WO2010092399A3 - Integrated mems transducer and circuitry - Google Patents

Integrated mems transducer and circuitry Download PDF

Info

Publication number
WO2010092399A3
WO2010092399A3 PCT/GB2010/050233 GB2010050233W WO2010092399A3 WO 2010092399 A3 WO2010092399 A3 WO 2010092399A3 GB 2010050233 W GB2010050233 W GB 2010050233W WO 2010092399 A3 WO2010092399 A3 WO 2010092399A3
Authority
WO
WIPO (PCT)
Prior art keywords
transducer
circuitry
layer
plate
layers
Prior art date
Application number
PCT/GB2010/050233
Other languages
French (fr)
Other versions
WO2010092399A2 (en
Inventor
Anthony Traynor
Neil Sinclair Rankin
Colin Roberts Jenkins
Tsjerk Hoekstra
Richard Laming
Original Assignee
Wolfson Microelectronics Plc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Wolfson Microelectronics Plc filed Critical Wolfson Microelectronics Plc
Publication of WO2010092399A2 publication Critical patent/WO2010092399A2/en
Publication of WO2010092399A3 publication Critical patent/WO2010092399A3/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
    • B81C1/00222—Integrating an electronic processing unit with a micromechanical structure
    • B81C1/00246—Monolithic integration, i.e. micromechanical structure and electronic processing unit are integrated on the same substrate
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B3/00—Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
    • B81B3/0018—Structures acting upon the moving or flexible element for transforming energy into mechanical movement or vice versa, i.e. actuators, sensors, generators
    • B81B3/0021—Transducers for transforming electrical into mechanical energy or vice versa
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00—Electrostatic transducers
    • H04R19/04—Microphones
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2201/00—Specific applications of microelectromechanical systems
    • B81B2201/02—Sensors
    • B81B2201/0257—Microphones or microspeakers
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/02—Casings; Cabinets ; Supports therefor; Mountings therein
    • H04R1/04—Structural association of microphone with electric circuitry therefor
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00—Electrostatic transducers
    • H04R19/005—Electrostatic transducers using semiconductor materials
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R31/00—Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor
    • H04R31/006—Interconnection of transducer parts

Abstract

The invention relates to the integration of MEMS transducers with electronic circuitry on the same substrate. A method of fabricating and integrated MEMS transducer and circuitry is disclosed which is fully compatible with standard CMOS processing and requires no post processing. The transducer is formed by forming at least one membrane layer, a plurality of back-plate layer sand at least one sacrificial structure such that removal of the sacrificial structure leaves the membrane free to move relative to the fixed back-plate. The method also forms circuit layers on the substrate to form the circuit components and involves sharing layers of material such that at least some of the layers which form the back-plate of the transducer also forms one of the circuit layer sand such layer include at least one metal layer and at least one dielectric layer. The method thus reduces the number of processing steps required compared with sequential fabrication of the circuitry and the transducer. Integrated transducer and electronics devices are also taught.
PCT/GB2010/050233 2009-02-13 2010-02-12 Integrated mems transducer and circuitry WO2010092399A2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
GB0902479A GB2467776A (en) 2009-02-13 2009-02-13 Integrated MEMS transducer and circuitry
GB0902479.5 2009-02-13

Publications (2)

Publication Number Publication Date
WO2010092399A2 WO2010092399A2 (en) 2010-08-19
WO2010092399A3 true WO2010092399A3 (en) 2011-05-05

Family

ID=40548201

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/GB2010/050233 WO2010092399A2 (en) 2009-02-13 2010-02-12 Integrated mems transducer and circuitry

Country Status (2)

Country Link
GB (1) GB2467776A (en)
WO (1) WO2010092399A2 (en)

