WO2009077177A1

WO2009077177A1 - Optoelectronic module and illumination device

Info

Publication number: WO2009077177A1
Application number: PCT/EP2008/010781
Authority: WO
Inventors: Gerhard Kuhn; Chin Khew Leong; Vincent Wu; Frank Sheng; Aileen Chen; Ken Kuo
Original assignee: Osram Opto Semiconductors Gmbh
Priority date: 2007-12-18
Filing date: 2008-12-17
Publication date: 2009-06-25
Also published as: EP2232133B1; DE102008036020A1; EP2232133A1; CN101903703A

Abstract

An optoelectronic module comprises, in particular, a connection carrier (2), an optoelectronic component (3) arranged on the connection carrier (2), a cooling element (9), on which the connection carrier (2) is arranged, a covering (6) extending over the connection carrier (2), and an electrical, in particular electronic, control element (8) for controlling the optoelectronic component (3). An illumination device comprises, in particular, a module (1) and a basic body (13), to which the module (1) is fixed.

Description

Optoelectronic module and illumination device

The invention relates to an optoelectronic module and an illumination device.

It is an object of the invention to specify an optoelectronic module which can be used in a variable manner. In particular, the intention is to specify an optoelectronic module which can be used in already existing illumination devices that do not have to be tailored to the optoelectronic module. Furthermore, it is an object of the invention to specify an illumination device comprising an optoelectronic module .

These objects are achieved by means of the subject matters of the independent patent claims. The dependent patent claims relate to advantageous configurations and developments .

Particularly advantageously, it is possible to provide a module wherein one or a multiplicity of functional units is or are already integrated in the module. This means that an illumination device no longer has to be tailored to the module to a considerable extent. Rather, an optoelectronic module can simply be incorporated into an already existing illumination device without the need for any conversion measures at the illumination device. The module can be provided for general lighting, in particular for interior or exterior lighting. By way of example, the module can be used in a street light, tunnel lighting, bus stop lighting or in an architectural illumination device, e.g. decorative lighting, building lighting or building illumination. The functional units can comprise one or a plurality of the elements mentioned below:

One or a plurality of optoelectronic components, preferably luminescence diodes, particularly preferably LED components. The respective component is particularly advantageously embodied as a surface mountable device (SMD) . The respective component is expediently designed for generating radiation, preferably for generating visible light, e.g. mixed- coloured light, in particular white light. Preferably, the respective component is embodied as a high-power component, e.g. having an electrical power consumption of 1 W or more, in particular of 2 W or more.

One or a plurality of optical elements, in particular one or a plurality of lenses and/or one or a plurality of reflectors, for beam shaping. Thereby, the respective component can already have an optical element or be equipped with such an element. Particularly advantageously, an additional optical system that would have to be disposed downstream of the module can be dispensed with. A desired emission characteristic of the module can thus be obtained solely by beam shaping at the respective optical element. Thereby, the radiation exit area of the respective lens and/or the radiation exit opening of the respective reflector can be embodied in elongate fashion, in particular with a distinguished longitudinal direction, for example in oval or rectangular fashion.

By way of example, a lens can be arranged downstream of one or a plurality of optoelectronic components in the beam path of the optoelectronic component or components. Furthermore, as an alternative or in addition to one or a plurality of lenses arranged downstream of one or a plurality of optoelectronic components, one or a plurality of optoelectronic components can be arranged in a reflector. Thereby, the reflector can be shaped in particular as a concave mirror having elliptically , parabolically and/or hyperbolicalIy shaped reflective areas at least in partial regions.

A connection carrier, preferably a circuit board, in particular a metal core circuit board such as e.g. a metal core printed circuit board (MCPCB) . The respective optoelectronic component is expediently arranged and in particular fixed on the connection carrier. Expediently, the respective component is electrically conductively connected to one or a plurality of connection conductors, e.g. conductor tracks of the connection carrier. A metal core circuit board is particularly suitable for a high- power component . Heat loss arising in the respective component can be dissipated from the component through the connection carrier.

A module carrier. Preferably, the connection carrier is arranged on the module carrier, and in particular fixed thereto. Particularly preferably, the connection carrier is electrically conductively connected to the module carrier. The respective component can be arranged on that side of the connection carrier which is remote from the module carrier. The module carrier is preferably provided for dissipating heat. Waste heat from the respective component that is conducted to the module carrier through the connection carrier can be conducted away further from the component through the module carrier. For this purpose, the module carrier preferably contains a metal, such as aluminium and/or copper, or consists thereof. Furthermore, the module carrier and the connection carrier can also be embodied as one and the same carrier. This can mean, in particular, that the connection carrier is also embodied as a module carrier, or that the module carrier is also embodied as a connection carrier. As a result, the carrier can fulfil one or a plurality of functions of the connection carrier, for example making electrical contact with the optoelectronic component or components, and one or a plurality of functions of the module carrier, for example dissipating heat away from the optoelectronic component or components. Thereby, the carrier can have one or a plurality of features from among the features described initially or hereinafter in association with the connection carrier and/or with the module carrier .

One or a plurality of fixing means. The respective fixing means is preferably designed for fixing, e.g. for screwing, the module in the illumination device. The respective fixing means can be connected to the module carrier, and in particular fixed thereto.

A cooling element. The cooling element is preferably designed for emitting heat to the surroundings of the module. The cooling element can be connected to the module carrier, and in particular fixed thereto. Expediently, the cooling element is arranged on that side of the module carrier which is remote from the connection carrier. Preferably, the cooling element has a heat-dissipating element, e.g. a heat pipe. A heat pipe can have for example a working medium present in a partly solid and partly liquid, partly solid and partly gaseous, only liquid, only gaseous, partly liquid and partly gaseous, or partly solid and partly liquid and partly gaseous state in a closed-off volume. For example in the case of a working medium present in the liquid and gaseous state, such as, for instance, water and/or alcohol, as a result of the evaporation of the working medium at a first end of the heat pipe, the heat pipe can in this case take up heat or thermal energy from the surroundings, for example waste heat originating from the optoelectronic component. This can lead to a phase transition or a phase transformation of part of the working medium, for example from liquid to gaseous. The transformed, for example evaporated, portion of the working medium can move (migrate) within the heat pipe in a volume or cavity provided therefore, for example on account of convection, to a second end of the heat pipe if the second end is at a lower temperature than the first end. At the second end, the working medium is converted into the original phase again with emission of heat to the surroundings of the heat pipe, that is to say for example condensed and returned to the liquid state. On account of a driving-back force, such as, for instance, the gravitational force and/or a capillary force or forces, for example caused by a wick or a net in the heat pipe, the liquid working medium can move back to the first end.

