WO2009105373A3 - Microelectromechanical device with thermal expansion balancing layer or stiffening layer - Google Patents

Microelectromechanical device with thermal expansion balancing layer or stiffening layer Download PDF

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Publication number
WO2009105373A3
WO2009105373A3 PCT/US2009/033818 US2009033818W WO2009105373A3 WO 2009105373 A3 WO2009105373 A3 WO 2009105373A3 US 2009033818 W US2009033818 W US 2009033818W WO 2009105373 A3 WO2009105373 A3 WO 2009105373A3
Authority
WO
WIPO (PCT)
Prior art keywords
layer
movable reflector
movable
thermal expansion
stiffening
Prior art date
Application number
PCT/US2009/033818
Other languages
French (fr)
Other versions
WO2009105373A2 (en
Inventor
Sauri Gudlavalleti
Clarence Chui
Original Assignee
Qualcomm Mems Technologies, Inc.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Qualcomm Mems Technologies, Inc. filed Critical Qualcomm Mems Technologies, Inc.
Priority to EP09711748A priority Critical patent/EP2254826A2/en
Priority to JP2010547692A priority patent/JP5366981B2/en
Priority to CN2009801059480A priority patent/CN101952194B/en
Publication of WO2009105373A2 publication Critical patent/WO2009105373A2/en
Publication of WO2009105373A3 publication Critical patent/WO2009105373A3/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B3/00—Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
    • B81B3/0064—Constitution or structural means for improving or controlling the physical properties of a device
    • B81B3/0067—Mechanical properties
    • B81B3/0072—For controlling internal stress or strain in moving or flexible elements, e.g. stress compensating layers
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B26/00—Optical devices or arrangements for the control of light using movable or deformable optical elements
    • G02B26/001—Optical devices or arrangements for the control of light using movable or deformable optical elements based on interference in an adjustable optical cavity
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2201/00—Specific applications of microelectromechanical systems
    • B81B2201/04—Optical MEMS
    • B81B2201/042—Micromirrors, not used as optical switches
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making

Abstract

An interferometric modulating device is provided with a thermal expansion balancing layer on a side of the movable flexible layer opposite the movable reflector such that when temperature changes the distance between the movable reflector and the optical stack does not change significantly, thereby leading to stable color. Additionally, an interferometric modulating device is provided with a stiffening layer between the movable flexible layer and the movable reflector and at least one hollow void exists on the surface where the movable reflector and the stiffening layer contact each other so that the movable reflector is more rigid to bending, thereby reducing the temperature sensitivity of the movable reflector.
PCT/US2009/033818 2008-02-22 2009-02-11 Microelectromechanical device with thermal expansion balancing layer or stiffening layer WO2009105373A2 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
EP09711748A EP2254826A2 (en) 2008-02-22 2009-02-11 Microelectromechanical device with thermal expansion balancing layer or stiffening layer
JP2010547692A JP5366981B2 (en) 2008-02-22 2009-02-11 Micro-electromechanical device with thermal expansion balance layer or reinforcing layer
CN2009801059480A CN101952194B (en) 2008-02-22 2009-02-11 Microelectromechanical device with thermal expansion balancing layer or stiffening layer

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US12/072,090 2008-02-22
US12/072,090 US8164821B2 (en) 2008-02-22 2008-02-22 Microelectromechanical device with thermal expansion balancing layer or stiffening layer

Publications (2)

Publication Number Publication Date
WO2009105373A2 WO2009105373A2 (en) 2009-08-27
WO2009105373A3 true WO2009105373A3 (en) 2010-01-28

Family

ID=40986135

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2009/033818 WO2009105373A2 (en) 2008-02-22 2009-02-11 Microelectromechanical device with thermal expansion balancing layer or stiffening layer

Country Status (7)

Country Link
US (2) US8164821B2 (en)
EP (1) EP2254826A2 (en)
JP (1) JP5366981B2 (en)
KR (1) KR20100121676A (en)
CN (2) CN101952194B (en)
TW (1) TWI462868B (en)
WO (1) WO2009105373A2 (en)

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CN104777558A (en) * 2015-04-09 2015-07-15 上海新微技术研发中心有限公司 Thermal single-wavelength optical switch and manufacturing method thereof
CN104698584B (en) * 2015-03-30 2017-05-03 上海新微技术研发中心有限公司 Double-beam type thermally-driven tunable filter and manufacturing method thereof

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US7855826B2 (en) * 2008-08-12 2010-12-21 Qualcomm Mems Technologies, Inc. Method and apparatus to reduce or eliminate stiction and image retention in interferometric modulator devices
US8358266B2 (en) 2008-09-02 2013-01-22 Qualcomm Mems Technologies, Inc. Light turning device with prismatic light turning features
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US8547626B2 (en) 2010-03-25 2013-10-01 Qualcomm Mems Technologies, Inc. Mechanical layer and methods of shaping the same
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