WO2011008039A2

WO2011008039A2 - Hot melt adhesive tape and a production method therefor, a method for connecting electronic equipment using the same and a connecting device therefor, and electronic equipment of this type

Info

Publication number: WO2011008039A2
Application number: PCT/KR2010/004630
Authority: WO
Inventors: 박성식; 정묘선
Original assignee: (주)새티스
Priority date: 2009-07-16
Filing date: 2010-07-16
Publication date: 2011-01-20
Also published as: WO2011008039A3

Abstract

The present invention relates to: a hot melt adhesive tape which can be used on diverse materials and can provide high adhesion reliability, and which can be melted and adhered by means of a frequency and particularly high-frequency waves; and a production method therefor. More specifically, it relates to: an adhesive tape in which a hot-melting adhesive layer is provided with an electrically conductive body and in particular conductive aluminium foil, and which provides an adhesive force when the hot-melting layer is melted by heating the electrically conductive body on applying a high frequency; and a production method therefor. The hot-melt adhesive tape according to the present invention comprises: an electrically conductive body; and a hot-melting adhesive layer disposed on one surface or both surfaces of the aluminium foil.

Description

Heat-sealing tape and manufacturing method thereof, joining method of electronic device using same, joining device for same, and same electronic device

The present invention relates to a heat-sealing tape which can be used for various materials and can provide high adhesion reliability, and that can be melt-bonded by a frequency, in particular high frequency, and a method of manufacturing the same. In particular, the present invention relates to a fusion tape and a method for manufacturing the same, which are provided in the conductive foil, and wherein the heat-adhesive adhesive layer is melted by heating of the conductor when applying high frequency.

Adhesive tapes are widely used for packaging, bonding, surface protection, masking, etc. of articles in various industries. In general, adhesive tapes comprise an adhesive and a base film to achieve the desired performance.

Examples of such adhesive tapes include pressure-sensitive adhesive tapes and heat fusion tapes.

Pressure-sensitive adhesive tapes are the most commonly used adhesive tapes and published pressure-sensitive adhesive tapes are described below.

Korean Patent Publication No. 195-0703036 discloses a pressure-sensitive adhesive latex having an alkali dispersibility in drying such as a copolymer of n-butyl acrylate, methacrylic acid and hydroxyethyl acrylate, and n-butyl acrylate-based air. A water-insoluble and adhesive latex composition comprising an alkali non-dispersible adhesive and optionally one or more tackifiers under conditions such as coalescing latex, and upon drying, a process for preparing a pressure-sensitive adhesive label therefrom; and The use of the composition is disclosed.

Korean Patent Publication No. 2005-0044290 discloses a pressure-sensitive adhesive composition comprising a copolymer and an isocyanate compound without a substantial amount of a halogen compound, wherein the copolymer is selected from the group consisting of ethyl acetate, acetone, methyl ethyl ketone and methyl isobutyl ketone. In the presence of at least one organic solvent selected, by using one or more chain transfer agents selected from the group consisting of A-pinene, limonene and terpinolene, by copolymerizing radically polymerizable monomers essentially containing a radically polymerizable monomer having a carboxyl group The pressure sensitive adhesive composition and pressure sensitive adhesive sheet which were manufactured are disclosed.

Korean Laid-Open Patent Publication No. 2008-0113427 discloses thermally conductive decompression obtained by adding a flame retardant thermally conductive inorganic compound and expanded graphite powder to an adhesive and / or pressure-sensitive adhesive composition mainly containing one or more materials selected from rubber, elastomer and resin. An adhesive composition and a thermally conductive pressure-sensitive adhesive sheet-like molded article are disclosed.

As a kind of adhesive tape, the heat-sealing tape is mainly used for a metal material which is difficult to use the pressure-sensitive adhesive tape, and comprises a curing agent or an ultraviolet curing agent.

The prior art disclosed with respect to the heat-sealing tape containing such a curing agent is described below.

In Korean Patent No. 430626, a solution for an epoxy adhesive film containing 10 to 50% by weight of a curing agent obtained by microencapsulating a reaction product of an imidazole compound and an epoxy compound with a thermoplastic resin on a polyester film released by silicone resin Disclosed is a heat-sealed epoxy film characterized by coating onto a phase and a method for producing the same.

