WO2010053804A3 - Endpoint control of multiple-wafer chemical mechanical polishing - Google Patents
Endpoint control of multiple-wafer chemical mechanical polishing Download PDFInfo
- Publication number
- WO2010053804A3 WO2010053804A3 PCT/US2009/062433 US2009062433W WO2010053804A3 WO 2010053804 A3 WO2010053804 A3 WO 2010053804A3 US 2009062433 W US2009062433 W US 2009062433W WO 2010053804 A3 WO2010053804 A3 WO 2010053804A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- polishing
- substrate
- substrates
- mechanical polishing
- chemical mechanical
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/005—Control means for lapping machines or devices
- B24B37/013—Devices or means for detecting lapping completion
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
- B24B49/02—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent
- B24B49/04—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent involving measurement of the workpiece at the place of grinding during grinding operation
Abstract
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011534728A JP2012508452A (en) | 2008-11-07 | 2009-10-28 | End point control for chemical mechanical polishing of multiple wafers |
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US12/267,434 US8295967B2 (en) | 2008-11-07 | 2008-11-07 | Endpoint control of multiple-wafer chemical mechanical polishing |
US12/267,473 US20100120331A1 (en) | 2008-11-07 | 2008-11-07 | Endpoint control of multiple-wafer chemical mechanical polishing |
US12/267,473 | 2008-11-07 | ||
US12/267,434 | 2008-11-07 |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2010053804A2 WO2010053804A2 (en) | 2010-05-14 |
WO2010053804A3 true WO2010053804A3 (en) | 2010-07-22 |
Family
ID=42153492
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US2009/062433 WO2010053804A2 (en) | 2008-11-07 | 2009-10-28 | Endpoint control of multiple-wafer chemical mechanical polishing |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP2012508452A (en) |
KR (1) | KR20110093866A (en) |
TW (1) | TW201027611A (en) |
WO (1) | WO2010053804A2 (en) |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9168630B2 (en) * | 2012-04-23 | 2015-10-27 | Applied Materials, Inc. | User-input functions for data sequences in polishing endpoint detection |
CN103624673B (en) * | 2012-08-21 | 2016-04-20 | 中芯国际集成电路制造(上海)有限公司 | The method of chemical mechanical polishing apparatus and chemico-mechanical polishing |
US9636797B2 (en) * | 2014-02-12 | 2017-05-02 | Applied Materials, Inc. | Adjusting eddy current measurements |
KR102131090B1 (en) * | 2014-04-22 | 2020-07-07 | 가부시키가이샤 에바라 세이사꾸쇼 | Polishing method and polishing apparatus |
KR102276869B1 (en) * | 2016-06-30 | 2021-07-14 | 어플라이드 머티어리얼스, 인코포레이티드 | Chemical Mechanical Polishing Automated Recipe Creation |
KR101968157B1 (en) * | 2018-01-18 | 2019-08-13 | 팸텍주식회사 | Polishing apparatus and sample processing apparatus |
JP7386125B2 (en) * | 2019-06-11 | 2023-11-24 | 株式会社荏原製作所 | Polishing method and polishing device |
KR102157729B1 (en) | 2020-01-09 | 2020-09-18 | 엑스티알 테크놀로지스 인코포레이티드 | Lcd glass lapping apparatus |
CN114290156B (en) * | 2021-11-30 | 2023-05-09 | 浙江晶盛机电股份有限公司 | Thickness measuring method, thickness measuring system and thickness measuring device in silicon wafer polishing process |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20020025764A1 (en) * | 1997-11-21 | 2002-02-28 | Seiji Katsuoka | Polishing apparatus |
US6618130B2 (en) * | 2001-08-28 | 2003-09-09 | Speedfam-Ipec Corporation | Method and apparatus for optical endpoint detection during chemical mechanical polishing |
US20060043071A1 (en) * | 2004-09-02 | 2006-03-02 | Liang-Lun Lee | System and method for process control using in-situ thickness measurement |
US20080051009A1 (en) * | 2002-09-16 | 2008-02-28 | Yan Wang | Endpoint for electroprocessing |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH11285968A (en) * | 1998-04-01 | 1999-10-19 | Nikon Corp | Polishing device and method |
JP2002359217A (en) * | 2001-05-31 | 2002-12-13 | Omron Corp | Method and device for detecting polishing end point |
-
2009
- 2009-10-28 JP JP2011534728A patent/JP2012508452A/en active Pending
- 2009-10-28 WO PCT/US2009/062433 patent/WO2010053804A2/en active Application Filing
- 2009-10-28 KR KR1020117012981A patent/KR20110093866A/en not_active Application Discontinuation
- 2009-11-03 TW TW098137326A patent/TW201027611A/en unknown
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20020025764A1 (en) * | 1997-11-21 | 2002-02-28 | Seiji Katsuoka | Polishing apparatus |
US6618130B2 (en) * | 2001-08-28 | 2003-09-09 | Speedfam-Ipec Corporation | Method and apparatus for optical endpoint detection during chemical mechanical polishing |
US20080051009A1 (en) * | 2002-09-16 | 2008-02-28 | Yan Wang | Endpoint for electroprocessing |
US20060043071A1 (en) * | 2004-09-02 | 2006-03-02 | Liang-Lun Lee | System and method for process control using in-situ thickness measurement |
Also Published As
Publication number | Publication date |
---|---|
JP2012508452A (en) | 2012-04-05 |
KR20110093866A (en) | 2011-08-18 |
TW201027611A (en) | 2010-07-16 |
WO2010053804A2 (en) | 2010-05-14 |
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