WO2009044113A3 - Semiconductor wafer metrology apparatus and method - Google Patents

Semiconductor wafer metrology apparatus and method Download PDF

Info

Publication number
WO2009044113A3
WO2009044113A3 PCT/GB2008/003292 GB2008003292W WO2009044113A3 WO 2009044113 A3 WO2009044113 A3 WO 2009044113A3 GB 2008003292 W GB2008003292 W GB 2008003292W WO 2009044113 A3 WO2009044113 A3 WO 2009044113A3
Authority
WO
WIPO (PCT)
Prior art keywords
wafer
semiconductor wafer
metrology apparatus
weight
wafer metrology
Prior art date
Application number
PCT/GB2008/003292
Other languages
French (fr)
Other versions
WO2009044113A2 (en
Inventor
Robert John Wilby
Original Assignee
Metryx Ltd
Robert John Wilby
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Metryx Ltd, Robert John Wilby filed Critical Metryx Ltd
Priority to JP2010527513A priority Critical patent/JP5414123B2/en
Priority to US12/680,755 priority patent/US8357548B2/en
Priority to EP08806442A priority patent/EP2201394B1/en
Publication of WO2009044113A2 publication Critical patent/WO2009044113A2/en
Publication of WO2009044113A3 publication Critical patent/WO2009044113A3/en
Priority to US13/686,265 priority patent/US9228886B2/en

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01G—WEIGHING
    • G01G21/00—Details of weighing apparatus
    • G01G21/28—Frames, Housings
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01G—WEIGHING
    • G01G21/00—Details of weighing apparatus
    • G01G21/22—Weigh pans or other weighing receptacles; Weighing platforms
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01G—WEIGHING
    • G01G23/00—Auxiliary devices for weighing apparatus
    • G01G23/01—Testing or calibrating of weighing apparatus
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01G—WEIGHING
    • G01G23/00—Auxiliary devices for weighing apparatus
    • G01G23/14—Devices for determining tare weight or for cancelling out the tare by zeroising, e.g. mechanically operated
    • G01G23/16—Devices for determining tare weight or for cancelling out the tare by zeroising, e.g. mechanically operated electrically or magnetically operated
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01G—WEIGHING
    • G01G9/00—Methods of, or apparatus for, the determination of weight, not provided for in groups G01G1/00 - G01G7/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/10—Measuring as part of the manufacturing process
    • H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)

Abstract

A semiconductor wafer metrology technique comprising performing atmospheric buoyancy compensated weighing of a wafer, in which the wafer is weighed in a substantially upright condition. A vertical or near vertical wafer orientation causes the surface area in the direction of a force (weight) sensor to be reduced compared with a horizontal wafer orientation. Hence, the electrostatic force components acting in the same direction as the wafer weight force component is reduced.
PCT/GB2008/003292 2007-10-04 2008-09-29 Semiconductor wafer metrology apparatus and method WO2009044113A2 (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2010527513A JP5414123B2 (en) 2007-10-04 2008-09-29 Semiconductor wafer measuring apparatus and method
US12/680,755 US8357548B2 (en) 2007-10-04 2008-09-29 Semiconductor wafer metrology apparatus and method
EP08806442A EP2201394B1 (en) 2007-10-04 2008-09-29 Semiconductor wafer metrology apparatus and method
US13/686,265 US9228886B2 (en) 2007-10-04 2012-11-27 Semiconductor wafer weight metrology apparatus

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
GBGB0719460.8A GB0719460D0 (en) 2007-10-04 2007-10-04 Measurement apparatus and method
GB0719460.8 2007-10-04

Related Child Applications (3)

Application Number Title Priority Date Filing Date
US12/680,755 A-371-Of-International US8357548B2 (en) 2007-10-04 2008-09-29 Semiconductor wafer metrology apparatus and method
US13/686,265 Continuation US9228886B2 (en) 2007-10-04 2012-11-27 Semiconductor wafer weight metrology apparatus
US13/686,265 Division US9228886B2 (en) 2007-10-04 2012-11-27 Semiconductor wafer weight metrology apparatus

Publications (2)

Publication Number Publication Date
WO2009044113A2 WO2009044113A2 (en) 2009-04-09
WO2009044113A3 true WO2009044113A3 (en) 2009-06-04