The above-mentioned pressure-sensitive adhesive tape is the adhesive tape most commonly used for the adhesion of materials. Recently, in order to realize a slim display and a wide display screen, high adhesion reliability is required even for a narrow adhesive surface, but a conventional pressure-sensitive adhesive tape has a problem in that it cannot satisfy such a condition due to the limitation of adhesion. In addition, the conventional heat-sealed tape including a curing agent has the advantage that can provide a high adhesive reliability, but there is a problem that can be used only when some or all of the adherend is a metal.

The present invention has been proposed to solve the problems of the prior art as described above, and can be used in various materials and fields. For example, a flange of an injection frame equipped with a window for protecting a display in an electronic device such as a mobile phone is narrow and thermally conductive. It is an object of the present invention to provide a sufficient bonding strength by introducing a heat-sealing tape even when the existing heat-sealing tape cannot be used due to a low degree, and to provide an excellent workability and high mass-produced heat-sealing tape and a method of manufacturing the same. .

In addition, the present invention is to introduce a release paper roll to a part or all of the heat-adhesive adhesive layer arranged on one side or both sides of the conductor, in particular the conductive aluminum foil (foil) to improve productivity, transportability, storage properties, joining workability An object of the present invention is to provide a heat-sealed tape and a method of manufacturing the same.

Furthermore, an object of the present invention is to provide a heat-sealed tape having a hollow portion formed in accordance with a shape of a junction portion of a bonding object, a shape of a junction portion of an electronic device, and more particularly, a shape of a frame portion of a mobile phone, and a method of manufacturing the same. .

In order to achieve the above object, the heat-sealed tape according to the present invention is

Conductors; And

A heat sealable adhesive layer arranged on one or both surfaces of the conductor;

It comprises a, the heat-adhesive adhesive layer is melted by the heating of the conductor when applying a high frequency.

In the heat-sealed tape according to the present invention, it is preferable that a release paper is attached to the heat-adhesive adhesive layer, and a hollow part is provided on the conductor and the heat-adhesive adhesive layer.

In addition, the manufacturing method of the heat-sealed tape according to the present invention is made by pressing a heat-sealing adhesive layer arranged on one side or both sides of the conductor.

In addition, the electronic device using the heat-sealed tape according to the present invention

First and second components requiring mutual bonding; And

And a heat-sealing tape including a first heat-adhesive adhesive layer in contact with the first component, a conductor in contact with the first heat-adhesive adhesive layer, and a second heat-adhesive adhesive layer in contact with the conductor and the second component. Done,

The conductive material is heated by applying a high frequency to melt the first and second heat-adhesive adhesive layers of the heat-sealed tape, thereby joining the first part and the second part.

Furthermore, in an electronic device using a heat sealing tape according to the present invention, a release paper is attached to the first or second heat sealing adhesive layer of the heat sealing tape, or both, and the first part is an injection frame, and the second It is preferable that a component is a window, and a hollow part is provided in the said conductor and the said heat-adhesive adhesive layer.

On the other hand, the bonding method of the electronic device using the heat-sealed tape according to the present invention

A first heat sealable adhesive layer contacting the first and second parts requiring mutual bonding with the first part, a conductor contacting the first heat sealable adhesive layer, and a second heat welding contact with the conductor and the second part Bond to each other using a heat-sealed tape consisting of a sex adhesive layer,

The conductor is heated by applying a high frequency to melt the first and second heat-adhesive adhesive layers of the heat-sealed tape to join the first and second parts.

In the bonding method of an electronic device using a heat-sealing tape according to the present invention, a release paper is attached to the first or second heat-sealing adhesive layer of the heat-sealing tape, or both of them, and the first row is attached to the first part. A first bonding step of applying and pressing high frequency in the state where the adhesive adhesive layer is in contact with each other, and then applying the high frequency in the state where the second part is in contact with the second heat adhesive adhesive layer, and then applying the high frequency It is preferable that the second bonding step to be bonded.

