WO2010039546A1 - Led phosphor deposition - Google Patents
Led phosphor deposition Download PDFInfo
- Publication number
- WO2010039546A1 WO2010039546A1 PCT/US2009/058079 US2009058079W WO2010039546A1 WO 2010039546 A1 WO2010039546 A1 WO 2010039546A1 US 2009058079 W US2009058079 W US 2009058079W WO 2010039546 A1 WO2010039546 A1 WO 2010039546A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- encapsulation
- dam material
- dam
- region
- selecting
- Prior art date
Links
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 title abstract description 23
- 230000008021 deposition Effects 0.000 title abstract description 20
- 239000000463 material Substances 0.000 claims abstract description 115
- 238000005538 encapsulation Methods 0.000 claims abstract description 71
- 239000000758 substrate Substances 0.000 claims abstract description 30
- 238000000034 method Methods 0.000 claims abstract description 21
- 230000005855 radiation Effects 0.000 claims description 18
- 229920001296 polysiloxane Polymers 0.000 claims description 6
- 239000004593 Epoxy Substances 0.000 claims description 5
- 239000012780 transparent material Substances 0.000 claims 3
- 239000004065 semiconductor Substances 0.000 description 10
- 238000004519 manufacturing process Methods 0.000 description 7
- 238000005286 illumination Methods 0.000 description 5
- 230000003287 optical effect Effects 0.000 description 5
- 239000012535 impurity Substances 0.000 description 3
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 2
- 230000000712 assembly Effects 0.000 description 2
- 238000000429 assembly Methods 0.000 description 2
- 230000005684 electric field Effects 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 239000004408 titanium dioxide Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/54—Encapsulations having a particular shape
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V1/00—Shades for light sources, i.e. lampshades for table, floor, wall or ceiling lamps
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
- H10N10/80—Constructional details
- H10N10/85—Thermoelectric active materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
- H01L33/60—Reflective elements
Definitions
- the present application relates generally to light emitting diodes, and more particularly, to a phosphor deposition system to form encapsulations for light emitting diodes.
- a light emitting diode is a semiconductor material impregnated, or doped, with impurities. These impurities add “electrons” and "holes” to the semiconductor, which can move in the material relatively freely.
- a doped region of the semiconductor can have predominantly electrons or holes, and is referred to either as an n-type or p-type semiconductor region, respectively.
- the semiconductor includes an n-type semiconductor region and a p-type semiconductor region.
- a reverse electric field is created at the junction between the two regions, which cause the electrons and holes to move away from the junction to form an active region. When a forward voltage sufficient to overcome the reverse electric field is applied across the p-n junction, electrons and holes are forced into the active region and combine. When electrons combine with holes, they fall to lower energy levels and release energy in the form of light.
- an LED device comprises an LED chip (or die) that is mounted onto a substrate and encapsulated with an encapsulation material, such as phosphor. The encapsulation operates to protect the LED chip and to extract light. Typically, the LED chip sits in a cavity, which is then filled with the encapsulation material. For LED chips mounted on flat substrates (e.g.
- an encapsulation mold having the desired geometric shape is separately designed and manufactured. The mold is then mounted onto the substrate so that it fits around the LED chip. The mold is then filled with the phosphor mixture or other encapsulation material. [0005]
- using a separately designed and manufactured mold is costly, time consuming, and requires additional manufacturing operations. For example, the mold needs to be designed and fabricated as a separate part, which is time consuming and costly. The mold then needs to be mounted onto the substrate before it can be filled with the encapsulation material, which requires additional manufacturing operations.
- a phosphor deposition system that allows LED encapsulations having a variety of geometries to be formed in a fast, flexible, and cost effective manner with simple manufacturing operations.
- a method for forming an encapsulation. The method comprises determining a geometric shape for the encapsulation, selecting a dam material, applying the dam material to a substrate to form a boundary defining a region having the geometric shape, and filling the region with encapsulation material to form the encapsulation.
- an LED apparatus comprises at least one LED chip and an encapsulation disposed on the at least one LED chip.
- the encapsulation is formed by determining a geometric shape for the encapsulation, selecting a dam material, applying the dam material to a substrate to form a boundary defining a region having the geometric shape, and filling the region with encapsulation material to form the encapsulation.
- an LED lamp comprising a package and an LED apparatus coupled to the package.
- the LED apparatus comprises at least one LED chip and an encapsulation disposed on the at least one LED chip.