The heat -dissipating element can be designed for dissipating the waste heat of the respective component from the connection carrier or the module carrier. The cooling element can have, in particular in addition to the heat-dissipating element, one or a plurality of cooling parts, e.g. cooling ribs, cooling fins and/or lamellae. The cooling part is preferably designed for emitting heat to the surroundings of the module. The waste heat of the component or components, in particular proceeding from the module carrier, can be fed via the heat- dissipating element to the cooling part for emission to the surroundings. Thereby, it is then advantageously not necessary to provide an external cooling device for reliable operation of the module in the illumination device. This is particularly advantageous in the case of high-power components, which can generate a considerable amount of waste heat but indeed also a luminous flux that is advantageously high for the illumination devices.

A covering, e.g. a cap. The covering can be fixed to the module carrier and/or to the connection carrier. The covering protects the optoelectronic component or the optoelectronic components preferably against harmful external influences such as, for instance, mechanical or chemical damaging influences.

A sealing means. Said sealing means can be arranged between the covering and the module carrier. The sealing means, e.g. a sealing rubber or a sealing rubber ring, can more extensively seal an interior space formed by means of the covering. Furthermore, the sealing means can also comprise an adhesive and/or a resin, for example comprising silicone and/or epoxy. Thereby, the sealing means can run laterally around the connection carrier. In particular, the interior space can be embodied in dust- and/or spray-water-tight fashion.

And/or

- An electronic control element. The control element, which has a driver circuit, for example, is expediently designed for controlling the optoelectronic component or components. The control element can be embodied as a control chip, e.g. as an IC chip. The control element can be arranged within or outside the interior space of the covering. An arrangement within affords an advantageously high protection for the control element against damaging influences such as, for instance, dust, moisture and/or mechanical loads. An arrangement outside facilitates the accessibility to the control element. This can be advantageous particularly when the optoelectronic component or components has or have a longer lifetime than the control element, such as e.g. in the case of cooling of the components. The control element can then be replaced without opening the covering.

The functional elements described above can all be integrated in an individual module.

It is thus possible to provide a module having one or a plurality of components for thermal management, an optical system for beam shaping and/or an electronic control element for the driving or power supply of the respective components, in particular the high-power components. Thereby, in the illumination device it is also merely necessary to provide an electrical connection for the electrical supply of the module or the plurality of modules incorporated therein. However, an electrical power source is actually a routine part of a conventional illumination device.

In particular, the module can comprise a connection carrier, at least one optoelectronic component arranged on the connection carrier and embodied for example as luminescence diode, a cooling element, on which the connection carrier is arranged, a covering extending over the connection carrier, and an electrical, in particular an electronic, control element for controlling the optoelectronic component. It is thereby possible to provide a module which, in terms of its optical functionality, for example by means of a suitable choice of the emission characteristic of the optoelectronic component, in terms of its electrical and/or electronic functionality by means of the provision of the control element, and in terms of its thermal functionality by means of the provision of the cooling element, can already be adapted to the stipulations and specifications of an illumination device. By means of the covering, it is possible to achieve mechanical protection and also protection against degradation, for example due to dust or moisture, such that in combination with the functionalities mentioned above, it is possible to ensure a long lifetime and high reliability for the module and also for an illumination device comprising the module.

In particular an arrangement of the control element outside the covering can be advantageous, as mentioned above, particularly if it can be assumed that the at least one optoelectronic component has a longer lifetime than the control element. The control element can thus be replaced without opening the covering such that the at least one optoelectronic component can be protected against damaging influences by the covering without interruption also in this case.

In this case, the covering can be permanently arranged on the module carrier and/or on the connection carrier. Thereby a permanent arrangement can mean, in particular, that the covering is not provided for being opened again after the completion and mounting of the optoelectronic module. Thereby, the covering can be arranged and fixed on the module carrier and/or on the connection carrier preferably in an inseparable manner, that is to say no longer able to be released without damage for example to the covering or, if so, to the sealing means.

Furthermore, a permanent arrangement of the covering can be made possible by means of a sealing means comprising an adhesive and/or a resin, for example comprising silicone and/or epoxy.

Thereby, the control element can be electrically conductively connected to the at least one optoelectronic component. For this purpose, by way of example, the connection carrier can have conductor tracks that enable the control element to be electrically contact -connected to the at least one optoelectronic component.

It is possible to provide in particular an optoelectronic module in the form of a high-power module having an electrical power consumption of 10 W or more, preferably 15 W or more, particularly preferably of 18 W or more, which is advantageously embodied in highly integrated fashion.

It can be particularly advantageous with regard to the above embodiments if the cooling element has a heat pipe. Furthermore, it can be particularly advantageous if the cooling element has a plurality of cooling parts, in particular cooling ribs, and the heat pipe extends through the cooling parts. Thereby, the heat pipe can be connected, in particular mechanically and/or thermally, to the cooling parts. As a result, the heat pipe can be arranged and embodied in a simplified manner in such a way that it advantageously conducts the waste heat from the optoelectronic components to the cooling parts.

Furthermore, it can be advantageous if the connection carrier is arranged on a module carrier, that side of the connection carrier which is remote from the optoelectronic components preferably facing the module carrier. Thereby, the cooling element can be arranged on that side of the module carrier which is remote from the connection carrier, the cooling element preferably being thermally conductively connected to the module carrier .

In particular, a fixing means can extend away from the connection carrier or the module carrier further than the cooling element such that a fixing means on that side of the module carrier which is remote from the connection carrier projects beyond the cooling element, in particular in a direction perpendicular to the module carrier. Thereby, the fixing means, on its side remote from the connection carrier or from the module carrier, can extend parallel or substantially parallel to the connection carrier or the module carrier and in particular project laterally beyond the connection carrier or the module carrier.