Family

ID=38739172

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/GB2008/003292 WO2009044113A2 (en) 2007-10-04 2008-09-29 Semiconductor wafer metrology apparatus and method

Country Status (6)

Country Link
US (2) US8357548B2 (en)
EP (1) EP2201394B1 (en)
JP (1) JP5414123B2 (en)
GB (1) GB0719460D0 (en)
TW (1) TWI454667B (en)
WO (1) WO2009044113A2 (en)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB0719460D0 (en) * 2007-10-04 2007-11-14 Metryx Ltd Measurement apparatus and method
ITBO20110105A1 (en) * 2011-03-04 2012-09-05 Ima Life Srl DEVICE FOR WEIGHING OBLUNG CONTAINERS POWERED ALONG A CONVEYANCE LINE
GB201315715D0 (en) 2013-09-04 2013-10-16 Metryx Ltd Method and device for determining information relating to the mass of a semiconductor wafer
DE102014101566A1 (en) * 2013-11-08 2015-05-13 Sartorius Lab Instruments Gmbh & Co. Kg Balance for calibration of pipettes
GB201405926D0 (en) * 2014-04-02 2014-05-14 Metryx Ltd Semiconductor wafer weighing apparatus and methods
US9478408B2 (en) 2014-06-06 2016-10-25 Lam Research Corporation Systems and methods for removing particles from a substrate processing chamber using RF plasma cycling and purging
US10081869B2 (en) 2014-06-10 2018-09-25 Lam Research Corporation Defect control in RF plasma substrate processing systems using DC bias voltage during movement of substrates
US10047438B2 (en) 2014-06-10 2018-08-14 Lam Research Corporation Defect control and stability of DC bias in RF plasma-based substrate processing systems using molecular reactive purge gas
US10989652B2 (en) 2017-09-06 2021-04-27 Lam Research Corporation Systems and methods for combining optical metrology with mass metrology
US10325796B2 (en) * 2017-10-30 2019-06-18 Taiwan Semiconductor Manufacturing Co., Ltd. Apparatus and system for detecting wafer damage
CN108344486B (en) * 2018-03-29 2019-10-11 深圳市联新移动医疗科技有限公司 The infusion test method and device on charged state automatic correcting measuring basis
DE102018209725A1 (en) * 2018-06-15 2019-12-19 Krones Ag Method and device for load identification of a transport element of a long stator linear motor system
CN114136422A (en) * 2020-09-03 2022-03-04 长鑫存储技术有限公司 Weighing device

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5625170A (en) * 1994-01-18 1997-04-29 Nanometrics Incorporated Precision weighing to monitor the thickness and uniformity of deposited or etched thin film
WO2002003449A2 (en) * 2000-07-05 2002-01-10 Metryx Limited Apparatus and method for investigating semiconductor wafers
US20050199078A1 (en) * 2004-02-18 2005-09-15 Infineon Technologies Ag Method and apparatus for determination of the depth of depressions which are formed in a mount substrate
GB2442857A (en) * 2006-10-11 2008-04-16 Metryx Ltd Measuring apparatus