- the encapsulation is formed by determining a geometric shape for the encapsulation, selecting a dam material, applying the dam material to a substrate to form a boundary defining a region having the geometric shape, and filling the region with encapsulation material to form the encapsulation [0011]
- FIG. 1 shows an exemplary LED assembly that illustrates aspects of a phosphor deposition system
- FIG. 2 shows an exemplary LED assembly that illustrates aspects of a phosphor deposition system
- FIG. 3 shows an exemplary method for providing encapsulations in accordance with a phosphor deposition system
- FIG. 4 shows exemplary devices comprising LED assemblies constructed in accordance with a phosphor deposition system.
- relative terms such as “lower” or “bottom” and “upper” or “top,” may be used herein to describe one element's relationship to another element as illustrated in the drawings. It will be understood that relative terms are intended to encompass different orientations of an apparatus in addition to the orientation depicted in the drawings. By way of example, if an apparatus in the drawings is turned over, elements described as being on the “lower” side of other elements would then be oriented on the “upper” sides of the other elements. The term “lower”, can therefore, encompass both an orientation of “lower” and “upper,” depending of the particular orientation of the apparatus.
- first and second may be used herein to describe various regions, layers and/or sections, these regions, layers and/or sections should not be limited by these terms. These terms are only used to distinguish one region, layer or section from another region, layer or section. Thus, a first region, layer or section discussed below could be termed a second region, layer or section, and similarly, a second region, layer or section may be termed a first region, layer or section without departing from the teachings of the present invention.
- FIG. 1 an exemplary LED assembly 100 is shown that illustrates aspects of a phosphor deposition system.
- the LED assembly 100 comprises a plurality of LED chips 104 mounted on a substrate 102 that may be ceramic, aluminum or any other suitable substrate material. It should be noted that although four LED chips 104 are shown in FIG. 1 , the system is suitable for use with one or any number of LED chips.
- a dam 106 comprising dam material is deposited onto the substrate 102 so that it surrounds the LED chips 104 so as to create an encapsulation region 108.
- the dam material may be clear or an opaque white that is reflective.
- the dam material can be epoxy or silicone.
- filler particles like titanium dioxide can be added to create an opaque material.
- the dam material should be transparent or reflective.
- the dam material is deposited onto the substrate 102 by an automated dispenser machine that is programmable and is able to deposit the dam material onto the substrate 102 in any pattern and/or geometric shape.
- dam material may be deposited to form rectangular shapes, circular shapes, curved shapes and/or any combination of shapes that may be selected to define a region in which an encapsulation is to be formed.
- the dam material may also be deposited with a desired cross-section.
- the deposited dam material has different optical properties.
- the dam material comprises a reflective dam material that reflects light.
- the dam material comprises a transparent dam material that passes light.
- light emitted from the LED chips 104 will pass through the dam material to form a broader radiation pattern.
- an efficient phosphor deposition system is provided for simplified encapsulation formation, selectable light radiation patterns, and other benefits.
- the system is suitable for use with any type of substrate and has the following features. 1. Free form, easy to deposit, and easy to shape dam material to provide any type of encapsulation geometry.
- Dam material may be transparent (i.e., clear silicone) to pass light to obtain a broad radiation pattern.
- Dam material may be reflective to reflect light to obtain a narrower radiation pattern.
- Dam material can be deposited with a range of heights and cross-sections.
- Dam material can be applied to any type of substrate material.
- FIG. 2 shows an exemplary LED assembly 200 that illustrates aspects of a phosphor deposition system.
- the LED assembly 200 comprises a plurality of LED chips 202 mounted onto a substrate 204.
- the dam material (shown at 206 and 208) is deposited onto the substrate 204 to define a closed region generally indicated at 210, in which an encapsulation is to be formed.
- the dam material that is shown at 206 and 208 forms a boundary that defines the closed region 210.
- the dam material is shown in the two sections 206 and 208 to illustrate how the optical characteristics of the dam material can be selected to obtain a desired radiation pattern.
- the dam material can be deposited to have virtually any cross-section and is not limited to the cross-section shape shown in FIG. 2.
- the dam material shown at 206 and 208 is deposited onto the substrate 204 with a selected height shown at 224.
- an encapsulation 214 is formed by filling the region 210 defined by the dam material (206, 208) with encapsulation material.
- the dam material can be deposited onto the substrate to define any size and/or shaped region in which a corresponding size/shaped encapsulation can be formed.
- dam material For the purpose of illustrating how the dam material can be selected to obtain broad and narrow radiation patterns, it will be assumed that the dam material is selected to be a reflective material.
- the dam material 206 illustrates optical characteristics under this assumption. If the dam material is selected to be reflective, light emitted from the LEDs 202 reflects off the surface of the dam material as illustrated at 216 to form a narrow radiation pattern illustrated at 218.
- the dam material Assuming now that the dam material is selected to be transparent.
- the dam material 208 illustrates optical characteristics under this assumption. If the dam material is selected to be transparent, light emitted from the LEDs 202 passes through the dam material as illustrated at 220 to form a broad radiation pattern illustrated at 222.
