the upper linear axis or to the chuck sitting thereon.
  • a deflecting mirror can alternatively be represented as a beam splitter. This allows additional illumination from another direction.
  • an additional light source which couples in via a deflecting mirror or beam splitter, is provided.
  • an optical sensor with integrated light source can also be used.
  • the gauge quality can be automatically assessed. Worn or damaged needles are detected in time. The electronic components are less burdened by these electrical testing operations.

Abstract

The invention relates to a method for automatically adjusting measuring probes (3) in relation to the surfaces of test samples, such as electronic components. According to the invention, the measuring probes are moved in relation to the test sample in order to carry out the electric testing process and said probes perform the process once they are in position and make contact. The position of measuring probes (3) is recognised using an optical sensor with the aid of reflected light at a predeterminable time in a test system and incorrect positioning with regard to the mis-rotation of a group of measuring probes is determined by image processing. If the incorrect positioning is significant, a measuring probe spider (1), provided with several measuring probes, is rotated into the correct position by means of an actuating mechanism.

Description

Verfahren zur Justierung von Messnadeln Method for adjusting measuring needles
Die Erfindung betrifft ein Verfahren zur Justierung von Messnadeln zum genauen Kontaktieren von elektrisch zu testenden Bauelementen mittels mehrerer Messnadelspitzen gleichzeitig.The invention relates to a method for adjusting measuring needles for accurately contacting electrically to be tested components by means of several measuring needle tips simultaneously.
Zum elektrischen Testen von Baugruppen, Chips auf Wafern oder sonstigen elektronischen Komponenten wird das zu testende Objekt mit den Messnadelspitzen eines Messinstrumentes kontaktiert und die Messung wird gestartet. Eine Anwendungsmöglichkeit des Messverfahrens ist der Wafer-Test. Auf einem Wafer sind beispielsweise mehrere Halbleiterbauelemente, die sogenannten Chips aufgebracht. Jeder Chip besitzt Messstellen für die elektrische Messung, sogenannte Pads . Beim elektrischen Wafer-Test werden die Messnadeln auf die hierfür vorgesehenen Pads aufgesetzt und anschließend wird die Funktion des elektronischen Bauteils geprüft. Zum Kontaktieren wird der Wafer derart angehoben, dass die Messnadeln des Messsystems die Pads des Messobjektes elektrisch kontaktieren. Dabei werden sämtliche kontaktierten Pads von den Messnadeln elektrisch kontaktiert. Die Messnadeln werden im Bezug zur Chiplage und zur Lage der Chipmatrix derart positioniert, dass ein fehlerfreies Kontaktieren sämtlicher Chips des Wafers möglich ist.For electrical testing of assemblies, chips on wafers or other electronic components, the object to be tested is contacted with the measuring needle tips of a measuring instrument and the measurement is started. One application of the measurement method is the wafer test. On a wafer, for example, a plurality of semiconductor devices, the so-called chips applied. Each chip has measuring points for the electrical measurement, so-called pads. In the electrical wafer test, the measuring needles are placed on the pads provided for this purpose and then the function of the electronic component is checked. For contacting, the wafer is raised in such a way that the measuring needles of the measuring system electrically contact the pads of the measuring object. All contacted pads are electrically contacted by the measuring needles. The measuring needles are positioned in relation to the chip layer and to the position of the chip matrix in such a way that a fault-free contacting of all the chips of the wafer is possible.
Bisher war es notwendig, dass ein Einrichter nach definierten zeitlichen Intervallen oder vor jedem Prüfvorgang die sogenannten Messkarten mit darauf befindlichen Messspinnen mit entsprechenden Messnadeln unter einem Mikroskop justieren musste. Ziel ist jeweils die Messnadeln möglichst optimal auf die elektrischen Anschlussflecken, die Pads, auszurichten wenn das Messsystem mit den Messnadeln jeweils auf zu prüfende elektronische Strukturen aufsetzt. Durch das bei einer Prüfung notwendige Anfahren, in Position fahren, und Kontaktieren von Chips werden auf den Pads Nadelabdrücke erzeugt. Diese Nadelabdrücke werden vom Einrichter unter dem Mikroskop analysiert und gegebenenfalls wird der Einrichtvorgang bis zum Erreichen eines befriedigenden Messergebnisses wiederholt.So far, it was necessary that a setter had to adjust the so-called measuring cards with measuring spiders located thereon with corresponding measuring needles under a microscope after defined time intervals or before each test procedure. The aim is to align the measuring needles as optimally as possible with the electrical pads, the pads, when the measuring system with the measuring needles in each case touches on electronic structures to be tested. Necessary start-up, positioning, and contacting of chips results in needle prints on the pads. These needleprints are analyzed by the fitter under the microscope and, if necessary, the setting up is done repeated to achieve a satisfactory measurement result.