In addition, the bonding apparatus of the electronic device using the heat-sealing tape according to the present invention is the first and second components that need to be mutually bonded

Mutual bonding using a heat-sealing tape comprising a first heat-adhesive adhesive layer in contact with the first component, a conductor in contact with the first heat-adhesive adhesive layer, and a second heat-adhesive adhesive layer in contact with the conductor and the second component. To do that,

A high frequency generator having a coil for heating the conductor by applying a high frequency, a first or second heat sealable adhesive layer of the heat-sealed tape melted by the heated conductor, and a first part or a second And a pressurizing device for pressurizing the component.

In addition, the bonding method of the electronic device using the heat-sealed tape according to the present invention

The first and second parts requiring mutual bonding are bonded to each other using a heat-sealing tape composed of a first heat-adhesive adhesive layer in contact with the first part and a second heat-adhesive adhesive layer in contact with the second part.

The first component or the second component, or both of them, is provided with a conductor in contact with the first heat sealable adhesive layer or the second heat sealable adhesive layer, and heats the conductor by applying a high frequency wave. It is made by melting the first and second heat-sealing adhesive layer of the heat-sealing tape to join the first part and the second part,

Furthermore, a release paper is attached to the first or second heat-sealing adhesive layer of the heat-sealing tape, or both of them.

A first joining step of applying a high frequency to the first part in contact with the first heat-adhesive adhesive layer and pressing to join the first part, and then contacting the second part with the second heat-adhesive adhesive layer It is preferable that the second bonding step of applying a high frequency in the state and pressurized to be bonded to each other.

In addition, the bonding apparatus of the electronic device using the heat-sealing tape according to the present invention

To the first and second parts

For bonding to each other using a heat-sealed tape consisting of a first heat-adhesive adhesive layer in contact with the first part, a second heat-adhesive adhesive layer in contact with the second part,

The first component or the second component, or both of them, is provided with a conductor in contact with the first heat sealable adhesive layer or the second heat sealable adhesive layer,

A high frequency generator having a coil for heating the conductor by applying a high frequency, a first or second heat sealable adhesive layer of the heat-sealed tape melted by the heated conductor, and a first part or a second It comprises a pressurizing device for pressurizing the parts.

As described above, the heat-sealed tape and the manufacturing method thereof according to the present invention may be used in various materials and fields. For example, the flange of the injection frame having a window for protecting the display in an electronic device such as a mobile phone is narrow and has a thermal conductivity. Low heat-sealing tape can be used to provide sufficient bonding force even when the existing heat-sealing tape cannot be used, and it has excellent workability and high productivity, and heat arranged on one or both sides of the conductive aluminum foil. The release paper roll is introduced into a part or all of the adhesive adhesive layer to improve productivity, transportability, storage properties, and bonding workability. Furthermore, the shape of the bonded part of the object to be bonded is limited, and the shape of the bonded part of the electronic device is more limited. Workability can be improved by forming a hollow part in accordance with the shape of the frame joint portion of the telephone.

1 is a schematic view of a heat-sealed tape according to the present invention.

Figure 2 is a schematic diagram of a method for producing a thermal fusion tape according to the present invention.

Figure 3 is a schematic diagram of a heat-sealed tape for bonding of the insert injection mobile phone frame according to the present invention.

4 is a view related to the bonding of the frame and the window of the cellular phone according to the present invention;

5 is a view related to the joining of an insert injection cellular phone frame and a window according to the invention;

6 is a perspective view of a bonding apparatus for an electronic device using a heat-sealed tape according to the present invention.

Figure 7 is a schematic diagram relating to the bonding process using a bonding apparatus according to the present invention.

Hereinafter, the present invention will be described in detail with reference to the accompanying drawings.

Since the present invention may be modified in various ways and have various forms, embodiments (or embodiments) will be described in detail in the text. However, this is not intended to limit the present invention to the specific form disclosed, it should be understood to include all modifications, equivalents, and substitutes included in the spirit and scope of the present invention.

In each of the drawings, the same reference numerals, in particular, the tens and ones digits, or the same digits, tens, ones, and alphabets refer to members having the same or similar functions, and unless otherwise specified, each member in the figures The member referred to by the reference numeral may be regarded as a member conforming to these criteria.

In addition, in each drawing, the components are exaggerated in size or thickness (or thick) and in small (or thin) and simplified in consideration of the convenience of understanding and the like, thereby limiting the protection scope of the present invention. It should not be interpreted.

