WO2009150590A1

WO2009150590A1 - Press springs

Info

Publication number: WO2009150590A1
Application number: PCT/IB2009/052385
Authority: WO
Inventors: Kwok W. Mok
Original assignee: Koninklijke Philips Electronics N.V.
Priority date: 2008-06-11
Filing date: 2009-06-05
Publication date: 2009-12-17
Also published as: TW201009243A

Abstract

This invention relates to an assembly structure (100, 200) comprising a light emitting diode module (105), a lamp fixture (130, 230), and a spring device (110, 210). The spring device comprises a main body (111, 211), a first holding member (120) arranged on a first side of the main body for holding the light emitting diode module, a second holding member (140, 260) for engaging the spring device with the lamp fixture, a first resilient element (120,125, 214, 215 ) for reacting between the first holding member and the light emitting diode module, and a second resilient element (150, 215, 216) for reacting between the second holding member and a receiving portion arranged (136, 236) on the lamp fixture. The first resilient element is arranged to release the first holding member when actuated, and the second resilient element is arranged to release the second holding member when actuated.

Description

Press springs

FIELD OF THE INVENTION

The present invention relates to light emitting diode assembly structures, and more particularly to an assembly structure comprising a light emitting diode module, a lamp fixture, and a spring device. Furthermore a method for mounting a light emitting diode module on a lamp fixture with a spring device is presented.

BACKGROUND OF THE INVENTION

Light emitting diodes (LEDs) are extensively utilized in light sources today. In practice the LEDs are typically arranged in LED modules that comprise a plurality of LEDs which are arranged on a base board and which are electrically interconnected on the base board.

US 6,582,100 Bl discloses an electrically driven LED module and a method of mounting the same. The LED module comprises an electrically and thermally conductive heat dissipater made from e.g. aluminium, and which is arranged under an electrically insulating layer with circuit traces disposed over the insulating layer, onto which one or more LEDs are arranged such that electrical contact is achieved with the circuit traces for powering the LED. Each LED is kept in place on the circuit traces with an independent and generally U-shaped holding device comprising legs, which comprises a tensioning portion for engaging the LED into thermal engagement with the heat dissipater. The tensioning portion may comprise barbs on the legs and/or undulations in the legs. The legs are arranged to engage in a through hole of the heat dissipater and the insulating layer, or to grip into an opening in the heat dissipater and the insulating layer. Pre-assembling of the LED and the U-shaped holding device is possible due to a retaining portion, which is arranged by the undulations and/or tangs on each leg. No soldering of the LED is required. To obtain a desired lamp application, the prior art LED module as described above will furthermore have to be assembled together with a lamp fixture.

A prior art assembly structure for a LED lamp application is disclosed in US 7,325,949 Bl. The assembly structure comprises a LED lamp and heat dissipating module. The LED lamp includes a casing and a LED module. The LED module is positioned in a containing hole in the casing, and is further arranged between the casing and the heat dissipating module. The casing is arranged with latch portions such that as the heat dissipating module is pressed against the casing, having the LED module placed in between the heat dissipating module and the casing, it is locked in a mounted position. To demount the assembly structure the latch portions will have to be removed.

The assembly structure is further arranged to have a plurality of elastic bodies which are arranged at the containing hole in the casing and which are further arranged to press the LED module towards the heat dissipating module in the mounted position. This prior art assembly structure thus contains a plurality of small parts, i.e. the elastic bodies, which are to be delicately positioned in holes corresponding to each elastic body, which holes are arranged in the casing for the purpose of holding the elastic bodies.

When utilizing LED modules in lamp applications it is of great interest to assemble the LED-modules and the lamp fixture in a quick and secure manner. For the purpose of maintenance and repair, it is also desirable to achieve an assembly structure that is also easily demounted, preferably without having to use a tool.

SUMMARY OF THE INVENTION

It is an object of the present invention to provide an assembly structure comprising a light emitting diode module and a method for mounting a light emitting diode module on a lamp fixture, which alleviate at least one of the above-mentioned drawbacks of the prior art.