Der Erfindung liegt die Aufgabe zu Grunde, ein Verfahren zur Justierung von Messnadeln zur Kontaktierung bei der elektrischen Prüfung von elektronischen Baugruppen oder Wafern bereitzustellen, wobei Fehlpositionierungen im Prüfvorgang vermieden werden.The invention is based on the object to provide a method for adjusting measuring needles for contacting in the electrical testing of electronic assemblies or wafers, with incorrect positioning in the testing process can be avoided.
Die Lösung dieser Aufgabe geschieht durch die Merkmalskombination entsprechend dem Hauptanspruch. Vorteilhafte Ausgestaltungen sind den Unteransprüchen zu entnehmen.The solution to this problem is done by the combination of features according to the main claim. Advantageous embodiments can be found in the dependent claims.
Der Erfindung liegt die Erkenntnis zu Grunde, dass die Lage von Messnadelspitzen oder allgemein einer Gruppe von Messnadeln zu einem bestimmten vorgebbaren Zeitpunkt vor den eigentlichen Testvorgängen oder nach dem Einsetzen einer neuen Messnadelspinne mit mehreren Messnadeln unter Einsatz eines zweidimensionalen Kamerasystems und mittels mindestens eines Stellantriebes zunächst erfassbar ist, eine Fehlstellung erkennbar ist und eine Nachführung in eine optimale Lage durchführbar ist. Somit ist für mindestens einen, meist eine Vielzahl, von Testvorgängen die Gruppe von Messnadeln optimal positioniert und ausgerichtet. Optimal bedeutet, dass eine Vielzahl von gleichzeitig verfahrbaren Messnadeln mit entsprechenden Messnadelspitzen gleichzeitig auf eine zu testenden Oberfläche von Prüflingen aufsetzen.The invention is based on the finding that the position of measuring needle tips or in general a group of measuring needles can be detected at a specific predeterminable time before the actual testing operations or after inserting a new measuring needle spider with a plurality of measuring needles using a two-dimensional camera system and by means of at least one actuating drive is, a malposition is recognizable and tracking in an optimal position is feasible. Thus, for at least one, usually a plurality of testing operations, the group of measuring needles is optimally positioned and aligned. Optimal means that a large number of simultaneously movable measuring needles with corresponding measuring needle tips can simultaneously be placed on a surface to be tested on test specimens.
Es werden die Messnadelspitzen im Wesentlichen unterhalb der Messstation im Auflicht beleuchtet und deren Bild wird nach der Übertragung mit entsprechenden Spiegeleinheiten in einer Kamera erzeugt, analysiert und hinsichtlich einer rotatorischen Fehlstellung um die Z-Achse untersucht. Mittels entsprechender Überwachung wird eine Messnadelkarte in einer vorhandenen rotatorischen Fehlstellung erkannt und in der Positionierung korrigiert, indem Sie um die Z-Achse gedreht wird. Somit ist insgesamt die Anordnung einer Vielzahl von Messnadelspitzen derart ausgerichtet dass sie eine große An- zahl von Prüfvorgängen parallel beziehungsweise gleichzeitig auf den zu prüfenden Oberflächen aufsetzt. So wird ein bestimmtes elektronisches Bauteil, welches beispielsweise auf einen Wafer vorhanden ist, kurz mit den Messnadeln angefah- ren, kurz kontaktiert und elektrisch überprüft. Der entsprechende Vorgang wiederholt sich für eine große Anzahl von nebeneinander liegenden Bauelementen.The measuring needle tips are illuminated essentially in the incident light below the measuring station and their image is generated after transmission with corresponding mirror units in a camera, analyzed and examined with regard to a rotational misalignment about the Z axis. By means of appropriate monitoring, a measuring needle card is detected in an existing rotary misalignment and corrected in the positioning by being rotated about the Z-axis. Thus, overall, the arrangement of a plurality of measuring needle tips is oriented in such a way that they have a large number of test operations is set up parallel or simultaneously on the surfaces to be tested. Thus, a specific electronic component, which is present for example on a wafer, briefly approached with the measuring needles, briefly contacted and electrically checked. The process is repeated for a large number of adjacent components.