Family Cites Families (45)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE705715C (en) 1939-07-11 1941-05-07 Erich Sartorius Device for disabling electrical charges on parts used in weighing operations
US3949295A (en) 1974-03-20 1976-04-06 Western Electric Company, Inc. Apparatus for retaining articles in an array for testing
US4291775A (en) * 1979-11-01 1981-09-29 Cem Corporation Method and apparatus for improving weighing accuracy
US4368791A (en) * 1980-10-14 1983-01-18 Jackson James M Postage estimator device
JPS57123892A (en) 1981-01-17 1982-08-02 Toshiba Corp Preparation and apparatus of single crystal
DE3106534A1 (en) 1981-02-21 1982-10-28 Sartorius GmbH, 3400 Göttingen Electronic scales
DE8104877U1 (en) * 1981-02-21 1982-06-16 Sartorius GmbH, 3400 Göttingen UPPER-SHELL ELECTRONIC SCALE
CH656224A5 (en) 1982-07-29 1986-06-13 Mettler Instrumente Ag HIGH-RESOLUTION SCALE.
JPS61195312A (en) 1985-02-25 1986-08-29 Shimadzu Corp Electronic balance
DE3526021A1 (en) 1985-07-20 1987-01-29 Hv Hofmann Und Voelkel Ohg PORTABLE ION GENERATOR AND USE
JPS62103951A (en) 1985-10-29 1987-05-14 Toshiba Corp Ion implanting apparatus
CH671630A5 (en) * 1986-12-15 1989-09-15 Mettler Instrumente Ag
CH675159A5 (en) * 1988-06-21 1990-08-31 Mettler Toledo Ag
JPH03137091A (en) 1989-10-19 1991-06-11 Hitachi Cable Ltd Production of semiconductor single crystal
JPH03199008A (en) 1989-12-28 1991-08-30 Toshiba Ceramics Co Ltd Blade stretching device
US5050694A (en) * 1990-02-26 1991-09-24 Pelouze Scale Co. Adjustable platform stand for a weigh scale
US5307281A (en) * 1991-07-19 1994-04-26 Wollmann Lothar R Device for weighing and automatically calculating postage for a mailing piece
JPH05129405A (en) 1991-11-05 1993-05-25 Hitachi Ltd Film forming equipment
JP2913962B2 (en) * 1991-11-27 1999-06-28 株式会社島津製作所 Balances for measuring plate samples
JP2647585B2 (en) 1991-11-28 1997-08-27 三菱電機株式会社 Automatic thin film measuring device
JP2576338B2 (en) * 1992-07-31 1997-01-29 株式会社島津製作所 Automatic wafer weighing system
IT1264247B1 (en) 1993-10-22 1996-09-23 Mg 2 Spa METHOD FOR DETERMINING THE WEIGHT OF PHARMACEUTICAL PRODUCTS AND MACHINE FOR DOSING PHARMACEUTICAL PRODUCTS USING
US5719796A (en) 1995-12-04 1998-02-17 Advanced Micro Devices, Inc. System for monitoring and analyzing manufacturing processes using statistical simulation with single step feedback
DE19744618A1 (en) 1997-10-09 1999-04-22 Wacker Siltronic Halbleitermat Gravimetric method for determining material removal from semiconductor wafers
JPH11121594A (en) * 1997-10-16 1999-04-30 Kokusai Electric Co Ltd Semiconductor manufacturing device
EP0932194A1 (en) 1997-12-30 1999-07-28 International Business Machines Corporation Method and system for semiconductor wafer fabrication process real-time in-situ interactive supervision
DE19833767C2 (en) * 1998-07-17 2000-07-27 Francotyp Postalia Gmbh Device for weighing moving mail
DE19849399A1 (en) 1998-10-27 2000-05-04 Mettler Toledo Gmbh Draft shield for a balance and balance with a draft shield
US6268570B1 (en) 1999-09-17 2001-07-31 Cem Corporation Method for correcting weight measurement errors during microwave heating
DE20018310U1 (en) * 1999-11-08 2001-03-29 Sartorius Gmbh Analytical balance for weighing electrostatically charged goods
JP4486217B2 (en) 2000-05-01 2010-06-23 浜松ホトニクス株式会社 Thickness measuring apparatus, wet etching apparatus using the same, and wet etching method
US6507474B1 (en) * 2000-06-19 2003-01-14 Advanced Micro Devices, Inc. Using localized ionizer to reduce electrostatic charge from wafer and mask
DE20104455U1 (en) * 2001-03-14 2001-05-17 Hoefliger Harro Verpackung Scale for weighing blister packs containing powder
US6759602B2 (en) * 2001-05-08 2004-07-06 Pitney Bowes Inc. Apparatus and method for weighing mailpieces in motion
US6790376B1 (en) 2001-07-23 2004-09-14 Advanced Micro Devices, Inc. Process control based upon weight or mass measurements, and systems for accomplishing same
CN1303408C (en) * 2002-07-17 2007-03-07 帝人株式会社 Method and device for weighing easily charged weighed object
US7271352B2 (en) * 2004-08-31 2007-09-18 Rabindran K George System for high-speed automatic weighing of items in a mail stream
US20060213537A1 (en) * 2005-03-23 2006-09-28 Thu Anh To Vertical wafer platform systems and methods for fast wafer cleaning and measurement
PL1813920T3 (en) * 2006-01-27 2010-05-31 Mettler Toledo Gmbh Weighing scales operating method and device
GB0719460D0 (en) * 2007-10-04 2007-11-14 Metryx Ltd Measurement apparatus and method
GB0719469D0 (en) * 2007-10-04 2007-11-14 Metryx Ltd Measurement apparatus and method
US9163979B2 (en) * 2008-11-17 2015-10-20 Taylor R Earl Method for using a ribbon scale for adjusting the amount of french fries in a bag in a restaurant
JP5198488B2 (en) * 2010-01-26 2013-05-15 株式会社エー・アンド・デイ Weighing device having windshield structure
JP5448090B2 (en) * 2010-06-17 2014-03-19 株式会社エー・アンド・デイ Weighing device with weighing chamber
DE102011000011B4 (en) * 2011-01-03 2015-10-22 Sartorius Lab Instruments Gmbh & Co. Kg Libra