This object is achieved by an assembly structure and method according to the invention as defined in claims 1 and 9.

Thus, in accordance with a first aspect of the invention, there is provided an assembly structure comprising a light emitting diode (LED) module, a lamp fixture and a spring device. The spring device comprises a main body, a first holding member arranged on a first side of the main body for holding the light emitting diode module, a second holding member for engaging the spring device with the lamp fixture, a first resilient element for reacting between the first holding member and the light emitting diode module, and a second resilient element for reacting between the second holding member and a receiving portion arranged on the lamp fixture. The first resilient element is arranged to release the first holding member when actuated, and the second resilient element is arranged to release the second holding member when actuated. Thus, there is provided an assembly structure comprising a spring device for mounting a light emitting diode module on a lamp fixture, which assembly structure is mechanically simple and reliable. The spring device is arranged for holding the light emitting diode module in a first holding member and is further arranged with a second holding member for engaging the spring device with the lamp fixture. The first holding member and the second holding member are provided with a first resilient element and a second resilient element that are reacting with the light emitting diode module and receiving portions of the lamp fixture, respectively. This way the light emitting diode module is kept engaged with the spring device when mounted, and the spring device is kept engaged with the lamp fixture when mounted. The first resilient element and the second resilient element are further arranged to release the first holding member and the second holding member, respectively, when actuated. Thus, in an easy approach the spring device provides both mounting and dismounting of the light emitting diode module to a lamp fixture without having to apply a tool. This is advantageous when utilizing the LED module in for instance a lamp product. The inventive concept provides an easy assembly and disassembly process for manufacturing and maintenance. If needed the LED module is conveniently replaced in a single operation. Furthermore, the spring device can advantageously be manufactured in one piece and at low cost, which keeps the complete lamp product cost at the lowest level.

In accordance with an embodiment of the assembly structure, the first resilient element and the second resilient element of the spring device are interconnected such that an external force actuates the first resilient element and the second resilient element simultaneously. The LED module is thus easily mounted or dismounted with a one-step- operation.

In accordance with an embodiment of the assembly structure, at least a portion of the main body of the spring device is arranged to be thermally engaged with the lamp fixture, which is advantageous as LED modules generate a large amount of heat during operation. The LED module is in the inventive concept thermally engaged with the spring device, which in turn is thermally engaged with the lamp fixture. The lamp fixture thus acts as a heat sink for the LED-module. In accordance with an embodiment of the assembly structure, the main body of the spring device is further arranged to receive an external heat sink, which is advantageous for high-power applications.

In accordance with an embodiment of the assembly structure, an end portion of the main body of the spring device is arranged to be pivotally arranged to the lamp fixture. The spring device may then advantageously be arranged to be pivotally arranged to the lamp fixture such that mounting and dismounting of the LED module may be done when the spring device is tiled upwards. The spring device may be permanently pivotally arranged to the lamp fixture, in which case the user does not have to be concerned with keeping track of the spring device, if opened during maintenance of the lamp.

In accordance with an embodiment of the assembly structure, the main body of the spring device comprises cooling fins, which provides an extra heat sink for the LED module.

In accordance with an embodiment of the assembly structure, the main body further comprises a light aperture for passing light emitted from the light emitting diode module.

In accordance with an embodiment of the assembly structure, the lamp fixture or spring device is arranged with at least one third resilient element for thermally engaging the spring device and the lamp fixture. The at least one third resilient element provides a counter force reacting and reinsuring a strong thermal contact between the spring device and the lamp fixture. Furthermore, the mechanical locking of the spring device and the lamp fixture becomes extremely stable with this arrangement.

