WO2010048237A3 - Ultraviolet reflector with coolant gas holes and method - Google Patents
Ultraviolet reflector with coolant gas holes and method Download PDFInfo
- Publication number
- WO2010048237A3 WO2010048237A3 PCT/US2009/061391 US2009061391W WO2010048237A3 WO 2010048237 A3 WO2010048237 A3 WO 2010048237A3 US 2009061391 W US2009061391 W US 2009061391W WO 2010048237 A3 WO2010048237 A3 WO 2010048237A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- coolant gas
- reflector
- ultraviolet lamp
- gas holes
- ultraviolet reflector
- Prior art date
Links
- 239000002826 coolant Substances 0.000 title abstract 2
- 238000000034 method Methods 0.000 title abstract 2
- 239000000758 substrate Substances 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67115—Apparatus for thermal treatment mainly by radiation
-
- G—PHYSICS
- G21—NUCLEAR PHYSICS; NUCLEAR ENGINEERING
- G21K—TECHNIQUES FOR HANDLING PARTICLES OR IONISING RADIATION NOT OTHERWISE PROVIDED FOR; IRRADIATION DEVICES; GAMMA RAY OR X-RAY MICROSCOPES
- G21K1/00—Arrangements for handling particles or ionising radiation, e.g. focusing or moderating
- G21K1/06—Arrangements for handling particles or ionising radiation, e.g. focusing or moderating using diffraction, refraction or reflection, e.g. monochromators
- G21K1/062—Devices having a multilayer structure
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/67034—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying
-
- G—PHYSICS
- G21—NUCLEAR PHYSICS; NUCLEAR ENGINEERING
- G21K—TECHNIQUES FOR HANDLING PARTICLES OR IONISING RADIATION NOT OTHERWISE PROVIDED FOR; IRRADIATION DEVICES; GAMMA RAY OR X-RAY MICROSCOPES
- G21K2201/00—Arrangements for handling radiation or particles
- G21K2201/06—Arrangements for handling radiation or particles using diffractive, refractive or reflecting elements
- G21K2201/064—Arrangements for handling radiation or particles using diffractive, refractive or reflecting elements having a curved surface
-
- G—PHYSICS
- G21—NUCLEAR PHYSICS; NUCLEAR ENGINEERING
- G21K—TECHNIQUES FOR HANDLING PARTICLES OR IONISING RADIATION NOT OTHERWISE PROVIDED FOR; IRRADIATION DEVICES; GAMMA RAY OR X-RAY MICROSCOPES
- G21K2201/00—Arrangements for handling radiation or particles
- G21K2201/06—Arrangements for handling radiation or particles using diffractive, refractive or reflecting elements
- G21K2201/065—Arrangements for handling radiation or particles using diffractive, refractive or reflecting elements provided with cooling means
-
- G—PHYSICS
- G21—NUCLEAR PHYSICS; NUCLEAR ENGINEERING
- G21K—TECHNIQUES FOR HANDLING PARTICLES OR IONISING RADIATION NOT OTHERWISE PROVIDED FOR; IRRADIATION DEVICES; GAMMA RAY OR X-RAY MICROSCOPES
- G21K2201/00—Arrangements for handling radiation or particles
- G21K2201/06—Arrangements for handling radiation or particles using diffractive, refractive or reflecting elements
- G21K2201/067—Construction details
Abstract
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011532341A JP5401551B2 (en) | 2008-10-21 | 2009-10-20 | Ultraviolet reflector with holes for cooling gas and method |
KR1020117011748A KR101244243B1 (en) | 2008-10-21 | 2009-10-20 | Ultraviolet reflector with coolant gas holes and method |
CN2009801423975A CN102187441B (en) | 2008-10-21 | 2009-10-20 | Ultraviolet reflector with coolant gas holes and method |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US12/255,609 US7964858B2 (en) | 2008-10-21 | 2008-10-21 | Ultraviolet reflector with coolant gas holes and method |
US12/255,609 | 2008-10-21 |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2010048237A2 WO2010048237A2 (en) | 2010-04-29 |
WO2010048237A3 true WO2010048237A3 (en) | 2010-07-15 |
Family
ID=42107912
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US2009/061391 WO2010048237A2 (en) | 2008-10-21 | 2009-10-20 | Ultraviolet reflector with coolant gas holes and method |
Country Status (6)
Country | Link |
---|---|
US (2) | US7964858B2 (en) |
JP (1) | JP5401551B2 (en) |
KR (1) | KR101244243B1 (en) |
CN (3) | CN103337274A (en) |
TW (1) | TWI374452B (en) |
WO (1) | WO2010048237A2 (en) |
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- 2009-10-20 WO PCT/US2009/061391 patent/WO2010048237A2/en active Application Filing
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Also Published As
Publication number | Publication date |
---|---|
KR20110077008A (en) | 2011-07-06 |
US7964858B2 (en) | 2011-06-21 |
CN102187441B (en) | 2013-09-11 |
US8338809B2 (en) | 2012-12-25 |
CN103337274A (en) | 2013-10-02 |
TWI374452B (en) | 2012-10-11 |
KR101244243B1 (en) | 2013-03-19 |
JP5401551B2 (en) | 2014-01-29 |
CN103400627A (en) | 2013-11-20 |
WO2010048237A2 (en) | 2010-04-29 |
CN102187441A (en) | 2011-09-14 |
JP2012506622A (en) | 2012-03-15 |
TW201029017A (en) | 2010-08-01 |
US20110248183A1 (en) | 2011-10-13 |
US20100096564A1 (en) | 2010-04-22 |
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