Im Folgenden werden anhand von schematischen begleitenden Fi- guren, die die Erfindung jedoch nicht einschränken, wie im Ausführungsbeispiel beschrieben.In the following, with reference to schematic accompanying figures, which, however, do not limit the invention, as described in the embodiment.
Figur 1 zeigt, eine Messnadelspinne bestehend aus einem Messnadelring auf dem Messnadeln aufgebracht sind,FIG. 1 shows a measuring needle spider consisting of a measuring needle ring on which measuring needles are applied,
Figur 2 zeigt, eine Messplatte mit darin verdrehbar gelagerter Messnadelkarte und darin enthaltener Messnadelspinne,FIG. 2 shows a measuring plate with a measuring needle card rotatably mounted therein and with a measuring needle spider contained therein.
Figur 3 zeigt, einen Messaufbau zur Messung der Verdrehung um die z- Achse.FIG. 3 shows a measuring setup for measuring the rotation about the z-axis.
Figur 1 zeigt eine Messnadelspinne 1, die aus einem Metall- Anschlussring 2 besteht, der Messnadeln 3 aufnimmt, wobei die Messnadeln mit ihren Messnadelspitzen in den inneren Bereich des Rings hineinragen und nach unten hervor stehen. Die Messnadelspitzen 4 sind in einer vorgegebenen gegenseitigen Anordnung ausgerichtet, insbesondere liegen die Messnadelspitzen 4 möglichst auf einer Geraden. Das Koordinatensystem 8 der Messnadeln ist in Figur 1 angedeutet, wobei die z-Achse senkrecht auf der Bildebene steht.Figure 1 shows a measuring needle spider 1, which consists of a metal connecting ring 2, which receives measuring needles 3, wherein the measuring needles protrude with their needle tips in the inner region of the ring and stand down. The measuring needle tips 4 are aligned in a predetermined mutual arrangement, in particular the measuring needle tips 4 are as possible on a straight line. The coordinate system 8 of the measuring needles is indicated in Figure 1, wherein the z-axis is perpendicular to the image plane.
Figur 2 zeigt die Messspinne 1, die in einer so genannten Messnadelkarte 6 aufgenommen ist, wobei das Koordinatensystem 8 der Messnadeln durch unterbrochene Linien entsprechend an- gedeutet ist. Die Messnadelkarte 6 ist in einer Messplatte 7 aufgenommen, deren Koordinatensystem 9 mit den Koordinaten xp und yp in Figur 2 dargestellt ist. Der Metallanschlussring 2 kann zusammen mit der Messnadelkarte 6 gegenüber der Messplatte 7 verdreht sein, wie in Figur 2 dargestellt. Dies bedeutet eine Fehlstellung der Messnadeln bei Prüfverfahren, die mit den Messnadeln an Chips auszuführen sind.FIG. 2 shows the measuring spider 1, which is accommodated in a so-called measuring needle card 6, the coordinate system 8 of the measuring needles being correspondingly indicated by broken lines. The measuring needle card 6 is received in a measuring plate 7, the coordinate system 9 is shown with the coordinates xp and yp in Figure 2. The metal connection ring 2 can be twisted together with the measuring needle card 6 relative to the measuring plate 7, as shown in FIG. This means a misalignment of the measuring needles in test methods that are performed with the measuring needles on chips.
Eine Anordnung nach Figur 3 zeigt in der Seitenansicht, dass die Messplatte 7 allgemein parallel zum Werkstückträger mit darauf befindlichem Messobjekt, beispielsweise einem Wafer 11, ausgerichtet ist.An arrangement according to FIG. 3 shows, in a side view, that the measuring plate 7 is oriented generally parallel to the workpiece carrier with a measuring object located thereon, for example a wafer 11.