In accordance with a second aspect of the invention, there is provided a method for mounting a light emitting diode module on a lamp fixture comprising: - providing a spring device comprising: a main body, a first holding member arranged on a first side of the main body for holding the light emitting diode module, a second holding member for engaging the spring device with the lamp fixture, a first resilient element for reacting between the first holding member and the light emitting diode module, and a second resilient element for reacting between the second holding member and receiving portions arranged on the lamp fixture. The first resilient element is arranged to release the first holding member when actuated, and the second resilient element is arranged to release the second holding member when actuated, releasing the first holding member by applying a first external force for actuating the first resilient element, - positioning the light emitting diode module in the first holding member, locking the light emitting diode module in the first holding member by removing the first external force, releasing the second holding member by applying a second external force for actuating the second resilient element, positioning the second holding member in a first receiving portion arranged on the lamp fixture, locking the second holding member in the first receiving portion by removing the second external force. The method provides for a convenient mounting, and dismounting when performed in reverse, of a LED module on a lamp fixture. Furthermore, the method is quick and does not require any additional tools. The essential functionality of the mounting and dismounting process is the one press for mounting of the LED module and one press for the dismounting of the LED module. In accordance with an embodiment of the method, the first resilient element and the second resilient element are interconnected. The step of releasing the first holding member and the step of releasing the second holding member is done simultaneously by applying a common external force for actuating the first resilient element and the second resilient element. In accordance with an embodiment of the method, the step of providing a spring device further comprises: arranging the main body of the spring device with at least one portion for thermally engaging with the lamp fixture. Thus, the method further provides a reliable thermal contact between the LED module and the lamp fixture (via the spring device). The lamp fixture then acts as a heat sink for the LED-module. In accordance with an embodiment of the method, the step of providing a spring device further comprises: mounting an external heat sink on a second side of the main body, such that holding protrusions arranged on the external heat sink protrudes through holes arranged in the main body. The holding protrusions form the first holding member. In accordance with an embodiment of the method, the step of providing a spring device further comprises arranging an end portion of the main body to be pivotal. The method further comprises, after the step of locking the light emitting diode module in the first holding member, arranging the pivotal end portion of the main body into a second receiving portion arranged on the lamp fixture.

In accordance with an embodiment of the method, the lamp fixture is arranged with at least one third resilient element for receiving the at least one portion of the main body, which provides an extra force to press the portion of the main body, which is arranged to provide a thermal interface between the spring device and the lamp fixture, towards the lamp fixture. These and other aspects, features, and advantages of the invention will be apparent from and elucidated with reference to the embodiments described hereinafter.

BRIEF DESCRIPTION OF THE DRAWINGS The invention will now be described in more detail and with reference to the appended drawings in which:

Fig. 1 a) is a perspective view of an embodiment of an assembly structure according to the invention before mounting, and b) is a perspective bottom view of an embodiment of the assembly structure according to the invention after mounting, Fig. 2 is a perspective view of an embodiment of an assembly structure according to the invention,

Fig. 3 illustrates the principles of an embodiment of a method for mounting a LED module on an external body according to the invention,

Fig. 4 a) and b) are cross sectional side views of an embodiment of an assembly structure according to the invention,

Fig. 5 is a perspective view of a spring device of an embodiment of an assembly structure according to the invention,

Fig. 6 is a perspective view of a spring device of an embodiment of an assembly structure according to the invention.

DESCRIPTION OF PREFERRED EMBODIMENTS

Fig. 1 a) is a perspective view of an embodiment of an assembly structure according to the present invention. For clarity the assembly structure 100 is here shown before mounting. The assembly structure 100 comprises a spring device 110, a LED module 105 and a lamp fixture 130. The lamp fixture 130 is here provided with a light aperture 135 and a receiving portion 136 for mounting the spring device 110, which in addition holds the LED module 105, onto. The light aperture 135 may be provided with a protection glass or a lens (not shown).

The spring device 110 comprises a main body 111. Here the main body 111 is circular to match the shape of the light aperture 135 and the receiving portion 136 of the lamp fixture 130. The main body 111 is provided with a first holding member 120, which in this exemplifying embodiment comprises four first holding elements, see Fig. 1 b), arranged on a bottom side of the spring device 110. The first holding member 120 is arranged to hold the LED module 105 in a mounted position. Each one of the first holding elements of the first holding member 120 is engaged with a first resilient element 125 which is arranged for forcing the first holding member 120 into a locking position, such that a reacting force is provided between the first holding member 120 and the LED module 105, when the LED module 105 is mounted in the first holding member 120.