The terminology used herein is for the purpose of describing particular embodiments (suns, aspects, and embodiments) (or embodiments) only and is not intended to be limiting of the invention. Singular expressions include plural expressions unless the context clearly indicates otherwise. In this application, the terms “comprises” or “consists” are intended to indicate that there is a feature, number, step, action, component, part, or combination thereof described on the specification, but one or more other features. It is to be understood that the present invention does not exclude the possibility of the presence or the addition of numbers, steps, operations, components, parts, or combinations thereof.

Unless defined otherwise, all terms used herein, including technical or scientific terms, have the same meaning as commonly understood by one of ordinary skill in the art. Terms such as those defined in the commonly used dictionaries should be construed as having meanings consistent with the meanings in the context of the related art and shall not be construed in ideal or excessively formal meanings unless expressly defined in this application. Do not.

In the present specification, the first to the second and the second will only refer to different components, and are not limited to the order of manufacture, and their names in the detailed description of the invention and the claims. This may not match.

As shown in Fig. 1 ([a] is a cross-sectional view of bonding, [b] is an exploded perspective view of a release paper and a tape, and [c] is a perspective view of the bonding), the heat-sealed tape T of the present invention is a conductive aluminum foil at the center ( It has a structure in which the foil (T3) is arranged, and the heat-sealable adhesive layer (T1) (T2) is arranged on both sides thereof. However, if necessary, the embodiment in which the heat-adhesive adhesive layer is introduced only on one surface of the aluminum foil is not excluded.

In the present invention, the conductive aluminum foil (foil) is generated by the induction current (the law of Fleming's left-hand and Faraday's electromagnetic induction) when applying a frequency, especially high frequency, the price competitiveness, productivity, applicability and In consideration of the exothermic efficiency, the aluminum foil is preferably aluminum foil, and aluminum of high purity may be used, or aluminum intentionally containing other components or naturally containing impurities may be used. Alternatively, however, it may be replaced by a sheet made of a mixture of a metal such as copper, iron, SUS, or a conductive material (granular or powdery), in particular, a synthetic resin sheet.

When used for bonding frames and display protective windows in electronic devices, especially mobile phones, the thickness of such conductive foils, in particular aluminum foils, is preferably between 6 and 340 μm,

If the thickness is less than 6 μm, it is difficult to control the degree of heating when applying high frequency, which may cause carbonization or combustion problems, and it is not possible to appropriately control the heat-adhesive adhesive layer applied on both sides. There are,

In addition, when the thickness is greater than 340 μm, the amount of energy consumed for heat generation is unnecessarily increased when the product is manufactured with a heat-sealed tape, the deformation is difficult, and the workability is reduced, and the weight of the product increases, making management difficult. When the thickness exceeds 340 μm, it is hardly considered to be an aluminum foil or a thin plate, and it is difficult to produce a roll in the form of a plate.

On the other hand, the heat-sealing tape (T) according to the present invention is attached to the heat-adhesive adhesive layer (T1) (T2) on each of one side or both sides of the aluminum foil (T3).

The heat sealable adhesive layer (T1) (T2) is formed on the aluminum foil (T3) and is melted when applying a high frequency to serve to bond the material to be bonded, that is, the object to be bonded to each other.

In the present specification, the expression 'melt' in relation to the heat-adhesive adhesive layer is used to provide a constant adhesive force after the resin constituting the heat-adhesive adhesive layer is attached to the bonding object (or the adherend) by providing adhesion through a change in physical properties. Representing a series of processes,

Comprehensive terminology, including the concept of heating, calcining, or curing, should not be construed in a way that restricts the scope of protection of the present invention overly prevalent in conventional or conventional terms.

In the present invention, such a heat sealable adhesive layer may be made of, for example, a mixture of phenol and butadiene acrylonitrile rubber (NBR), and may be made of various other materials.

The heat sealable adhesive layer (T1) (T2) may be attached to both surfaces of the aluminum foil (T3) using the heat-sealing method, but is not limited thereto.