Figur 3 zeigt das Gesamtmesssystem, wobei eine so genannte Messnadelüberwachung einerseits das System auf rotatorische Fehlstellungen überwacht und damit Daten von einer Bildanalyse berücksichtigt. Die Bildanalyse greift auf Daten des optischen Sensors, insbesondere einer zweidimensional auflösenden Kamera 18 zurück, die Teil des optischen Sensors ist. Mit angedeutet ist das Koordinatensystem 8 der Messnadeln 3. Die Objektbeleuchtung geschieht nach dem Auflichtprinzip . Der optische Sensor weist eine Beleuchtung 13 auf, die die Messnadeln 4 im Durchlichtsystem mittels eines Messstrahls 17 und über einen Umlenkspiegel 14 in die Kamera 18 abbilden. Die Bildanalyse ergibt Daten hinsichtlich der Prüfung, ob eine Verdrehung vorliegt oder nicht.FIG. 3 shows the overall measuring system, wherein a so-called measuring needle monitoring on the one hand monitors the system for rotational misalignments and thus takes into account data from an image analysis. The image analysis uses data from the optical sensor, in particular a two-dimensionally resolving camera 18, which is part of the optical sensor. Indicated is the coordinate system 8 of the measuring needles 3. The object illumination is done according to the incident light principle. The optical sensor has an illumination 13, which images the measuring needles 4 in the transmitted-light system by means of a measuring beam 17 and via a deflecting mirror 14 into the camera 18. The image analysis gives data regarding the check whether there is a twist or not.
Ausgehend von einer Fehlstellung in Form einer Verdrehung entsprechend Figur 2 wird eine Korrektur der Nadeln vorgenommen und eine genaue rotatorische Ausrichtung erzielt. Zur op- tischen Abbildung wird eine zweidimensional auflösende CCD- Kamera verwendet. Die Abbildung der Nadeln und deren Spitzen erfolgt im Auflichtprinzip . Hierzu beleuchtet eine Lichtquelle 13 die Messnadeln 3 und deren Spitzen 4. Die Lichtquelle kann mittels Licht emittierender Dioden betrieben werden.Starting from a misalignment in the form of a rotation corresponding to Figure 2, a correction of the needles is made and achieved an accurate rotational alignment. For optical imaging, a two-dimensionally resolving CCD camera is used. The illustration of the needles and their tips is done in the incident light principle. For this purpose, a light source 13 illuminates the measuring needles 3 and their tips 4. The light source can be operated by means of light-emitting diodes.
Der Chuck 12 wird derart verfahren, dass die Messnadeln mittels des Sensors nach dem Auflichtprinzip beleuchtet werden und eine Verdrehung einer Nadelgruppe geschieht vor dem Prüf- Vorgang. Aufgrund der automatischen Nachjustierung lassen sich die Kontaktfahrten während des PrüfVorgangs verkürzen. Die Chipoberflächen und die Messnadeln werden weniger stark belastet, was die Reduzierung von Chipausfällen zur Folge hat. Weiterhin wird der Messnadelverschleiß minimiert.The chuck 12 is moved in such a way that the measuring needles are illuminated by means of the sensor according to the reflected-light principle and a rotation of a needle group occurs before the test Process. Due to the automatic readjustment, the contact runs can be shortened during the test procedure. The chip surfaces and the measuring needles are less heavily loaded, resulting in the reduction of chip failures. Furthermore, the measuring needle wear is minimized.
Die Verstellbereiche liegen im μm-Bereich. Im Strahlengang des optischen Sensors kann mindestens ein Umlenkspiegel enthalten sein. Maßgeblich für die parallele Ausrichtung ist die Oberfläche, beispielsweise eines Wafers oder eine Baugruppe.The adjustment ranges are in the μm range. At least one deflection mirror may be contained in the beam path of the optical sensor. Decisive for the parallel orientation is the surface, for example a wafer or an assembly.
Anhand der Figuren ist klar dargestellt, dass sich eine Messnadelspinne 1 an einer Messnadelkarte 6 abstützt und die Messnadelkarte 6 wiederum in eine Messplatte 7 eingebaut ist. Zur Justierung der Messnadellage insbesondere bezüglich einer Fehlstellung durch Verdrehung wird entweder die Messnadelspinne oder die Messnadelkarte in der Drehlage korrigiert.On the basis of the figures it is clearly shown that a measuring needle spider 1 is supported on a measuring needle card 6 and the measuring needle card 6 is in turn mounted in a measuring plate 7. For adjusting the measuring needle position, in particular with respect to a misalignment by rotation, either the measuring needle spider or the measuring needle card is corrected in the rotary position.
Entsprechend Figur 2 wird in jedem Fall ein Korrekturwinkel 15 zur Korrektur einer winkelbezogenen Fehlstellung mittels eines Stellantriebes berücksichtigt, so dass insbesondere die Messnadelspitzen 4 in einem Koordinatensystem des übergreifenden Systems derart ausgerichtet sind, dass sie bei Prüfvorgängen optimal auf zu testende Bauelemente aufsetzen kön- nen.According to FIG. 2, a correction angle 15 for correcting an angle-related misalignment by means of an actuator is taken into account in each case, so that in particular the measuring needle tips 4 in a coordinate system of the overlapping system are aligned in such a way that they can optimally rest on components to be tested during test procedures.
