WO2009088882A3 - Edge-contacted vertical carbon nanotube transistor - Google Patents
Edge-contacted vertical carbon nanotube transistor Download PDFInfo
- Publication number
- WO2009088882A3 WO2009088882A3 PCT/US2008/088572 US2008088572W WO2009088882A3 WO 2009088882 A3 WO2009088882 A3 WO 2009088882A3 US 2008088572 W US2008088572 W US 2008088572W WO 2009088882 A3 WO2009088882 A3 WO 2009088882A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- edge
- carbon nanotube
- nanotube transistor
- vertical carbon
- contacted vertical
- Prior art date
Links
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 title abstract 3
- 239000002041 carbon nanotube Substances 0.000 title abstract 3
- 229910021393 carbon nanotube Inorganic materials 0.000 title abstract 3
- 230000005669 field effect Effects 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
- H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body
- H01L27/10—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body including a plurality of individual components in a repetitive configuration
- H01L27/101—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body including a plurality of individual components in a repetitive configuration including resistors or capacitors only
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
- H01L29/0657—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by the shape of the body
- H01L29/0665—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by the shape of the body the shape of the body defining a nanostructure
- H01L29/0669—Nanowires or nanotubes
- H01L29/0676—Nanowires or nanotubes oriented perpendicular or at an angle to a substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/66007—Multistep manufacturing processes
- H01L29/66075—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
- H01L29/66227—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
- H01L29/66409—Unipolar field-effect transistors
- H01L29/66439—Unipolar field-effect transistors with a one- or zero-dimensional channel, e.g. quantum wire FET, in-plane gate transistor [IPG], single electron transistor [SET], striped channel transistor, Coulomb blockade transistor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/775—Field effect transistors with one dimensional charge carrier gas channel, e.g. quantum wire FET
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K10/00—Organic devices specially adapted for rectifying, amplifying, oscillating or switching; Organic capacitors or resistors having a potential-jump barrier or a surface barrier
- H10K10/40—Organic transistors
- H10K10/46—Field-effect transistors, e.g. organic thin-film transistors [OTFT]
- H10K10/462—Insulated gate field-effect transistors [IGFETs]
- H10K10/491—Vertical transistors, e.g. vertical carbon nanotube field effect transistors [CNT-FETs]
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K85/00—Organic materials used in the body or electrodes of devices covered by this subclass
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K85/00—Organic materials used in the body or electrodes of devices covered by this subclass
- H10K85/20—Carbon compounds, e.g. carbon nanotubes or fullerenes
- H10K85/221—Carbon nanotubes
Abstract
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2010540944A JP2011522394A (en) | 2007-12-31 | 2008-12-30 | End contact type vertical carbon nanotube transistor |
EP08869424A EP2238611A2 (en) | 2007-12-31 | 2008-12-30 | Edge-contacted vertical carbon nanotube transistor |
CN200880123544XA CN101933125A (en) | 2007-12-31 | 2008-12-30 | Edge-contacted vertical carbon nanotube transistor |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US1842607P | 2007-12-31 | 2007-12-31 | |
US61/018,426 | 2007-12-31 |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2009088882A2 WO2009088882A2 (en) | 2009-07-16 |
WO2009088882A3 true WO2009088882A3 (en) | 2009-09-24 |
Family
ID=40797039
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US2008/088572 WO2009088882A2 (en) | 2007-12-31 | 2008-12-30 | Edge-contacted vertical carbon nanotube transistor |
Country Status (6)
Country | Link |
---|---|
US (2) | US7960713B2 (en) |
EP (1) | EP2238611A2 (en) |
JP (1) | JP2011522394A (en) |
KR (1) | KR20100110853A (en) |
CN (1) | CN101933125A (en) |
WO (1) | WO2009088882A2 (en) |
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US20110056812A1 (en) * | 2009-09-08 | 2011-03-10 | Kaul Anupama B | Nano-electro-mechanical switches using three-dimensional sidewall-conductive carbon nanofibers and method for making the same |
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WO2014100723A1 (en) * | 2012-12-21 | 2014-06-26 | The Regents Of The University Of California | Vertically stacked heterostructures including graphene |
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US9318718B2 (en) * | 2014-05-13 | 2016-04-19 | King Abdullah University Of Science And Technology | Methods and devices for silicon integrated vertically aligned field effect transistors |
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US20070012961A1 (en) * | 2004-10-02 | 2007-01-18 | Samsung Electronics Co., Ltd. | N-type carbon nanotube field effect transistor and method of fabricating the same |
US20070048908A1 (en) * | 2005-05-16 | 2007-03-01 | Joerg Appenzeller | Method and apparatus for fabricating a carbon nanotube transistor |
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2008
- 2008-12-30 JP JP2010540944A patent/JP2011522394A/en not_active Withdrawn
- 2008-12-30 EP EP08869424A patent/EP2238611A2/en not_active Withdrawn
- 2008-12-30 KR KR1020107017203A patent/KR20100110853A/en not_active Application Discontinuation
- 2008-12-30 CN CN200880123544XA patent/CN101933125A/en active Pending
- 2008-12-30 US US12/346,513 patent/US7960713B2/en not_active Expired - Fee Related
- 2008-12-30 WO PCT/US2008/088572 patent/WO2009088882A2/en active Application Filing
-
2011
- 2011-06-03 US US13/153,277 patent/US20120138902A1/en not_active Abandoned
Patent Citations (3)
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US20050059176A1 (en) * | 2003-04-22 | 2005-03-17 | Nantero, Inc. | Process for making byte erasable devices having elements made with nanotubes |
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Also Published As
Publication number | Publication date |
---|---|
US20090166686A1 (en) | 2009-07-02 |
KR20100110853A (en) | 2010-10-13 |
WO2009088882A2 (en) | 2009-07-16 |
JP2011522394A (en) | 2011-07-28 |
CN101933125A (en) | 2010-12-29 |
EP2238611A2 (en) | 2010-10-13 |
US7960713B2 (en) | 2011-06-14 |
US20120138902A1 (en) | 2012-06-07 |
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