An illumination device can have a basic body and preferably be free of cooling devices provided outside the module or modules. In particular, a plurality of modules can be provided, at least two of the plurality of modules being modules of identical type and/or at least two of the plurality of modules being modules of different types. The basic body can have one or a plurality of cut-outs for one or a plurality of modules, into each of which one module or a plurality of modules is or are inserted.

Furthermore, the basic body can extend between a first end side and a second end side, one or a plurality of modules being arranged between the first end side and the second end side, the basic body preferably being open at the end side such that cooling gas, e.g. air, can flow within the basic body from the first end side to the second end side. Particularly advantageously, the basic body can be embodied in a manner bent away or curved away from the module in the region of one of the first and second end sides, whereby the flow of cooling gas can be facilitated. In particular, a module can be held and arranged in the basic body in such a way that the cooling gas can flow along the cooling parts of the module. Furthermore, the basic body can be open in the region between two modules such that cooling gas can enter between two modules into the basic body.

Further features, advantages and expediencies will become apparent from the following description of the exemplary embodiments in conjunction with the figures.

Figures IA, IB and 1C show an exemplary embodiment of an optoelectronic module on the basis of various schematic views.

Figure 2 shows an exemplary embodiment of an illumination device on the basis of a plan view of the modules of the illumination device.

Figure 3 shows further exemplary embodiments for illumination devices on the basis of various schematic views in Figures 3A to 3D and in Figures 3E to 31.

Figures 4A, 4B and 4C show a schematic exploded illustration and a front and rear view of a module in accordance with a further exemplary embodiment.

Figures 5A and 5B show exemplary embodiments for the electrical connection of an illumination device in accordance with further exemplary embodiments.

Figures 6A and 6B show an excerpt from an optoelectronic module in accordance with a further exemplary embodiment on the basis of different schematic views.

Figures 7A to 7E show further exemplary embodiments for the arrangement of modules in illumination devices. Figure 8 shows in connection with Figures 8A to 8F emission characteristics for exemplary embodiments with illumination devices.

Figures 9A to 9C show an emission characteristic for a further exemplary embodiment with illumination devices.

Elements that are identical, of identical type and act identically are provided with identical reference symbols in the figures.

Figures IA, IB and 1C show an exemplary embodiment of an optoelectronic module 1 on the basis of various schematic views. Figure IA shows a schematic plan view of the module 1, Figure IB shows a schematic sectional view through the module in accordance with Figure IA, and Figure 1C shows a schematic plan view of the radiation exit area of an optical element of the module 1.

The optoelectronic module 1 has a connection carrier 2. The connection carrier 2 is embodied e.g. as a circuit board, preferably as a metal core circuit board. A plurality of optoelectronic components 3, in particular luminescence diodes, is arranged on the connection carrier. The components 3 are electrically conductively connected to connection conductors, which are conductor tracks for example, of the connection carrier 2, the connection conductors and the electrical linking not being explicitly illustrated for reasons of clarity. The components 3 are furthermore embodied as surface mountable components, in particular as LED components or luminescent diodes . The components 3 are expediently embodied as high-power components having an electrical power consumption of 1 W or more, preferably of 2 W or more. By way of example, a component of the type Golden Dragon (Manufacture: OSRAM Opto Semiconductors GmbH), is suitable therefore. The components can be designed for generating mixed-coloured and in particular white light .

A metal core circuit board is suitable as connection carrier 2 particularly for high-power components, since the considerable heat loss that arises in the components 3 can be conducted away from the components

3 through the connection carrier 2 to that side of the connection carrier 2 which is remote from the components 3, the conduction away being particularly efficient on account of the high thermal conductivity of the metal core circuit board.

Furthermore, the module 1 has a module carrier 4. The connection carrier 2 is arranged on the module carrier 4. Thereby, the components 3 are arranged on that side of the connection carrier 2 which is remote from the module carrier 4. The module carrier 4 is preferably embodied with a high thermal conductivity. For this purpose, the module carrier 4 can contain a metal, e.g.

Cu and/or Al, or consist thereof.

The connection carrier 2 is preferably thermally conductively connected to the module carrier 4. The connection carrier 2 is expediently fixed to the module carrier 4. Particularly advantageously, for this purpose a connecting layer 5 is provided between the connection carrier 2 and the module carrier 4. By means of the connecting layer 5, the connection carrier 2 can be fixed on the module carrier 4 and/or be thermally conductively connected thereto. For the mechanical and thermal connection to the connection carrier 2, for example a thermally conductive adhesive or a solder is suitable for the connecting layer 5. The waste heat can be more extensively conducted away from the components 3 by means of the module carrier 4 and also, if appropriate, by means of the thermally conductive connecting layer 5. As an alternative to the exemplary embodiment shown, the module carrier 4 and the connection carrier 2 can also be provided as a combined carrier which inherently unites the properties and features of the connection carrier 2 and of the module carrier 4. In other words, the connection carrier 2 can simultaneously also be embodied as a module carrier 4. As a result, the construction of the module 1 can be simplified further and a higher degree of integration of the components of the module 1 can be achieved.

Furthermore, the module 1 can have a covering 6. The covering 6 is expediently embodied such that it is radiation-transmissive to a radiation to be generated by the components 3. The covering 6 is preferably produced from radiation-transmissive material. The covering 6 can contain for example a glass and/or a plastic, such as, for instance, poly (methyl methacrylate) (PMMA) or a composite material, for example a composite material comprising glass and plastic films. That side of the covering 6 which is remote from the components 3 can form the radiation exit side of the module 1. The covering 6 can be connected to the module carrier 4 and in particular fixed mechanically stably thereto. By way of example, the covering 6 is screwed to the module carrier 4 (not explicitly illustrated) . The covering 6 encloses the connection carrier 2 preferably in a cup-like manner.