When used for bonding the frame and the display protection window in an electronic device, especially a mobile phone, the thickness of the heat sealable adhesive layer is, for example, preferably 10 to 300 μm, wherein the heat sealable adhesive layer has a thickness of less than 10 μm. In this case, it is not possible to provide high adhesion reliability, and when the thickness of the heat-adhesive adhesive layer is formed to exceed 300 μm, partial melting due to heat generated during high frequency application occurs, and thus the adhesion is not completely performed. When it exceeds 300 μm, workability and workability deteriorate, and problems such as low efficiency and high cost may occur. However, the thickness of the heat sealable adhesive layer may be variously selected depending on the type of the material and the bonding object.

Referring to the manufacturing method of the heat-sealed tape (T) according to the present invention for example.

The scope of the present invention is not limited by the following examples, in particular the specific thickness of the heat sealable adhesive layer and the aluminum foil is just one example.

Butadiene acrylonitrile rubber (NBR) was cut to a suitable size, for example less than 1 cubic centimeter, for proper mixing, then mixed with phenol and melted (other solvents available) and mixed.

The mixture of the phenol and butadiene acrylonitrile rubber mixed in this way was applied thinly on a moving paper using a discharge port (T Die) for spraying with heat. After applying the mixture on the release paper and dried at room temperature to form a heat sealable adhesive layer to a thickness of 20 ㎛.

Alternatively, a conventional coater may be used in consideration of the mass productivity of the heat sealable adhesive layer. The heat release adhesive layer is applied to the release paper while the release paper is continuously passed through the coater's knife, and then the oven is applied. It can be dried while passing to form a heat sealable adhesive layer.

Then, in order to laminate the heat-sealable adhesive layer applied on the release paper on both sides of the aluminum foil, the following method was used.

That is, the drum-shaped metal roller was heated to 80-130 degreeC or less. Between the heated rollers and the additional rollers for compression, an aluminum foil having a thickness of 18 μm and a heat-adhesive adhesive layer applied on the release paper were faced to each other so that the two materials melted by heat and pressure.

If necessary, the lamination of the heat-adhesive adhesive layer and the aluminum foil may be performed by applying only pressure without heating in consideration of productivity and safety.

After attaching the heat-adhesive adhesive layer applied on the release paper on one surface of the aluminum foil, the heat-adhesive adhesive layer applied on the opposite side of the product is further applied in the manner described above to apply the heat-adhesive adhesive layer on both sides. A heat fusion tape according to the present invention was prepared.

Furthermore, referring to Figure 2 will be described more comprehensively the manufacturing method of the heat-sealed tape (T) suitable for mass production as follows.

Heat-adhesive adhesive layer (T1) (T2) arranged on one or both sides of the conductive aluminum foil (T3) and the aluminum foil by pressurizing (or heating in parallel) by passing between the two rollers (R1) (R2) ).

In addition, in order to increase the mass productivity, a separate feed roller (Rc) (Ra) (Rb) in which aluminum foil (T3) and a heat-sealable adhesive layer (T1) (T2) are respectively wound in a sheet form is prepared. It is fed by unwinding continuously and passed through two rollers to press together.

If necessary, the two rollers are composed of a heating roller (R1) and a pressure roller (R2) to be laminated together by applying heat together with pressure, and then rolled up to the winding roller (R3) to mass-produce.

Also, if necessary, the first heat-adhesive adhesive layer may be attached to one surface of the aluminum foil, and the second heat-adhesive adhesive layer may be attached to the other surface of the aluminum foil at a time difference, and the release paper may also be manufactured from the supply roller. It can be supplied and attached to the first or second heat sealable adhesive layer, or both.

In addition, when a large amount of heat-sealed tape is required for the object to be bonded in a specific shape, it can be press punched or injection-molded according to the shape of the bonded part of the object to be bonded.

This process is performed while the aluminum foil (T3) and the heat sealable adhesive layer (T1) (T2) is attached,

The aluminum foil or the heat-sealable adhesive layer member, or both, may be preliminarily processed and heated and joined in a later step.

In the heat-sealed tape T shown in FIGS. 1B and 2C, aluminum foil T3 and heat-adhesive adhesive layer T1 and T2 are bonded to each other, and the shape of the joint portion of the bonding object is limited. It has a hollow part (Ta) in accordance with the shape of the junction part of the electronic device, more specifically, the frame junction part of the mobile phone.

The hollow part may be formed in various ways through a post-processing (punching, etc.) process before, during, or after lamination of the aluminum foil T3 and the heat sealable adhesive layer (T1) (T2).