The mounting of the LED module 105 is done by pressing on the first resilient element 125 to release and open up the first holding elements, such that the LED module 105 is allowed to be positioned in the first holding member 120.

Subsequently, the first holding member 120 is locked by releasing the pressing force on the first resilient element 125, whereupon the first holding elements of the first holding member 120 are closed again.

Alternatively, the first resilient element 125 is arranged such that it has two different locked positions. A first static position in which the first holding member 120 is locked, and a second static position in which the first holding member 120 is released. The second static position is reached by pressing on the first resilient element 125 downwards. To re-enter the first static position from the second static position, the first resilient member must then be pressed in the opposite direction, whereby the first holding member 120 is locked again.

The spring device 110 is further arranged to be mounted onto the lamp fixture 130. A second holding member 140 for engaging the spring device 110 with the lamp fixture is arranged on the main body 111. In this exemplifying embodiment the second holding member 140 comprises four second holding elements, positioned peripherally and protruding from the main body 111. The second holding elements of the second holding member 140 are further positioned so as to match the positioning of corresponding first receiving portion elements of the receiving portion 136, which are arranged in the lamp fixture 130.

A second resilient element 150, which here is realized with second resilient elements associated with each second holding element (as exemplified by the second resilient element 150 for the second holding element of the second holding member 140 in Fig. 1 a)), is arranged for reacting between the second holding member elements of the second holding member 140 and the respective first receiving portions elements 136.

Furthermore, when actuating the second resilient element 150 by applying a force towards the centre of the spring device, the second holding member 140 is released from a mounted position. That is, when for instance the second holding element 140 is arranged in the first receiving portion element 136, the second resilient element 150 provides a force reacting between the second holding element 140 and the lamp fixture 130, keeping the spring device 110 engaged with the lamp fixture 130. To release the second holding element 140 the resilient element 150 is pressed in towards the centre of the spring device 110, whereupon the spring device 110 can be released from the lamp fixture 130 and thus demounted (under premises that all second holding elements are released). This is typically done in a convenient one-step operation.

Preferably, the spring device 110 is formed from a material with high thermal conductivity, e.g. a metal. The LED module 105 is mounted in the spring device 110, and will dissipate heat to the spring device 110 when electrically driven. In the current embodiment the main body 111 of the spring device 110 is formed so as to match the first receiving portion 136 of the lamp fixture 130. In addition to providing a good mechanical stability of the mounting of the spring device 110 to the lamp fixture 130, the matching of the interface surfaces of the spring device 110 and the lamp fixture 130 provides for a good thermal connection between the spring device 110 and the first receiving portion 136 (and between other interfacing surfaces that are arranged between the spring device 110 and the lamp fixture 130). Thus, heat that is produced by the LED module is at least partly dissipated via the spring device 110 and the lamp fixture 130.

In an embodiment of the assembly structure 200 according to the invention, as illustrated in Fig. 2, the spring device 210 is arranged having a substantially rectangular main body 211 which has a centre portion 214 and which is further arranged with upturned flanged end portions 212, 213. The spring device 210 is when mounted onto the lamp fixture 230 arranged with the bottom side of the centre portion 214 oriented towards the lamp fixture 230. A second holding member comprising two upturned side plates, 215 and 216, are arranged on the outer edges of the centre portion 214, and are furthermore in this exemplifying embodiment substantially perpendicular to the centre portion 214. Each of the upturned side plates 215, 216 is arranged with a protruding holding element, 217 and 218, respectively. The protruding holding elements 217, 218 are arranged on the outer side of the respective upturned side plates 215, 216. The upturned side plates 215, 216 are resiliently arranged and may be tilted by applying an external force. A first holding member 120 is arranged on the bottom side of the centre portion 214 of the spring device 210. The first holding member 120 comprises at least two first holding member elements, each arranged at a respective outer edge of the centre portion 214. The first holding member 120 is arranged for holding the LED module 105. In this exemplifying embodiment the first holding member elements are resilient and the LED module is mounted by the LED module 105 in place. In another embodiment the first holding member elements are not resilient themselves, but are arranged to open up as the upturned side plates 215, 216 are pressed together and affect the holding elements such that they are opened up and thus able to receive the LED module 105. Dismounting of the LED module 105 is easily done by the same procedure.