By means of the covering 6, a cavity - the interior space of the covering 6 - is preferably formed above the connection carrier 2 and in particular above the components 3. The covering 6 can protect those elements, which like e.g. the components 3 are arranged in the cavity, against harmful external influences, such as, for example, mechanical stress, dust and/or moisture . A sealing means 7 can be provided for more extensively sealing the interior space of the covering 6. The sealing means 7 is expediently arranged between the covering 6 and the module carrier 4. The sealing means 7 preferably runs laterally circumferentially around the connection carrier 2, and the sealing means 7 particularly preferably runs completely around the connection carrier 2. The sealing means 7 is embodied e.g. as a sealing rubber ring. By way of the sealing means 7, the cavity between the covering 6 and the module carrier 4 can be made at least spray-water- and/or dust-tight. The cavity can satisfy for instance the tightness requirements of the degree of protection class IP65 known to the person skilled in the art.

For forming electrical contact with the components 3 and in particular with the connection carrier 2, the module carrier 4 can be provided with a cut-out. A corresponding cut-out 40 is formed, preferably alongside the connection carrier 2, in the module carrier 4. Electrical contact-connection of the connection carrier 2 and in particular of the optoelectronic components 3 is thus facilitated. By way of example, an electrical supply cable can be led through the cut-out 40 (not illustrated) .

The optoelectronic module 1 furthermore has an electrical, in particular an electronic, control element 8. The control element 8 is expediently designed for electrically driving the optoelectronic components 3. Expediently, the control element 8 is electrically conductively connected to the components 3 and in particular to the connection carrier 2 (not explicitly illustrated) .

The control element 8 can be designed for supplying the components 3 with current. By way of example, the control element 8 can be embodied as a current converter which converts AC voltage of e.g. 24 V, applied externally to the module 1, into DC current, which is preferably kept constant - e.g. at 350 mA. By means of the control element 8, the module 1 can thus be adapted to the boundary conditions prescribed by an external power supply. The electronic control element 8 can be embodied for example as a control chip, in particular as an IC chip.

The control element 8 can be arranged in the covering 6. As an alternative, the control element 8 can be arranged outside the covering 6. The arrangement outside the covering 6 is indicated by dashed lines in Figures IA and IB. As already mentioned above, an arrangement within the covering 6 has an advantageously high protection for the control element 8. An arrangement outside the covering 6 simplifies access to the control element 8 from outside such that said control element can be replaced in a simplified manner, in particular without the covering 6 having to be removed.

Furthermore, the module 1 has a cooling element 9. The cooling element 9 is expediently arranged on that side of the connection carrier 2 which is remote from the components 3. The cooling element 9 can be arranged on that side of the module carrier 4 which is remote from the connection carrier 2. Furthermore, the cooling element 9 is expediently thermally conductively and/or mechanically stably connected to the module carrier 4. The cooling element 9 can for example be soldered or adhesively bonded to the module carrier 4.

Via the module carrier 4, the heat loss from the components 3 can be forwarded to the cooling element 9 for dissipation to the surroundings of the module 1. The cooling element 9 preferably has a heat-dissipating element 90. The heat-dissipating element 90 can be embodied as a heat pipe, for example. A heat pipe is particularly suitable for efficient heat transfer as described above. The heat-dissipating element 90 is preferably designed for dissipating the heat from that side of the module carrier 4 which is remote from the components 3. The heat-dissipating element 90 can extend, on the side facing the module carrier 4, firstly along the module carrier, then in a region away from the module carrier 4 and subsequently along the module carrier 4 again in particular parallel or substantially parallel to the latter. The heat- dissipating element 90 can be fixed, in particular adhesively bonded or welded, to the module carrier 4 by its side facing the module carrier 4.

In particular, the heat-dissipating element 90 can be embodied such that it is shaped like a U at least in regions or completely. Thereby, the heat-dissipating element 90 is expediently arranged in such a way that it extends perpendicular or substantially perpendicular to the module carrier 4. One limb of the U-like shaping can be connected to the module carrier 4, while the further limb can be spaced apart from the module carrier 4.

The cooling element 9 furthermore has a plurality of cooling parts 91, in particular cooling ribs or cooling fins. The cooling parts 91 preferably extend in elongate fashion, in particular perpendicular or substantially perpendicular, away from the connection carrier 2 and in particular from the module carrier 4.

The cooling parts 91 are thermally conductively and preferably also mechanically stably connected to the heat-dissipating element 90. The cooling parts 91 are preferably designed for emitting the waste heat to the surroundings of the module 1. A cooling-rib-like embodiment of the cooling parts 91 is particularly suitable for this purpose on account of the high surface area. For efficient heat transfer from the heat-dissipating element 90 to the cooling parts 91, the heat-dissipating element can be thermally conductively adhesively bonded or soldered to the cooling parts 91. The heat-dissipating element 90 can extend through the cooling parts 91. For this purpose, the cooling parts 91 are expediently provided correspondingly with a cut-out in the passage region. Particularly preferably, efficient heat transfer to the cooling parts 91 is effected in the passage region of the heat -dissipating element 90 through the cooling parts 91. The passage through the cooling parts 91 can be provided in particular on that side of the heat- dissipating element 90 which is remote from the module carrier 4.

By way of example, two separate cooling elements 9, in particular of identical type, are provided for cooling.

By means of such cooling, sufficient dissipation of heat from the optoelectronic components 3 is ensured even in the case of an embodiment of the module 1 as a high-power module having a power consumption of 10 W or more, preferably of 15 W or more, for example of 16 W or more or 18 W or more.

If a cooling element 9 is provided, then it can be particularly expedient to arrange the electronic control element 8 outside the covering 6, since, in this case, the control element 8 should be expected to have to be replaced earlier than the components 3 on account of the long lifetime of the optoelectronic components 3.

Furthermore, the module 1 has a plurality of fixing means 10. The fixing means 10 are preferably fixed to the module carrier 4 as separate fixing means. By suitable selection of fixing means 10, the module 1 can thus be optimised towards a multiplicity of illumination devices in such a way that it can be fixed to the latter in a simplified manner. Thereby, the fixing means 10 extends for example firstly laterally beyond the module carrier 4, then obliquely or perpendicular to the module carrier 4 away from the latter and, on the side remote from the module carrier 4, once again parallel or substantially parallel to the module carrier 4. The fixing means 10 extend, in particular along a direction perpendicular or substantially perpendicular to the module carrier 4, preferably further away from the module carrier 4 than the cooling element 9, such that the cooling element 9 does not impede mounting of the module 1 in an illumination device by means of that end side of the fixing means 10 which is remote from the module carrier 4.