The release paper T4 is coupled to the second heat sealable adhesive layer T2, and the release paper T4 has a through hole T4a for gripping, in particular, a hole T4a for jig insertion for workability. .

The release paper (T4) is used as is the release paper used in the process of producing a heat-adhesive adhesive layer before lamination with aluminum foil in the manufacturing method of the heat-sealed tape described above with respect to FIG.

If necessary, the release paper at the time of manufacturing the first heat-adhesive adhesive layer may be removed, and may be another separate release paper, particularly a light-transmissive release paper, which is later attached to the heat-adhesive adhesive layer.

The release paper T4 may be attached to a part or all of the heat sealable adhesive layer, and basically the release paper T4 serves to protect the heat sealable adhesive layer T1 and T2, and the high frequency heating for the bonding object. It is used after peeling in advance in the bonding process. Release paper in the present invention can be used to purchase a commercially available to suit the purpose.

The total thickness of the heat-sealed tape using the high frequency according to the present invention is preferably 26 to 500 μm except for the thickness of the release paper when used for bonding the frame and the display protection window in an electronic device, especially a mobile phone.

On the other hand, using the heat-sealing tape (T) according to the present invention can be used in the bonding process of the object to be bonded, specifically the electronic device, more specifically the mobile phone,

4, 6 and 7 show a process for joining the injection frame E1 for the mobile phone E and the window E2 for protecting the display E3 (see below in enlarged circle in FIG. 3). The bonding device B is shown.

As mentioned above, for this purpose, the heat-sealed tape T according to the present invention may be used after being processed in the same shape as that of the joint part of the injection frame E1, that is, the adhesive surface, and is processed (hollow part Ta). The bonding process may be performed by arranging the heat-sealed tape T having a heat-sealing tape T on a portion to which the screen protection injection frame E1 is to be bonded on the display, that is, the flange E1a, which is a bonding portion, and applying a high frequency wave.

The heat-sealed tape T according to the present invention, unlike a heat-sealed tape including a conventional curing agent or ultraviolet curing agent, generates heat to the aluminum foil T3 by applying a high frequency in the bonding process to heat-bond the adhesive layer T1 ( It is used in the bonding process by melting T2).

The bonding process using the heat-sealing tape using the high frequency of the present invention may be performed by applying a high frequency in the range of 10 to 1000 kHz, but is not limited thereto. Therefore, the protection range should be interpreted even when various frequency bands are applied.

When described in more detail with reference to Figure 6 and Figure 7 the bonding method and a bonding apparatus using the heat-sealed tape according to the present invention. The following description will be described with reference to electronic devices, in particular mobile phones, but the present invention can be applied to various bonding objects.

First, as shown in Figure 6, the bonding device (B) consists of a high frequency generator (B1) and the pressurizing device (B2), the high frequency generator (B1) is a high frequency generating coil (B1a) (or work coil) The coil has a shape similar to the shape of the joint, that is, the flange E1a of the frame E1.

In addition, the pressurizing device B2 presses the support frame B2c on which the electronic device, in particular, the frame E1 of the cellular phone E is placed, and presses the frame E1 and the window E2 positioned on the support frame. And a pressure plate B2a, which is connected to a plunger B2b which is mechanically operated by pneumatic, hydraulic pressure, or a motor. The size and shape of the pressure plate should be the same as the joint portion of at least two joining objects, and may be variously modified in consideration of manufacturing convenience.

In addition, the lower portion of the support frame (B2c) is a manual means consisting of a level gauge (both analog type or digital type) and a manual lifting means (screw, hydraulic or pneumatic cylinder, etc.), a horizontal sensor and a lifting means (electric plunger) Etc.) may be provided with a horizontal adjusting means (B2d) consisting of automatic means consisting of.

The horizontal adjusting means helps to increase the bonding quality by allowing the pressure by the pressure plate of the pressure device to be uniformly transmitted throughout the bonding object and the heat-sealing tape.

Furthermore, the bonding apparatus B according to the present invention may perform cooling means (air cooling or water cooling, etc.) for forced cooling of some or all of the high frequency generator B1, the pressure plate B2a, and the electronic device E.