- dam material may be selected to obtain a desired radiation pattern.
- the indicator 224 illustrates the height of the dam material.
- dam material may be deposited to have a wide range of heights and/or cross-sections. For example, dam material having a height of approximately one millimeter can be easily achieved. Generally, the height and/or cross-section of the dam material may be dependant on the width of its base or on overall aspect ratio.
- FIG. 3 shows an exemplary method 300 for providing encapsulations in accordance with a phosphor deposition system. For clarity, the method 300 is described below with reference to FIGS. 1-2.
- a geometric shape is determined for an encapsulation to be used with an LED assembly.
- any suitable geometric shape may be selected. For example, rectangular shapes, circular shapes, curved shapes and/or any combination of shapes may be selected.
- a dam material is selected to provide a desired optical radiation pattern.
- the dam material may be reflective material that reflects light to provide a narrower radiation pattern.
- the dam material may be transparent to pass light to provide a broad radiation pattern.
- the dam material is deposited onto the substrate to form a boundary that defines a region having the desired geometric shape. It should be noted that multiple regions may be defined.
- the dam material is deposited by an automated dispenser.
- the dam material may also be deposited at a desired height above the substrate and with a desired cross-section to further define the shape of the encapsulation. For example, as illustrated in FIG. 1, the dam material is deposited to form the region 108, and in FIG. 2, the dam material is deposited to form the region 210.
- the region bounded by the dam material is filled with encapsulation material to obtain an encapsulation have the desired shape.
- the encapsulation material may be a silicone or epoxy, either clear or filled with phosphor, or any other encapsulation material that is applied, deposited, or otherwise filled within the regions bounded by the dam material.
- the method 300 operates to provide a phosphor deposition system that allows encapsulations having a variety of shapes to be quickly and flexibly formed. It should be noted that the operations of the method 300 may be rearranged or otherwise modified within the scope of the various aspects. Thus, other implementations are possible with the scope of the various aspects described herein.
- FIG. 4 shows exemplary devices 400 comprising LED assemblies having encapsulations formed by a phosphor deposition system in accordance with aspects of the present invention.
- the devices 400 comprise a lamp 402, an illumination device 404, and a street light 406.
- Each of. the devices shown in FIG. 4 includes an LED assembly having an encapsulation formed by a phosphor deposition system as described herein.
- the lamp 402 comprises a package 416 and an LED assembly having an encapsulation formed by a phosphor deposition system.
- the lamp 402 may be used for any type of general illumination.
- the lamp 402 may be used in an automobile headlamp, street light, overhead light, or in any other general illumination application.
- the illumination device 404 comprises a power source 410 that is electrically coupled to a lamp 412, which may be configured as the lamp 402.
- the power source 410 may be batteries or any other suitable type of power source, such as a solar cell.
- the street light 406 comprises a power source connected to a lamp 414, which may be configured as the lamp 402.
- the lamp 414 comprises an LED assembly having an encapsulation formed by a phosphor deposition system.
Abstract
Description
Claims
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN200980146640.0A CN102224607B (en) | 2008-09-30 | 2009-09-23 | LED phosphorus deposits |
JP2011529187A JP2012504341A (en) | 2008-09-30 | 2009-09-23 | LED phosphor deposition method |
RU2011117216/28A RU2521749C2 (en) | 2008-09-30 | 2009-09-23 | Depositing phosphorus for light-emitting diode |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US12/242,274 US8247827B2 (en) | 2008-09-30 | 2008-09-30 | LED phosphor deposition |
US12/242,274 | 2008-09-30 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2010039546A1 true WO2010039546A1 (en) | 2010-04-08 |
Family
ID=42056418
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US2009/058079 WO2010039546A1 (en) | 2008-09-30 | 2009-09-23 | Led phosphor deposition |
Country Status (7)
Country | Link |
---|---|
US (1) | US8247827B2 (en) |
JP (1) | JP2012504341A (en) |
KR (1) | KR20110063793A (en) |
CN (1) | CN102224607B (en) |
MY (1) | MY153517A (en) |
RU (1) | RU2521749C2 (en) |
WO (1) | WO2010039546A1 (en) |
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Also Published As
Publication number | Publication date |
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RU2011117216A (en) | 2012-11-10 |
MY153517A (en) | 2015-02-27 |
US20100078664A1 (en) | 2010-04-01 |
KR20110063793A (en) | 2011-06-14 |
RU2521749C2 (en) | 2014-07-10 |
US8247827B2 (en) | 2012-08-21 |
CN102224607A (en) | 2011-10-19 |
CN102224607B (en) | 2016-10-12 |
JP2012504341A (en) | 2012-02-16 |
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