In Figur 3 sind die wesentlichen Bestandteile des optischen Sensors in Form der Beleuchtung 13, einer zusätzlichen Beleuchtung 16 und 19, der Kamera 18 und dem entsprechenden Strahlengang 17 dargestellt, wobei eine Bildverarbeitung für die Justierung der Messkarte 6 beziehungsweise der Messnadelspitzen eingesetzt wird.FIG. 3 shows the essential components of the optical sensor in the form of the illumination 13, an additional illumination 16 and 19, the camera 18 and the corresponding beam path 17, image processing being used for the adjustment of the measuring card 6 or of the measuring needle tips.
Der optische Sensor prüft eine Fehlstellung der Messnadel- spitzen insbesondere unterhalb des Messanordnung. Zur Abbildung der Messnadelspitzen oder größerer Teile der Messnadeln wird mindestens ein Umlenkspiegel verwendet, welcher direkt oder indirekt fest mit der oberen Linearachse des Chuckan- triebs verbunden ist. Mindestens ein Umlenkspiegel kann auch mit der auf der oberen Linearachse sitzenden Rotationsachse oder dem hierauf sitzenden Chuck verbunden sein.The optical sensor checks a malposition of the measuring needle tips, in particular below the measuring arrangement. At least one deflecting mirror is used for imaging the measuring needle tips or larger parts of the measuring needles, which directly or indirectly is fixedly connected to the upper linear axis of the chuck drive is connected. At least one deflection mirror can also be connected to the axis of rotation seated on the upper linear axis or to the chuck sitting thereon.
Ein Umlenkspiegel kann alternativ als Strahlteiler dargestellt werden. Dies ermöglicht eine zusätzliche Beleuchtung aus einer weiteren Richtung.A deflecting mirror can alternatively be represented as a beam splitter. This allows additional illumination from another direction.
Zur weiteren Beleuchtung der Messnadel ist eine zusätzliche Lichtquelle, die über einen Umlenkspiegel oder Strahlteiler einkoppelt, vorgesehen. Anstelle eines Umlenkspiegels kann auch ein optischer Sensor mit integrierter Lichtquelle verwendet werden.For further illumination of the measuring needle, an additional light source, which couples in via a deflecting mirror or beam splitter, is provided. Instead of a deflecting mirror, an optical sensor with integrated light source can also be used.
Aufgrund automatisch einstellbaren Nadelpositionen kann sichergestellt werden, dass die Messnadeln im Rahmen der Kontaktfahrten bei den später auszuführenden Prüfverfahren beziehungsweise Kontaktfahrten auf die Pads treffen und nicht auf Regionen elektrisch kontaktieren, die nicht dafür vorge- sehen sind. Zusätzlich kann die Messnadelqualität automatisch beurteilt werden. Verschlissene oder beschädigte Messnadeln werden rechtzeitig erkannt. Die elektronischen Bauelemente werden durch diese elektrischen Testvorgänge weniger belastet . Due to automatically adjustable needle positions, it is possible to ensure that the measuring needles encounter the pads during the contact movements during the later test procedures or contact journeys and do not electrically contact regions that are not intended for this purpose. In addition, the gauge quality can be automatically assessed. Worn or damaged needles are detected in time. The electronic components are less burdened by these electrical testing operations.

Claims

Patentansprüche claims
1. Verfahren zur automatischen Justierung von Messnadeln (3) relativ zu Oberflächen von Prüflingen, wie elektronischen Bauelementen, wobei die Messnadeln zum elektrischen Prüfen relativ zum Prüfling verfahren werden und nach dem Aufsetzen und Kontaktieren entsprechend elektrisch Prüfen, dadurch gekennzeichnet, dass1. A method for automatic adjustment of measuring needles (3) relative to surfaces of specimens, such as electronic components, wherein the measuring needles are moved for electrical testing relative to the DUT and according to touchdown and contacting according electrically test, characterized in that
- mittels eines optischen Sensors die Lage von Messnadeln (3) mit dem Auflichtprinzip zu einem vorgebbaren Zeitpunkt in einem Prüfsystem erkannt wird,by means of an optical sensor the position of measuring needles (3) with the reflected-light principle is recognized at a predeterminable time in a test system,
- eine Bildverarbeitung Fehlstellungen hinsichtlich einer Verdrehung einer Gruppe von Messnadeln ermittelt, undan image processing determines misalignments with respect to a rotation of a group of measuring needles, and
- bei wesentlichen Fehlstellungen eine mit mehreren Messna- dein bestückte Messnadelspinne (1) mittels eines Stellantriebs in die korrekte Lage gedreht wird.- In the case of significant misalignments, a measuring needle spider (1) equipped with several measuring points is turned into the correct position by means of an actuator.