That end side of the fixing means 10 which is remote from the module carrier 4 can therefore be provided for mounting module 1 in an illumination device.

For mounting at the illumination device, the fixing means 10 can have a mounting means 100. The mounting means 100 can be embodied as a cut-out, for example, which reaches through the fixing means 10 and is provided for example for screwing the fixing means 10 to the illumination device. The respective fixing means 10 preferably also projects laterally beyond the module carrier 4. The respective fixing means 10 can be fixed to the module carrier 4 at an end side of the carrier. Preferably, the fixing means 10 are fixed at opposite end sides of the module carrier 4. In particular, the respective fixing means 10 can be arranged closer to the edge of the module carrier 4 than the (respective) cooling element 9. Furthermore, the optoelectronic components 3 each have an optical element 30. The respective optoelectronic component 3 can already be produced with the optical element 30 or can be equipped with the optical element 30 after production but before mounting on the connection carrier 2. As an alternative, the optoelectronic components 3 can be equipped with optical elements 30 after they have been mounted on the connection carrier 2.

Figure 1C shows by way of example a plan view of the radiation exit area 31 of one of the optical elements 30 shown in a sectional illustration in Figure IB. The optical elements 30 are preferably embodied such that they are in each case of identical type. The radiation exit area 31 of the respective optical element 30 has a concavely curved partial region 310. The latter is preferably embodied such that it is located centrally in the radiation exit area 31. The concavely curved partial region 310 is surrounded by a convexly curved partial region 311. The convexly curved partial region 311 preferably runs completely around the concavely curved partial region 310. Particularly preferably, the optical axis 11 of the respective component 3 runs through the concavely curved partial region 310. In Figure 1C, the optical axis 11 is perpendicular to the plane of the illustration. Such a shaping of the optical element 30 embodied as a lens is also referred to as ARGUS particularly in rotationally symmetrical form.

The optical element 30 is preferably embodied in elongate fashion in plan view, that is to say with a distinguished longitudinal direction and, in particular, in oval fashion. By way of example, the optical element 30 is shaped elliptically in a plan view of the radiation exit area 31. Such an embodiment of the optical element 30 is suitable, in particular, for the illumination of roads, for instance for use in street lights.

The module 1, the connection carrier 2 and/or the module carrier 4 furthermore preferably has a distinguished longitudinal direction. The module 1 can be embodied in particular overall in elongate fashion. The distinguished longitudinal direction of the optical element 30, that is to say for example the longer principal axis of the elliptical radiation exit area 31 of the optical element 30, can be oriented along this longitudinal extension direction of the module 1, of the connection carrier 2 and/or of the module carrier 4. If the longitudinal direction of the optical elements 30 is oriented along a main extension direction of the object to be illuminated, e.g. a road, then particularly efficient illumination of the object, for example a road, can be obtained. At the same time, the contamination on the surroundings, e.g. residential buildings located at the road, with the radiation generated can be reduced since the optical element 30 concentrates the radiation onto the object to be illuminated. The shaping of the radiation exit area 31 with the concavely curved partial region 311 and the convexly curved partial region 310 running around the latter and with the elongate shaping of the lens is particularly suitable for this.

Figure 2 shows a plan view of an illumination device 12 with modules 1 fixed thereto, which are preferably embodied in accordance with the previous exemplary embodiment. The illumination device 12, for example a street light, has a basic body 13. The latter can be embodied in elongate fashion.

The basic body 13 furthermore preferably has cut-outs 19. In each of the cut-outs 19 a module 1, in particular exactly one module 1, is inserted. The modules 1 are inserted with their distinguished longitudinal direction running transversely with respect to the distinguished longitudinal direction of the basic body 13. The modules 1 are expediently inserted in such a way that firstly the side of the module 1 with the cooling element 9 and in particular the fixing means 10 is introduced into the cut-out 19

(not explicitly illustrated) . The module 1 can then be fixed, e.g. screwed, to the basic body 13 by the fixing means 10. The plan view illustrated can represent that side of a street light which faces the road.

By way of example, through the arrangement of one or a plurality of optoelectronic components 3 relative to one or a plurality of optical elements 30, the respective emission characteristic of the modules 1 can be adjustable and in particular adaptable in a simplified manner to specifications and stipulations imposed on an illumination device 12 such as, for instance, for street lighting or tunnel lighting. In this case, the modules 1 can be embodied in identical fashion. As an alternative to this, at least two of the modules 1 can also be embodied differently, such that the desired emission characteristic of the illumination device 12 can be achieved by the combination of a plurality of modules 1. Exemplary emission characteristics - also in conjunction with further optical elements as shown in conjunction with Figures 6A and 6B - are illustrated in Figures 8A to 9C and described in more detail further below.

Figure 3 shows a further exemplary embodiment of an illumination device 12 on the basis of various schematic views in Figures 3A to 3D. The exemplary embodiment essentially corresponds to that described in connection with Figure 2. In contrast to Figure 2, the basic body 13 has cooling gas passages 16, 17 at its end sides 14, 15. The end sides 14, 15 are preferably the end sides between which the basic body 13 extends along its distinguished longitudinal direction. The cooling gas passages 16, 17 can comprise in each case a plurality of cooling slots. Here in a final arrangement of the illumination device 12, one of the cooling gas passages is preferably arranged in a manner elevated above the other cooling gas passage. This can be achieved by the basic body 13 being embodied in a manner bent or curved from the modules 1 in the region of the first end side, the optoelectronic modules 1 particularly preferably being arranged outside the bent or curved region of the basic body 13. Cooling gas, for example ambient air, can enter into the basic body 13 via the cooling gas passage 17. The cooling gas can subsequently flow along the cooling elements 9, in particular the cooling parts 91, transport waste heat away from the modules 1 and subsequently emerge from the housing body of the basic body 13 through the cooling gas passage 16. The cooling gas flow is identified by the arrows in Figure 3.

