WO2009158683A3 - Data center thermal monitoring - Google Patents

Data center thermal monitoring Download PDF

Info

Publication number
WO2009158683A3
WO2009158683A3 PCT/US2009/048966 US2009048966W WO2009158683A3 WO 2009158683 A3 WO2009158683 A3 WO 2009158683A3 US 2009048966 W US2009048966 W US 2009048966W WO 2009158683 A3 WO2009158683 A3 WO 2009158683A3
Authority
WO
WIPO (PCT)
Prior art keywords
data center
thermal monitoring
center thermal
computer
measurement
Prior art date
Application number
PCT/US2009/048966
Other languages
French (fr)
Other versions
WO2009158683A2 (en
Inventor
David W. Stiver
Shawn Lewis
Gregory P. Imwalle
Original Assignee
Exaflop Llc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Exaflop Llc filed Critical Exaflop Llc
Priority to MX2010014463A priority Critical patent/MX2010014463A/en
Priority to JP2011516741A priority patent/JP5237449B2/en
Priority to BRPI0914537A priority patent/BRPI0914537A2/en
Priority to CA2729143A priority patent/CA2729143C/en
Priority to AU2009261991A priority patent/AU2009261991B2/en
Priority to EP09771214.5A priority patent/EP2313831B1/en
Priority to DK09771214.5T priority patent/DK2313831T3/en
Publication of WO2009158683A2 publication Critical patent/WO2009158683A2/en
Publication of WO2009158683A3 publication Critical patent/WO2009158683A3/en

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • G06F1/206—Cooling means comprising thermal management
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/20836—Thermal management, e.g. server temperature control
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
    • Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management

Abstract

A measurement indicative of a temperature of a computer is received and a thermal health value for the computer is calculated based on the measurement.
PCT/US2009/048966 2008-06-26 2009-06-26 Data center thermal monitoring WO2009158683A2 (en)

Priority Applications (7)

Application Number Priority Date Filing Date Title
MX2010014463A MX2010014463A (en) 2008-06-26 2009-06-26 Data center thermal monitoring.
JP2011516741A JP5237449B2 (en) 2008-06-26 2009-06-26 Data center thermal monitoring
BRPI0914537A BRPI0914537A2 (en) 2008-06-26 2009-06-26 data center thermal monitoring
CA2729143A CA2729143C (en) 2008-06-26 2009-06-26 Data center thermal monitoring
AU2009261991A AU2009261991B2 (en) 2008-06-26 2009-06-26 Data center thermal monitoring
EP09771214.5A EP2313831B1 (en) 2008-06-26 2009-06-26 Data center thermal monitoring
DK09771214.5T DK2313831T3 (en) 2008-06-26 2009-06-26 Thermal monitoring of data center

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US7610408P 2008-06-26 2008-06-26
US61/076,104 2008-06-26

Publications (2)

Publication Number Publication Date
WO2009158683A2 WO2009158683A2 (en) 2009-12-30
WO2009158683A3 true WO2009158683A3 (en) 2010-04-29

Family

ID=41445372

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2009/048966 WO2009158683A2 (en) 2008-06-26 2009-06-26 Data center thermal monitoring

Country Status (11)

Country Link
US (1) US8223025B2 (en)
EP (1) EP2313831B1 (en)
JP (1) JP5237449B2 (en)
AU (1) AU2009261991B2 (en)
BR (1) BRPI0914537A2 (en)
CA (1) CA2729143C (en)
CL (1) CL2010001564A1 (en)
DE (1) DE202009019133U1 (en)
DK (1) DK2313831T3 (en)
MX (1) MX2010014463A (en)
WO (1) WO2009158683A2 (en)

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US20130169816A1 (en) * 2011-12-28 2013-07-04 Jhen-Jia Hu Monitoring and managing device, monitoring and managing system and method of data center
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US9851726B2 (en) * 2013-09-04 2017-12-26 Panduit Corp. Thermal capacity management
US9279597B1 (en) 2013-11-11 2016-03-08 Brocade Communications Systems, Inc. Selection of environmental profile based on system configuration
US9883009B2 (en) 2013-12-27 2018-01-30 International Business Machines Corporation Automatic computer room air conditioning control method
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US9763356B2 (en) * 2014-03-26 2017-09-12 Lenovo (Singapore) Pte. Ltd. Closed-loop control and monitoring in cooling electronic components
US9945576B2 (en) * 2014-10-08 2018-04-17 Dell Products, Lp System and method for detecting the presence of alternate cooling systems
US10877530B2 (en) 2014-12-23 2020-12-29 Intel Corporation Apparatus and method to provide a thermal parameter report for a multi-chip package
CN109324768B (en) * 2014-12-30 2021-10-22 珠海奔图电子有限公司 Method and system for binding user account with image forming device through mobile terminal
US10642325B2 (en) * 2015-01-30 2020-05-05 Microsoft Technology Licensing, Llc Implementing thermal remediations in reaction to execution of software
US9970674B2 (en) 2015-04-29 2018-05-15 International Business Machines Corporation Automated, adaptive ventilation for a data center
US10203994B2 (en) * 2016-05-12 2019-02-12 Lenovo Enterprise Solutions (Singapore) Pte. Ltd Determining and using correlative thermal efficiency impacts to distribute workloads
US10698460B2 (en) 2017-03-13 2020-06-30 Samsung Electronics Co., Ltd. Advanced thermal control for SSD
US10809780B2 (en) 2017-03-13 2020-10-20 Samsung Electronics Co., Ltd. Active disturbance rejection based thermal control
US10860071B2 (en) 2017-05-04 2020-12-08 Microsoft Technology Licensing Llc Thermal excursion detection in datacenter components
KR102351681B1 (en) * 2017-07-25 2022-01-14 삼성전자주식회사 System and method for active disturbance rejection based thermal control
US10488901B1 (en) * 2018-09-20 2019-11-26 Dell Products L.P. Dynamic thermal responses for computing components
US10671051B2 (en) 2018-10-09 2020-06-02 Hewlett Packard Enterprise Development Lp Thermal event detection in electrical systems
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Also Published As

Publication number Publication date
DE202009019133U1 (en) 2017-01-04
EP2313831B1 (en) 2018-02-21
WO2009158683A2 (en) 2009-12-30
US20100085196A1 (en) 2010-04-08
JP2011526395A (en) 2011-10-06
CA2729143C (en) 2015-08-18
EP2313831A2 (en) 2011-04-27
AU2009261991B2 (en) 2013-03-14
US8223025B2 (en) 2012-07-17
DK2313831T3 (en) 2018-03-12
MX2010014463A (en) 2011-07-20
EP2313831A4 (en) 2012-02-08
BRPI0914537A2 (en) 2015-12-15
JP5237449B2 (en) 2013-07-17
CL2010001564A1 (en) 2011-06-03
CA2729143A1 (en) 2009-12-30
AU2009261991A1 (en) 2009-12-30

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