6, the cooling means B3 for the high frequency generator B1 is provided with the water tank B3a, the cooling water circulation pump B3b, and the circulation pipe B3c. In addition, the circulation pipe (B3c) is extended to the lower side of the support frame (B2c) of the pressurizing device (B2) to enable the cooling of the frame placed on the support frame, pump (B3b) or solenoid provided on the circulation pipe It is preferable to allow the cooling water to circulate after the heat-bonding adhesive layer melt bonding by high frequency application by controlling on / off of the valve B3d or both.

The heat-sealed resin for the heat-adhesive adhesive layer (T1) (T2) of the heat-sealing tape (T) according to the present invention is generally a resin that generates adhesive force by heat and pressure, and melts by heat without chemical change to generate adhesive force. The thermosetting resin of the thermoplastic resin system, and the thermosetting resin which hardens by the action of the curing agent contained in the resin when heat is applied to generate an adhesive force,

Considering the product characteristics of electronic devices, especially mobile phones, thermosetting resins can be used, or thermoplastic resins (which can be relatively low-temperature fused, so there is little problem of damage to the adherend).

Referring to the rough bonding process, first, when the high frequency generated from the high frequency generator B1 is transferred to the conductive aluminum foil T3 of the heat-sealed tape T through the coil B1a, the induced current (Fleming's left-hand law and By the principle of Faraday's electromagnetic induction), aluminum foil generates heat (joint law), and this heat melts the heat-sealable adhesive layer (T1) (T2) to form a joining object, that is, a frame, which is the first part of the mobile phone (E). The flange E1a of E1 is joined to the outer part of the window E2 which is the second component. At this time, the pressurized state of the pressurizing device (B2) is preferably maintained for a certain time again through the melting process of the heat-sealable adhesive layer from the initial bonding, to ensure the time to stabilize the adhesive resin is cured.

Looking at the bonding process in more detail, as shown in Figure 1 [b] and 6, the heat-sealed tape (T) has a hollow (Ta), the jig (2) in the second heat-adhesive adhesive layer (T2) J, see Fig. 7 and 6) Release paper (T4) formed with a through hole (T4a) for fixing, in particular, a light-transmissive release paper for bonding position confirmation by the naked eye is combined.

The heat-sealing tape T is seated on the flange E1a of the frame E1, which is the first part placed on the support frame B2c (with the jig J) of the pressurizing device B2, and the plunger B2b. ) Is lowered and pressed by the pressure plate B2a so that the first heat-adhesive adhesive layer T1 of the heat-sealing tape T is brought into close contact with the flange E1a of the frame E1, and the high frequency is applied. The frame E1a, which is one component, is subjected to a first joining step such that the frame E1a is bonded to the first heat sealable adhesive layer T1.

Then, the pressing plate B2a of the pressurizing device B2 is lifted up and the release paper T4 is removed. Then, the second part of the window E2 is seated on the flange E1a of the frame E1 so that the edge of the window is second row. In contact with the adhesive adhesive layer T2

The pressure plate B2a is lowered again so that the edge of the window E2 is in close contact with the second heat-adhesive adhesive layer T2, and high frequency is applied again to bond the second component window and the second heat-adhesive adhesive layer to each other. The second joining step is performed.

Looking at the bonding method of the electronic device using the heat-sealed tape according to the present invention comprising the first and second bonding step in more detail as follows.

The first bonding step is a form in which release paper is attached to the first heat sealable adhesive layer (not shown) while leaving the release paper T4 in the second heat sealable adhesive layer T2 of the heat sealing tape according to the present invention. This release paper should be removed before the ramen operation.)

The first thermally adhesive adhesive layer T2 having no release paper is first attached to an adherend (especially an electronic device, that is, a flange of an injection frame of a mobile phone).

The purpose of the first bonding step is to accurately fix the heat-sealing tape and to remove the release paper, and the adhesive force expressed at this time is lower than that of the final second bonding step, so that the frame as an adherend when removing the release paper (E1) ) And the heat-sealing tape (T) is enough to not be separated from each other, so it corresponds to a kind of 'temporary bonding' step.

The reason why the release paper T4 is left in the second heat-adhesive adhesive layer T2 is that when both release papers are removed, only the heat-sealing tape T having a hollow portion Ta (in the form of a thin strip) remains. This is because it is difficult to maintain the circular shape in the bonding process, so that defects are likely to occur.