Furthermore, a cooling gas passage 18 can be arranged between two modules 1 in each case. The cooling gas passages 18 can each have a plurality of hole-like cutouts in the basic body 13. Preferably, in each case two cooling gas passages 18 extend alongside a module 1, the module 1 particularly preferably being arranged between said cooling gas passages. The cooling gas passages 18 can extend in particular along a distinguished longitudinal direction of the module 1. Cooling gas, for example ambient air, can likewise enter into the basic body 13 through the cooling gas passages 18. Cooling of the modules 1 is thus improved and the risk of failure of the module 1 owing to overheating is thus reduced. Figure 3 furthermore shows a further exemplary- embodiment of an illumination device 12 in conjunction with Figures 3E to 31, this exemplary embodiment representing a modification of the exemplary embodiment shown in Figures 3A to 3D.

In contrast to the previous exemplary embodiment, the illumination device 12 in Figures 3E to 31 has a basic body 13 comprising a first basic body part 131 and a second basic body part 132. Thereby, the first basic body part 131 is embodied as a holding device for the second basic body part 132 and preferably serves for fixing the second basic body part 132 for example above a road or an object to be illuminated. The second basic body part 132 serves for accommodating the modules 1 in the manner already described further above analogously to the basic body 13 in accordance with the previous exemplary embodiment .

In an illumination device 12 as shown in Figures 3E to 31, with the eight modules 1 shown, for example, it was possible to achieve a luminous flux of approximately 8960 lumen with a power consumption of approximately 140 watts of the optoelectronic components 3 - embodied as LEDs - of the modules 1. By adapting the modules 1 and also the number of modules 1 in a basic body 13, these performance data are scaleable and adaptable to the requirements of an illumination device 12 for a wide variety of purposes such as, for instance, general lighting, street lighting, tunnel lighting or object lighting .

Figure 4A shows a schematic exploded illustration of an optoelectronic module 1 as was described in connection with Figures IA to 1C. Figures 4B and 4C show the optoelectronic module 1 in assembled fashion in a front view of the covering 6 and in a rear view of the cooling element 9. The description below relates equally to Figures 4A to 4C.

The module 1 has an electronic control element 6 on the connection carrier 2 on one side or on both sides of the optoelectronic components 3, said control elements not being shown for the sake of clarity. In the exemplary embodiment shown, the optoelectronic components 3 are arranged in hexagonal fashion on the connection carrier 2 such that the connection carrier 2 can be covered as densely as possible with the optoelectronic components 3.

The optoelectronic module 1 enables variable use in a wide variety of types of illumination devices. In particular, it is possible to realise high-power illumination devices, for example having a power consumption of 100 W or more, in particular 140 W or more. The power respectively desired can be scaled here by the number of modules and the number of components per module.

An optoelectronic module 1 as shown in Figure 4 was produced with the dimensions of length 200 mm, width 70 mm and height 60 mm, and also a weight of 700 grams. As optoelectronic components 16, light-emitting diodes (LEDs) with optical elements 30 as lenses as described in Figure 1 were applied on the connection carrier 2. The optoelectronic components 3 were operated with an efficiency of approximately 70 lumen per watt at a voltage of 3.2 volts with 350 milliamperes per LED, in which case a luminous flux of approximately 1120 lumen was achieved during operation of the module 1. Via the cut-out 40, an AC voltage of 24 volts was able to be applied to the electronic control element 6 (not shown) fitted in the covering 2, which then provides the operating voltage of 24 volts DC-voltage required for operation of the optoelectronic components 3 at a current of 700 milliamperes . The optoelectronic components 3 and the electronic control element 6 produced a thermal power of approximately 22 watts . Thermal measurement and also simulations on a model of a module 1 of this type show that by means of the cooling element 9 and also the above-described thermal connection of the cooling element 9 to the connection carrier 2, it was possible to achieve an operating temperature of less than 65 degrees Celsius at an ambient temperature of 30 degrees Celsius (with no wind) .

In particular, the module 1 can be used in already- existing illumination devices 12 that are not tailored especially to the module 1. Furthermore, the module 1 can be operated with solar power, if appropriate.

The module 1 proposed is suitable particularly for use in a street light, tunnel lighting, bus stop lighting or in an architectural illumination device, e.g. decorative lighting.

Figures 5A and 5B schematically show two exemplary embodiments for the electrical connection of an illumination device 12 comprising one or a plurality of modules 1.

As is shown in Figure 5A, the illumination device 12 described here can be integrated for example into an existing street lighting system. For this purpose, current with an AC voltage of 220 volts can be provided for example by means of a power station 98 and via already exiting current transport paths. By means of a transformer 97, the current provided in this way can be converted into current with an AC voltage of 24 volts, which can then be fed directly to the respective optoelectronic component by means of the electrical control element or elements integrated in one or a plurality of modules 1, as described in connection with Figures 4A to 4C.

Since, in comparison with conventional street lighting systems having fluorescent tubes or incandescent lamps, for the illumination device 12 provided here it is necessary to provide current with a significantly lower voltage, for example only 24 volts AC voltage at a current intensity of 350 milliamperes, it is possible, as shown in Figure 5B, as an alternative or in addition also to effect an electrical connection via a solar installation 95, that is to say a photovoltaic installation comprising solar cells, by means of which energy from the sun 99 can be converted into electric current. For this purpose, an inverter and battery system 96 can furthermore be provided, which, alongside the transformer 97, can adapt the electric current provided by the solar installation 95 to the requirements of the illumination device 12 and/or the modules in the illumination device 12.

Figures 6A and 6B show excerpts from a module in accordance with a further exemplary embodiment on the basis of different schematic views, in which case Figure 6A shows a three-dimensional illustration and Figure 6B shows a sectional illustration. The description below relates equally to Figures 6A and 6B.