The lamp fixture 230 is arranged with an aperture 135, which in this embodiment has a substantially rectangular shape, wherein the aperture 135 matches the central portion 214 of the spring device 210. Furthermore, the first receiving portion 236 is arranged at the aperture. The first receiving portion 236 comprises two upturned receiving plates, 237 and 238, which are arranged on a respective opposite side of the aperture 135 and on an upper side of the lamp fixture 230. The upturned receiving plates, 237 and 238, are substantially perpendicular to the lamp fixture 230. Two receiving holes, 239 and 240, are arranged in the upturned receiving plates 237, 238.

The first receiving portion 236 is further arranged to have two downturned flanged subportions, 241 and 242, which are arranged at a respective opposite side of the aperture 135, which sides of the aperture 135 are located perpendicular to the receiving plates 237, 238. The downturned flanged subportions 241, 242 are furthermore arranged to receive the upturned flanged end portions 212, 213 as the spring device 210 is mounted onto the lamp fixture 230. The upturned flanged end portions 212, 213 of the spring device 210 are upturned an angle which at least substantially matches the angle of the corresponding downturned flanged subportions 241, 242. Thus, different values of the angles may be chosen in different embodiments, as long as the spring device 210 substantially matches the receiving portion 236 of the lamp fixture 230.

When mounting the spring device 210 onto the lamp fixture 230, the central portion 214 of the spring device 210 is fitted into the first receiving portion 236 such that the side plates 215, 216 of the spring device 210 are lowered into position in parallel with the receiving plates 237, 238, and the holding elements 217, 218 are received in the receiving holes 239, 240 of the receiving plates 237, 238. The side plates 215, 216 provide second resilient elements for reacting between the holding elements 217, 218 and the receiving plates 237, 238. The spring device 210 is then locked to the lamp fixture 230. To dismount the spring device 210, the side plates 215, 216 are pressed against each other and the holding elements 217, 218 are then released. In the locked position the two downturned flanged subportions 241, 242 and the upward flanged side portions 212, 213 are pressed together and produce double spring forces against each other.

Fig. 3 illustrates the mounting of the exemplifying embodiment of the assembly structure according to the invention. Fig. 3 a) illustrates a cross sectional side view of the present embodiment before mounting. Further in Fig. 3 b) the mounting process is started by placing the spring device 210 in position in the receiving portion 236. The spring device 210 makes contact with the lamp fixture 230 in touch points TPl, TP2 at the outer edges of the upturned flanged side portions 212,213. In Fig. 3 c) the spring device 210 is then pressed down into the receiving portion 236 such that protruding holding elements 217,218 of the upturned side plates 215,216 are pushed into position in the receiving holes 239, 240 of the upturned receiving plates 237, 238. The spring device 210 is now pressed into a position where touch points TP3 and TP4, as illustrated in Fig. 3 c), are achieved at the bending of the upturned flanged side portions 212, 213 of the spring device 210 and the outer edge of the downturned flanged subportions 241, 242 of the receiving portion 236. Thus, in the mounted position spring forces SFl from the spring device 210 and an opposite spring force SF2 caused by the receiving portion 236 causes the interface surfaces of the spring device 210 and the lamp fixture 230 to be squeezed together, and thus ensures for good thermal contact. In an embodiment of the assembly structure 400 according to the present invention, as illustrated in Fig. 4, there is provided a spring device 410 which has a main body 411 having a first end portion 412 which is arranged to be pivotally connected to a lamp fixture 430. The main body 411 is in this exemplifying embodiment arranged as a resilient plate of rectangular shape, and which is further provided with a small curve surface. On a bottom side of the main body 411, a first holding member 120, as described above, is arranged for holding the LED-module 105.