2. Verfahren nach Anspruch 1, dadurch gekennzeichnet, dass ein optischer Sensor eine zwei- dimensional auflösende Kamera umfasst, insbesondere eine CCD- Kamera .2. The method according to claim 1, characterized in that an optical sensor comprises a two-dimensional resolution camera, in particular a CCD camera.
3. Verfahren nach Anspruch 1 oder 2, dadurch gekennzeichnet, dass neben der Ausrichtung der Mess- nadeln (3) die Position der Messnadelspitzen (4) mit berücksichtigt wird.3. The method according to claim 1 or 2, characterized in that in addition to the orientation of the measuring needles (3), the position of the measuring needle tips (4) is taken into account.
4. Verfahren nach einem der Ansprüche 1 bis 3, dadurch gekennzeichnet, dass der optische Sensor eine LED- Beleuchtung aufweist.4. The method according to any one of claims 1 to 3, characterized in that the optical sensor has an LED illumination.
5. Verfahren nach einem der Ansprüche 1 bis 4, dadurch gekennzeichnet, dass eine Objektbeleuchtung mittels diffusem Licht geschieht.5. The method according to any one of claims 1 to 4, characterized in that an object illumination is done by means of diffused light.
6. Verfahren nach einem der Ansprüche 1 bis 5, dadurch gekennzeichnet, dass ein Objektträger derart verfahren wird, dass Justiervorgänge in einer Justierstation ablaufen .6. The method according to any one of claims 1 to 5, characterized in that a slide is moved in such a way that adjusting processes take place in an adjustment station.
7. Verfahren nach einem der Ansprüche 1 bis 6, dadurch gekennzeichnet, dass ein Justiervorgang vor jedem7. The method according to any one of claims 1 to 6, characterized in that an adjustment before each
PrüfVorgang erfolgt. Checking process takes place.
PCT/EP2008/061381 2007-09-28 2008-08-29 Method for adjusting measuring probes WO2009043653A1 (en)

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DE200710046446 DE102007046446A1 (en) 2007-09-28 2007-09-28 Method for adjusting measuring needles

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US5642056A (en) * 1993-12-22 1997-06-24 Tokyo Electron Limited Probe apparatus for correcting the probe card posture before testing
US5644245A (en) * 1993-11-24 1997-07-01 Tokyo Electron Limited Probe apparatus for inspecting electrical characteristics of a microelectronic element
US6118894A (en) * 1993-06-04 2000-09-12 Schwartz; Rodney E. Integrated circuit probe card inspection system
US6208375B1 (en) * 1999-05-21 2001-03-27 Elite Engineering Corporation Test probe positioning method and system for micro-sized devices
US20070096763A1 (en) * 2005-10-18 2007-05-03 Gsi Group Corporation Methods and apparatus for utilizing an optical reference

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Publication number Priority date Publication date Assignee Title
US5394100A (en) * 1993-05-06 1995-02-28 Karl Suss America, Incorporated Probe system with automatic control of contact pressure and probe alignment
US6118894A (en) * 1993-06-04 2000-09-12 Schwartz; Rodney E. Integrated circuit probe card inspection system
US5644245A (en) * 1993-11-24 1997-07-01 Tokyo Electron Limited Probe apparatus for inspecting electrical characteristics of a microelectronic element
US5642056A (en) * 1993-12-22 1997-06-24 Tokyo Electron Limited Probe apparatus for correcting the probe card posture before testing
US6208375B1 (en) * 1999-05-21 2001-03-27 Elite Engineering Corporation Test probe positioning method and system for micro-sized devices
US20070096763A1 (en) * 2005-10-18 2007-05-03 Gsi Group Corporation Methods and apparatus for utilizing an optical reference

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EP2193381A1 (en) 2010-06-09
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