In the exemplary embodiment shown, purely by way of example four optoelectronic components 3 each with an optical element 30 embodied as a lens are arranged on a connection carrier 2. Thereby, the optoelectronic components 3, the optical elements 30 embodied as lenses and also the connection carrier 2 can be embodied for example as described in conjunction with

Figures IA to 1C. Furthermore, a further optical element 20 is arranged and preferably fixed on the connection carrier 2. The further optical element is embodied as a reflector. Thereby, the optoelectronic components 3 and the optical elements 30 respectively disposed directly downstream thereof are arranged within the reflector 20 such that, in particular, the optical component 20 embodied as a reflector is assigned jointly to the plurality of optoelectronic components 3 shown. The reflector 20 has on the inside reflective areas or side areas 210 that preferably run obliquely with respect to the connection carrier and have in each case a parabolic curvature, for example. Furthermore, the reflector 20 has a radiation exit opening 21, which is enclosed and bordered by the reflective areas 210 and is rectangular in the exemplary embodiment shown. As an alternative to the exemplary embodiment shown, the reflector can for example also have plane, elliptical and/or hyperbolic reflective areas. Depending on the shaping of the reflective areas 210, the radiation exit opening 210 can alternatively or supplementarily have a square, circular, elliptical or oval shape or a combination thereof. The reflector 20 is embodied as a reflector pot in the exemplary embodiment shown.

In particular, the modules shown in the previous exemplary embodiments can also have one or a plurality of reflectors of this type. Here in each case individual optoelectronic components 3, groups having a plurality of optoelectronic components 3, or else all the optoelectronic components 3 arranged on the respective connection carrier 2 can be arranged in an optical element 20 embodied as a reflector and can be optically decoupled from, if appropriate, further optoelectronic components 3 on the connection carrier 2. Through a suitable choice and combination of optical elements 30 shaped as lenses and optical lenses 20 embodied as reflectors, the emission characteristic of a module can be adapted in a simplified manner individually and in a targeted manner to the requirements of the module or to the illumination device without a further additional optical system having to be disposed downstream of a module or a plurality of modules. Further degrees of freedom for setting a desired emission characteristic arise by rotation, tilting and/or displacement of optoelectronic components and/or optical elements 20 and/or 30 relative to one another.

Figures 7A to 7E show further exemplary embodiments for arrangements of modules 1 in illumination devices. Thereby, for the sake of clarity, only the modules 1 are shown, and further features of the illumination devices as described in conjunction with previous exemplary embodiments, for example, are not shown for the sake of clarity. Thereby, the arrangement possibilities shown in conjunction with Figures 7A to 7E are purely by way of example and can in particular also be combined with one another.

In the exemplary embodiment in Figure 7A the modules 1 are arranged alongside one another along a row. In the exemplary embodiment in Figure 7B, the modules 1 are arranged alongside one another in a matrix-like arrangement in rows and columns . Figure 7C shows a basic body 13 having three groups of modules 1 arranged alongside one another in each case in row form, said groups being spaced apart from one another. Here in the exemplary embodiment shown, the groups having modules 1 each have a different numbers of modules 1. Figure 7D shows a free arrangement of modules 7D. As shown in Figure 7E, the modules can be arranged not only in a common plane but also along curved, arched and/or bent areas . The free combination of modules having identical as well as different emission characteristics results in a type of modular system. This can mean that modules having different emission characteristics can be provided, such that desired emission characteristics and brightness distributions can be produced by different combinations of these different modules depending on the requirement of the illumination devices. This means that the modules as shown previously can be arranged relative to one another in a simple manner in accordance with the requirements made of the use of the illumination device with in each case identical or different emission characteristics of the modules .

Figure 8 shows, in conjunction with Figures 8A to 8F, simulations of emission characteristics of illumination devices in accordance with the previous exemplary embodiments. The different emission characteristics are made possible by means of the previously described modular system of the modules and their arrangement with respect to one another.

Figures 8A to 8F show in each case two illumination devices 12 as well as the brightness profile produced by the latter on part of a road where the illumination devices 12 are assumed to be arranged. The respective brightness profile is indicated by the brightness regions 101, 102 and 103 separated by means of the dashed lines. Thereby, the brightness region 101 corresponds to an illuminance of greater than or equal to approximately 30 lux, the brightness region 102 corresponds to an illuminance of greater than or equal to approximately 17 lux and less than approximately 30 lux, and the brightness region 103 corresponds to an illuminance of less than approximately 17 lux. Thereby, the illumination devices 12 are embodied in accordance with previously described exemplary embodiments for illumination devices and modules.

In Figure 8A, the modules of the illumination devices 12 have optoelectronic components 3 embodied in accordance with the exemplary embodiment in Figures IA to 1C with optical elements 30 embodied as oval lenses having concavely and convexly curved partial regions 310, 311.

By altering the relative arrangements of the optoelectronic components 3 and the optical elements 30, for instance by rotation and/or displacement with respect to one another, and by changing the relative dimensions of the optical elements 30 in comparison with the optoelectronic components 3, for instance by lengthening and/or widening, it is possible to reduce the brightness region 103 having an illuminance of less than approximately 17 lux between the illumination devices 12, as is shown in Figure 8B, such that more homogeneous illumination can be achieved.

A brightness profile in accordance with Figure 8C can be achieved by the additional use of a further optical element 20, which is embodied as a reflector as in Figures 6A and 6B in addition to the embodiment of the illumination devices 12 for the generation of the brightness profile in accordance with Figure 8A.

By altering the optical elements 20, 30 with regard to their dimensions and arrangements relative to the optoelectronic components 3, it is possible to achieve a further homogenization of the brightness profile as is shown in Figure 8D .

Figure 8E shows the simulation of illumination devices 12 which are embodied like the illumination devices 12 in conjunction with the brightness profile in Figure 8A. In this case, however, the emission characteristic of the modules 1 was adapted in such a way that the highest brightness can be produced between the illumination devices 12 (so-called "fill-the-gap" embodiment) .

An emission characteristic with a generated brightness profile in accordance with Figure 8F can be achieved by mixing modules 1 in the illumination devices 12 which have an emission characteristic in accordance with figure 8A and which have an emission characteristic in accordance with Figure 8E.

By virtue of the adjustability and variability of the modules 1 and of the illumination devices 12 it is possible to adapt the emission characteristic to the desired brightness profile without light and hence energy being wasted for instance as a result of shading or non-targeted emission, such that the illumination devices 12 described here can lead to a considerable saving of electrical power in comparison with conventional illumination devices.

Figures 9A to 9C show a further exemplary embodiment for illumination devices in conjunction with a simulation with regard to the brightness distribution that can be generated.