A second holding member 450 is arranged at an opposite second end portion of the main body 411. The second holding member 450 is a substantially U-shaped resilient element 450 arranged to protrude from the bottom side of the spring device, and comprises an operation member 441 and a locking member 442. Furthermore, the assembly structure 400 comprises a lamp fixture 430 which is arranged with first receiving portion 436. The first receiving portion 436 is in this embodiment arranged as a through hole of the lamp fixture 430. A second receiving portion 437 for mounting the pivotal end portion 412 of the main body 411 of the spring device 410 is arranged in the lamp fixture 430. The second receiving portion 437 is here a through hole in the lamp fixture 430, in which through hole 437 the first end portion 412 of the main body 411 of the spring device 410 is pivotally arranged when mounting the spring device 410 onto the lamp fixture 430.

In an alternative embodiment the second receiving portion 437 is arranged as a hinge bracket for receiving a hinge bolt arranged at the first end portion 412 of the spring device 410.

The lamp fixture 430 is in this embodiment further arranged to receive the LED-module in an aperture 135.

In an alternative embodiment the LED module is mounted in the first holding member 120 with the LEDs facing the main body 411 of the spring device 410. The spring device is then arranged having an aperture (not shown) for passing light from the LED- module 105. Thus the mounting of the spring device 410 and associated LED-module 105 may be done from the external side of a lamp, without having to open up the housing of the lamp device. The electrical connect must be arranged such that when mounting the spring device, power connections inside the lamp device are simultaneously connected for the LED- module.

When mounting the assembly structure 400, the LED-module 105 is pushed into the first holding member 120. This may be done before or after pivotally connecting the first end portion 412 with the lamp fixture 430 by engaging the first end portion 412 with the second receiving portion 437. The spring device 410 is subsequently folded down towards the lamp fixture 430, whereupon the LED-module 105 is lowered through the aperture 135 (or in the alternative embodiment as described above, is pressed against the surface of the lamp fixture 430). The first holding member 440 is pushed against the first receiving portion 436 of the lamp fixture 430, i.e. is pressed through the through hole which is preferably arranged to be substantially the same width as the U-shaped first holding member 440, such that the first resilient element 450 is pressed in as the locking member 442 is pressed in by the edge of the first receiving portion. Alternatively the locking member 442 is pressed in by applying an external force on the operation member 441.

Once the locking member 442 has been pressed through the through hole 436 the operation member 441 is released and the spring device 410 is locked in a locked state. The small cure surface of the main body 411 of the spring device 410 provides a third resilient element which causes a spring force to act against the interface surface of the spring device 410 and the lamp fixture 430 such that good thermal contact is achieved. In an embodiment of the present invention, as illustrated in Fig. 5, cooling fins 590 are arranged on the main body 511 of the spring device 510. The cooling fins 590 provides additional heat dissipating ability to the spring device 510. As is appreciated by a man skilled in the art the cooling fins 590 may be designed in a variety of ways. In another embodiment of the invention, the spring device 610 is arranged having an external heat sink 620 arranged on the spring device 610. In an exemplifying embodiment, as illustrated in Fig. 6, the external heat sink 620 is arranged on the top side of the spring device 610. Furthermore, the first holding member 120 is arranged at the heat sink 620 such that the first holding member 120 is utilized for holding the LED-module 105 while simultaneously engaging the external heat sink 620 with the spring device 610. The first holding member 120 protrudes the main body 611 of the spring device 610. The LED module is mounted onto the spring device 610 by pressing against the holding member 120.

Above, embodiments of the assembly structure according to the invention as defined in the appended claims have been described. These should be seen as merely non- limiting examples. As understood by a skilled person, many modifications and alternative embodiments are possible within the scope of the invention.