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5625170A (en) * 1994-01-18 1997-04-29 Nanometrics Incorporated Precision weighing to monitor the thickness and uniformity of deposited or etched thin film
WO2002003449A2 (en) * 2000-07-05 2002-01-10 Metryx Limited Apparatus and method for investigating semiconductor wafers
US20050199078A1 (en) * 2004-02-18 2005-09-15 Infineon Technologies Ag Method and apparatus for determination of the depth of depressions which are formed in a mount substrate
GB2442857A (en) * 2006-10-11 2008-04-16 Metryx Ltd Measuring apparatus

Also Published As

Publication number Publication date
JP2010540951A (en) 2010-12-24
EP2201394B1 (en) 2013-02-13
TW200938814A (en) 2009-09-16
WO2009044113A2 (en) 2009-04-09
TWI454667B (en) 2014-10-01
US20100285614A1 (en) 2010-11-11
US9228886B2 (en) 2016-01-05
EP2201394A2 (en) 2010-06-30
GB0719460D0 (en) 2007-11-14
JP5414123B2 (en) 2014-02-12
US8357548B2 (en) 2013-01-22
US20130118816A1 (en) 2013-05-16

Similar Documents

Publication Publication Date Title
WO2009044113A3 (en) Semiconductor wafer metrology apparatus and method
WO2011135599A3 (en) Active platform for the landing of an aircraft on an access facility
TW200721517A (en) Printable semiconductor structures and related methods of making and assembling
WO2013028378A3 (en) Weighing system using a conveyor belt with load cells
WO2014051391A3 (en) Jig for supporting ship block
WO2013144126A3 (en) Method for determining a state of credibility of measurements made by sensors of an aircraft and corresponding system
WO2009086289A3 (en) Solar cell package for solar concentrator
WO2009077201A3 (en) Method and device for treating silicon wafers
WO2010144848A3 (en) Stress balance layer on semiconductor wafer backside
TW200627635A (en) Multilayered semiconductor substrate and image sensor formed thereon for improved infrared response
TW200942959A (en) Photographic apparatus
WO2011020038A3 (en) Interconnect structure with elements of varying height or different materials that allows a balanced stress to prevent thin die warpage
WO2011075714A3 (en) Glass compositions used in conductors for photovoltaic cells
WO2006112995A3 (en) Glass-based semiconductor on insulator structures and methods of making same
WO2011084531A3 (en) Mobile vacuum carriers for thin wafer processing
WO2010123967A3 (en) Glass compositions used in conductors for photovoltaic cells
WO2009046255A3 (en) Steel coil weighing apparatus and method for use thereof
EP2500930A4 (en) Etching liquid for etching silicon substrate rear surface in through silicon via process and method for manufacturing semiconductor chip having through silicon via using the etching liquid
WO2011062380A3 (en) Solar photovoltaic device
WO2007133935A3 (en) Method and materials to control doping profile in integrated circuit substrate material
WO2008067098A3 (en) Applications of polycrystalline wafers
WO2009011428A1 (en) Apparatus for attaching load port apparatus
EP2600426A3 (en) Solar cell apparatus
WO2007044467A3 (en) Integrated aircraft scale and leveling apparatus and methods for use
WO2007024714A3 (en) Process for modifying dielectric materials

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 08806442

Country of ref document: EP

Kind code of ref document: A2

WWE Wipo information: entry into national phase

Ref document number: 2010527513

Country of ref document: JP

NENP Non-entry into the national phase

Ref country code: DE

WWE Wipo information: entry into national phase

Ref document number: 2008806442

Country of ref document: EP

WWE Wipo information: entry into national phase

Ref document number: 12680755

Country of ref document: US