The arrangement of the illumination devices 12 along a road is shown in Figures 9A and 9B . Thereby, with regard to their dimensions, the illumination devices 12 are embodied like already known standard 250 W high- pressure sodium vapour lamps for street lighting. This means, as indicated in Figure 9A, a mounting height 110 of 8 meters, an overhang 111 of 2 meters, a cantilever angle of 15 degrees and a cantilever length 1.5 meters, resulting in a height above the road of 7.994 meters. Instead of the high-pressure sodium vapour lamps, the illumination devices of the present exemplary- embodiment have 10 modules 1 having a total electrical power consumption of the optoelectronic components 3 embodied as LEDs of 180 watts with a luminous flux of 9760 lumen.

As shown in Figure 9B, the illumination devices 12 are arranged at a distance of 30 meters from one another on one side of the road and in a manner offset with respect to the illumination devices 12 on the opposite side of the road.

Figure 9C shows the simulated brightness distribution that can be achieved as a result in the form of lines identifying a constant illuminance of 40, 30 and 20 lux. Thereby, the average illuminance that can be achieved by means of the exemplary embodiment shown is 30 lux with a maximum illuminance of 48 lux and a minimum illuminance of 14 lux. In the exemplary embodiment shown, the ratio of minimum to maximum illuminance is 0.29 with a uniformity - known to the person skilled in the art - of the illuminance of 0.47. In comparison therewith, known street lighting systems comprising high-pressure sodium vapour lamps generate a less homogenous illumination with a significantly higher maximum illuminance. Consequently, in conjunction with a lower power consumption, an improved homogeneity and illumination of the road can also be achieved with the illumination devices and modules described here, in comparison with conventional street lighting systems.

By means of the illumination devices and modules described here it is possible to considerably reduce or even completely prevent disadvantages of known illumination devices such as, for instance, glare effects, light contamination and adverse disturbance of insects that are active at night. By virtue of the selectable and adjustable emission characteristic and the associated directionality of the emitted light, for example safety in road traffic can be increased by reduction or prevention of glare effects. As a result of the better efficiency costs can be reduced and the light contamination can be reduced. The efficiency of the light sources and the lifetime thereof can be increased by means of the optical elements and optoelectronic elements integrated in the modules. The consequences of this may be an increased safety, homogeneity and efficiency and also reduced costs and maintenance intervals in comparison with conventional illumination devices. Furthermore, the illumination devices and modules described here can be dimmable and/or rapidly switchable by virtue of the integration of optoelectronic components such as LEDs, for instance, such that it is possible to realize intelligent illumination solutions in which brightness and/or colour rendering in the index can be adapted, which can in turn contribute to safety in road traffic, for example. The modular construction in the form of the modular system described above affords flexible design options and a high scalability with regard to the dimensions and dimensioning of the modules and illumination devices. By means of the radiation spectrum that can be achieved with LEDs as optoelectronic components, the appearance of the illumination devices and modules can be adjustable, which can result in a high degree of flexibility and also the abovementioned reduction of the adverse disturbance by insects that are active at night.

This patent application claims the priority of the German patent application DE 10 2008 036 020.1 and of the Chinese patent application CN 200710194365.2, the disclosure content of which is hereby incorporated by reference into the present application. The invention is not restricted by the description on the basis of the exemplary embodiments. Rather, the invention encompasses any new feature and also any combination of features, which in particular comprises any combination of features in the patent claims, even if this feature or this combination itself is not explicitly specified in the patent claims or exemplary embodiments .

Claims

Patent Claims

1. Optoelectronic module comprising: - a connection carrier (2), an optoelectronic component (3) arranged on the connection carrier (2) , a cooling element (9) , on which the connection carrier (2) is arranged, - a covering (6) extending over the connection carrier (2) , and an electrical, in particular electronic, control element (8) for controlling the optoelectronic component (3) .

2. Module according to Claim 1, wherein the cooling element (9) has a heat-dissipating element (90), in particular a heat pipe, and/or a plurality of cooling parts (31) , in particular cooling ribs.

3. Module according to any of the preceding claims, wherein the connection carrier (2) is embodied as a circuit board, in particular as a metal core circuit board.

4. Module according to any of the preceding claims, wherein - the connection carrier (2) is arranged on a module carrier (4) , that side of the connection carrier (2) which is remote from the optoelectronic components (3) facing the module carrier (4) .

5. Module according to Claim 4, wherein the cooling element (9) is arranged on that side of the module carrier (4) which is remote from the connection carrier (2) , and is thermally conductively connected to the module carrier (4) .

6. Module according to Claim 4 or 5 , wherein - the covering (6) is connected to the module carrier.

7. Module according to any of Claims 4 to 6, wherein a sealing means (7) , in particular a sealing rubber ring, is arranged between the module carrier (4) and the covering (6) .

8. Module according to any of the preceding claims, which has one or a plurality of fixing means (10) designed for fixing the module (1) to an illumination device (12) .

9. Module according to any of the preceding claims, wherein - the optoelectronic component (3) has one or a plurality of optical elements (2) , selected from a lens having a radiation exit area and a reflector having a radiation exit opening.

10. Module according to any of Claims 1 to 9, wherein the control element (8) is arranged within the covering (6) .

11. Module according to any of Claims 1 to 9, wherein - the control element (8) is arranged outside the covering (6) .

12. Illumination device, comprising a module (1) according to any of Claims 1 to 11, and a basic body (13) , to which the module (1) is fixed.

13. Illumination device according to Claim 12, wherein a plurality of modules (1) are provided, at least two of the plurality of modules (1) being of identical type and/or at least two of the plurality of modules (1) being of different types.

14. Illumination device according to Claim 12 or 13, wherein the basic body (13) extends between a first end side and a second end side (14, 15) , the

(respective) module (1) being arranged between the first and the second end side (14, 15) , and the basic body (13) is open at the end side, such that cooling gas, e.g. air, can flow within the basic body (13) from the first to the second end side

(14, 15) .

15. Illumination device according to any of Claims 12 to 14, wherein - the basic body (13) is open in the region between two modules (1) such that cooling gas can enter between two modules (1) into the basic body (13) .