It is to be noted, that for the purposes of this application, and in particular with regard to the appended claims, the word "comprising" does not exclude other elements or steps, that the word "a" or "an", does not exclude a plurality, which per se will be apparent to a person skilled in the art.

Claims

CLAIMS:

1. An assembly structure (100, 200) comprising: a light emitting diode module (105); a lamp fixture (130, 230); and a spring device (110, 210) comprising - a main body (111, 211); a first holding member (120) arranged on a first side of said main body for holding said light emitting diode module; a second holding member (140, 260) for engaging said spring device with said lamp fixture; - a first resilient element (120,125, 214, 215 ) for reacting between said first holding member and said light emitting diode module; and a second resilient element (150, 215, 216) for reacting between said second holding member and a receiving portion arranged (136, 236) on said lamp fixture; wherein said first resilient element is arranged to release said first holding member when actuated, and said second resilient element is arranged to release said second holding member when actuated.

2. An assembly structure (200) according to claim 1, wherein said first resilient element and said second resilient element are interconnected such that an external force actuates said first resilient element and said second resilient element simultaneously.

3. An assembly structure (100, 200, 400) according to claim 1 or 2, wherein at least a portion of said main body is arranged to be thermally engaged with said lamp fixture.

4. An assembly structure according to any one of the preceding claims, wherein said main body is further arranged to receive an external heat sink (620).

5. An assembly structure according to any one of the preceding claims, wherein an end portion (413) of said main body is arranged to be pivotally arranged to said lamp fixture.

6. An assembly structure according to any one of the preceding claims, wherein said main body comprises cooling fins (590).

7. An assembly structure according to any one of the preceding claims, wherein said main body further comprises a light aperture for passing light emitted from said light emitting diode module.

8. An assembly structure according to any one of claims 3 to 7, wherein said lamp fixture or said spring device is arranged with at least one third resilient element for thermally engaging said spring device and said lamp fixture.

9. A method for mounting a light emitting diode module on a lamp fixture comprising: providing a spring device, said spring device comprising: a main body; - a first holding member arranged on a first side of said main body for holding said light emitting diode module; a second holding member for engaging said spring device with said lamp fixture; a first resilient element for reacting between said first holding member and said light emitting diode module; and a second resilient element for reacting between said second holding member and receiving portions arranged on said lamp fixture; wherein said first resilient element is arranged to release said first holding member when actuated, and said second resilient element is arranged to release said second holding member when actuated; releasing said first holding member by applying a first external force for actuating said first resilient element; positioning said light emitting diode module in said first holding member; locking said light emitting diode module in said first holding member by removing said first external force; releasing said second holding member by applying a second external force for actuating said second resilient element; positioning said second holding member in a first receiving portion arranged on said lamp fixture; locking said second holding member in said first receiving portion by removing said second external force.

10. A method according to claim 9, wherein said first resilient element and said second resilient element are interconnected, wherein said step of releasing said first holding member and said step of releasing said second holding member is done simultaneously by applying a common external force for actuating said first resilient element and said second resilient element.

11. A method according to claim 9 or 10, wherein said step of providing a spring device further comprises: arranging said main body of said spring device with at least one portion that is arranged for thermally engaging with said lamp fixture.

12. A method according to any one of claims 9 to 11, wherein said step of providing a spring device further comprises: mounting an external heat sink on a second side of said main body, such that holding protrusions arranged on said external heat sink protrudes through holes arranged in said main body, wherein said holding protrusions form said first holding member.

13. A method according to any one of claims 9 to 12, wherein said step of providing a spring device further comprises arranging an end portion of said main body to be pivotal, and wherein said method further comprises after said step of locking said light emitting diode module in said first holding device, arranging said pivotal end portion of said main body into a second receiving portion arranged on said lamp fixture.

14. A method according to claim 11, wherein said lamp fixture is arranged with at least one third resilient element for receiving said at least one portion of said main body.