WO2010008985A3 - Encapsulation methods for interfero-metric modulator and mems devices - Google Patents

Encapsulation methods for interfero-metric modulator and mems devices Download PDF

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Publication number
WO2010008985A3
WO2010008985A3 PCT/US2009/049964 US2009049964W WO2010008985A3 WO 2010008985 A3 WO2010008985 A3 WO 2010008985A3 US 2009049964 W US2009049964 W US 2009049964W WO 2010008985 A3 WO2010008985 A3 WO 2010008985A3
Authority
WO
WIPO (PCT)
Prior art keywords
mems devices
interfero
encapsulation
encapsulation methods
devices
Prior art date
Application number
PCT/US2009/049964
Other languages
French (fr)
Other versions
WO2010008985A2 (en
Inventor
Je-Hsiung Lan
Original Assignee
Qualcomm Mems Technologies, Inc.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Qualcomm Mems Technologies, Inc. filed Critical Qualcomm Mems Technologies, Inc.
Publication of WO2010008985A2 publication Critical patent/WO2010008985A2/en
Publication of WO2010008985A3 publication Critical patent/WO2010008985A3/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
    • B81C1/00222—Integrating an electronic processing unit with a micromechanical structure
    • B81C1/0023—Packaging together an electronic processing unit die and a micromechanical structure die
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2201/00—Specific applications of microelectromechanical systems
    • B81B2201/04—Optical MEMS
    • B81B2201/047—Optical MEMS not provided for in B81B2201/042 - B81B2201/045
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2207/00—Microstructural systems or auxiliary parts thereof
    • B81B2207/09—Packages
    • B81B2207/091—Arrangements for connecting external electrical signals to mechanical structures inside the package
    • B81B2207/094—Feed-through, via
    • B81B2207/095—Feed-through, via through the lid
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2203/00—Forming microstructural systems
    • B81C2203/01—Packaging MEMS
    • B81C2203/0136—Growing or depositing of a covering layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2203/00—Forming microstructural systems
    • B81C2203/01—Packaging MEMS
    • B81C2203/0145—Hermetically sealing an opening in the lid

Abstract

Methods and devices used for the encapsulation of MEMS devices, such as an interferometric modulator, are disclosed. Encapsulation is provided to MEMS devices to protect the devices from such environmental hazards as moisture and mechanical shock. In addition to the encapsulation layer (300) providing protection from environmental hazards, the encapsulation layer (300) is additionally planarized so as to function as a substrate for additional circuit elements formed above the encapsulation layer (300).
PCT/US2009/049964 2008-07-17 2009-07-08 Encapsulation methods for interfero-metric modulator and mems devices WO2010008985A2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US12/175,355 US7782522B2 (en) 2008-07-17 2008-07-17 Encapsulation methods for interferometric modulator and MEMS devices
US12/175,355 2008-07-17

Publications (2)

Publication Number Publication Date
WO2010008985A2 WO2010008985A2 (en) 2010-01-21
WO2010008985A3 true WO2010008985A3 (en) 2010-07-22

Family

ID=41429324

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2009/049964 WO2010008985A2 (en) 2008-07-17 2009-07-08 Encapsulation methods for interfero-metric modulator and mems devices

Country Status (2)

Country Link
US (2) US7782522B2 (en)
WO (1) WO2010008985A2 (en)

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US9709509B1 (en) * 2009-11-13 2017-07-18 MCube Inc. System configured for integrated communication, MEMS, Processor, and applications using a foundry compatible semiconductor process
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US20130135184A1 (en) * 2011-11-29 2013-05-30 Qualcomm Mems Technologies, Inc. Encapsulated arrays of electromechanical systems devices
US9128289B2 (en) 2012-12-28 2015-09-08 Pixtronix, Inc. Display apparatus incorporating high-aspect ratio electrical interconnects
US20130335312A1 (en) * 2012-06-15 2013-12-19 Qualcomm Mems Technologies, Inc. Integration of thin film switching device with electromechanical systems device
US20140071142A1 (en) * 2012-09-13 2014-03-13 Pixtronix, Inc. Display apparatus incorporating vertically oriented electrical interconnects
CN103640211A (en) * 2013-12-23 2014-03-19 中国石油大学(华东) Flexible material assisted polymer micro-structure ultrasonic bonding encapsulating method

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Also Published As

Publication number Publication date
US20100014146A1 (en) 2010-01-21
US7782522B2 (en) 2010-08-24
US20100290102A1 (en) 2010-11-18
WO2010008985A2 (en) 2010-01-21
US8988760B2 (en) 2015-03-24

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