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CN102086019B (en) * 2010-11-02 2013-04-17 中国电子科技集团公司第二十四研究所 Method for manufacturing monolithic polysilicon cantilever structure
US9540232B2 (en) 2010-11-12 2017-01-10 MCube Inc. Method and structure of MEMS WLCSP fabrication
US9276080B2 (en) 2012-03-09 2016-03-01 Mcube, Inc. Methods and structures of integrated MEMS-CMOS devices
US9181087B2 (en) 2011-03-02 2015-11-10 Epcos Ag Flat back plate
CN103404172B (en) * 2011-03-04 2016-11-09 埃普科斯股份有限公司 The method of the barrier film between microphone and two backboards of positioning
US9148726B2 (en) 2011-09-12 2015-09-29 Infineon Technologies Ag Micro electrical mechanical system with bending deflection of backplate structure
FR2983189B1 (en) * 2011-11-30 2014-02-07 Commissariat Energie Atomique METHOD FOR PRODUCING A STRUCTURE COMPRISING AT LEAST ONE ACTIVE PART HAVING DIFFERENT THICKNESS AREAS
US10132630B2 (en) 2013-01-25 2018-11-20 MCube Inc. Multi-axis integrated MEMS inertial sensing device on single packaged chip
US10036635B2 (en) 2013-01-25 2018-07-31 MCube Inc. Multi-axis MEMS rate sensor device
US9249012B2 (en) 2013-01-25 2016-02-02 Mcube, Inc. Method and device of MEMS process control monitoring and packaged MEMS with different cavity pressures
US9499392B2 (en) 2013-02-05 2016-11-22 Butterfly Network, Inc. CMOS ultrasonic transducers and related apparatus and methods
US10913653B2 (en) 2013-03-07 2021-02-09 MCube Inc. Method of fabricating MEMS devices using plasma etching and device therefor
US10046964B2 (en) 2013-03-07 2018-08-14 MCube Inc. MEMS structure with improved shielding and method
US9079761B2 (en) * 2013-03-14 2015-07-14 Taiwan Semiconductor Manufacturing Company, Ltd. Stacked semiconductor device and method of forming the same related cases
WO2014151525A2 (en) 2013-03-15 2014-09-25 Butterfly Network, Inc. Complementary metal oxide semiconductor (cmos) ultrasonic transducers and methods for forming the same
CN105247890B (en) * 2013-05-28 2019-03-29 罗伯特·博世有限公司 Multi-layer combined backboard for micromachined microphones
US9510103B2 (en) 2013-09-09 2016-11-29 Audio Pixels Ltd. Microelectromechanical apparatus for generating a physical effect
CA2946133A1 (en) * 2014-04-18 2015-10-22 Butterfly Network, Inc. Ultrasonic transducers in complementary metal oxide semiconductor (cmos) wafers and related apparatus and methods
DE102014106220B4 (en) 2014-05-05 2020-06-18 Tdk Corporation Sensor component with two sensor functions
US9067779B1 (en) 2014-07-14 2015-06-30 Butterfly Network, Inc. Microfabricated ultrasonic transducers and related apparatus and methods
GB2528872B (en) * 2014-07-31 2018-10-31 Cirrus Logic Int Semiconductor Ltd Integrated MEMS transducer and circuitry
GB2549876A (en) * 2014-12-23 2017-11-01 Cirrus Logic Int Semiconductor Ltd Mems transducer package
US9862600B2 (en) 2015-05-21 2018-01-09 Ams International Ag Chip structure
US10433067B2 (en) 2015-07-22 2019-10-01 Audio Pixels Ltd. DSR speaker elements and methods of manufacturing thereof
US10567883B2 (en) 2015-07-22 2020-02-18 Audio Pixels Ltd. Piezo-electric actuators
US9987661B2 (en) 2015-12-02 2018-06-05 Butterfly Network, Inc. Biasing of capacitive micromachined ultrasonic transducers (CMUTs) and related apparatus and methods
GB2547729B (en) * 2016-02-29 2020-01-22 Cirrus Logic Int Semiconductor Ltd Integrated MEMS transducer and circuitry
US10358340B2 (en) * 2016-04-28 2019-07-23 Globalfoundries Singapore Pte. Ltd. Integrated circuits having shielded MEMS devices and methods for fabricating shielded MEMS devices
DE102016123130B4 (en) 2016-11-30 2020-12-10 Infineon Technologies Austria Ag MEMS device and method of making a MEMS device
US10196261B2 (en) 2017-03-08 2019-02-05 Butterfly Network, Inc. Microfabricated ultrasonic transducers and related apparatus and methods
GB2561403A (en) * 2017-04-13 2018-10-17 Cirrus Logic Int Semiconductor Ltd MEMS Device
WO2018236956A1 (en) 2017-06-21 2018-12-27 Butterfly Network, Inc. Microfabricated ultrasonic transducer having individual cells with electrically isolated electrode sections
CN108666412A (en) * 2018-05-31 2018-10-16 歌尔股份有限公司 A kind of MEMS microphone and baroceptor integrated morphology and preparation method thereof
CN110248288A (en) * 2019-06-11 2019-09-17 东莞泉声电子有限公司 Compound horn diaphragm and preparation method thereof

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US6140689A (en) * 1996-11-22 2000-10-31 Siemens Aktiengesellschaft Micromechanical sensor
US20020135708A1 (en) * 2001-03-23 2002-09-26 Koninklijke Philips Electronics N.V. Display substrate and display device
US20030210799A1 (en) * 2002-05-10 2003-11-13 Gabriel Kaigham J. Multiple membrane structure and method of manufacture
US20060205106A1 (en) * 2005-02-25 2006-09-14 Hiroshi Fukuda Integrated micro electro-mechanical system and manufacturing method thereof

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US6012336A (en) * 1995-09-06 2000-01-11 Sandia Corporation Capacitance pressure sensor
US6140689A (en) * 1996-11-22 2000-10-31 Siemens Aktiengesellschaft Micromechanical sensor
US20020135708A1 (en) * 2001-03-23 2002-09-26 Koninklijke Philips Electronics N.V. Display substrate and display device
US20030210799A1 (en) * 2002-05-10 2003-11-13 Gabriel Kaigham J. Multiple membrane structure and method of manufacture
US20060205106A1 (en) * 2005-02-25 2006-09-14 Hiroshi Fukuda Integrated micro electro-mechanical system and manufacturing method thereof

Also Published As

Publication number Publication date
GB0902479D0 (en) 2009-04-01
GB2467776A8 (en) 2010-09-01
GB2467776A (en) 2010-08-18
WO2010092399A2 (en) 2010-08-19

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