In the first bonding step, the heat-sealing tape T on which the release paper T4 is not removed is placed on the offset flange E1a of the frame E1, which is the first component of the mobile phone, which is the electronic device E. When the high frequency generator B1 is operated by pressing the pressure plate B2a of the pressurizing device B2 and applying high pressure to the work coil B1a, the high frequency flowing to the work coil generates a low frequency wave.

The electromagnetic wave is induced to the metal layer in the heat-sealing tape T, that is, the conductive aluminum foil T3, to generate a current.

The induced current causes heat generation by generating resistance to a metal material (mainly surface-oriented). The heat-conducting conductive aluminum foil (T3) melts the heat-sealing resin forming a heat-sealable adhesive layer to make it sticky.

At this time, the natural adhesive strength of the heat-sealed tape (T) is expressed, and when the high frequency supply is stopped, the heat generation is stopped, and when the heat generation is stopped, the remaining heat (remaining heat) is divided with the frame E1 as the adherend and cooled. If necessary, a separate cooling device may be required to increase productivity).

The pressing plate B2a of the pressurizing device B2 is kept in a pressed state for several seconds to be cooled in this way, and the pressing plate is raised at a time when sufficient cooling is performed.

After finishing the first bonding step, the release paper (T4) can be easily peeled off. This is because the adhesive force between the first heat-adhesive adhesive layer T10 and the frame E1 is greater than the adhesive force between the second heat-adhesive adhesive layer T2 and the release paper T4, which is inherent in the release paper.

Next, the second joining step is a process corresponding to a kind of 'main joining' step because the final bonding of the thermal fusion tape and the joining object is perfectly completed.

After the release paper T4 attached to the second adhesive layer is removed, the second component is brought into contact with the second adhesive layer, and the output of the high frequency generator B1 is increased or the high frequency application time is increased in the first bonding step. In order to increase the heating time by increasing the elongation, and when forming a heat-sealable adhesive layer of the thermosetting resin to activate the curing agent to cure at about 160 ℃.

In this way, more precise and powerful bonding is possible through the first and second bonding steps.

The specific second bonding step is to contact the second adherend window E2 (using acrylic or tempered glass) with the second heat-adhesive adhesive layer T2 of the heat-sealed tape T from which the release paper T4 is removed. In the state, the pressurizing device B2 is operated to pressurize the pressurizing plate B2a, and then the high frequency generator B1 is operated to flow high frequency to the work coil B1a to conduct the conductive aluminum foil T3 of the heat-sealed tape T. Heat).

When the high frequency supply is stopped after a certain time, the heat generated from the aluminum foil T3 of the heat-sealed tape is partially absorbed by both adherents E1 and E2, and is cooled. After sufficiently cooling, the pressed plate is released.

In this case, if necessary, a separate cooling device may be necessary to increase productivity.

As described above, in the case of using the heat-sealed tape using high frequency according to the present invention, experiments show that high adhesion reliability can be obtained by providing high adhesion reliability even on narrow contact surfaces such as display screen protection frames of electronic devices, especially mobile phones. I could see through. While the pressure sensitive adhesive tape (Pressure Sensitive Adhesive), commonly known as tape, is 5 to 10 kgf / cm 2 in the dynamic SHEAR test process, the shear adhesive strength of the heat-sealed tape using high frequency according to the present invention is It stably showed about 50kgf / ㎠. It also has no ESD issues and does not affect windows with touchpad characteristics.

In addition, the electronic device manufactured according to the heat-sealing tape according to the present invention and the method for joining the electronic device using the same, basically the first and second parts that need to be mutually bonded, and the heat-sealed between the first and second parts Tapes,

The heat-sealing tape is a first heat-sealable adhesive layer in contact with the first part, an aluminum foil in contact with the first heat-adhesive adhesive layer, and a second heat-sealable adhesive layer in contact with the aluminum foil and the second part. Is done.

In addition, since it is manufactured according to the bonding apparatus and the bonding method described above, the aluminum foil is heated by applying a high frequency to melt the first and second heat-sealing adhesive layers of the heat-sealing tape to bond the first and second parts. do.

When applied to a mobile phone among electronic devices, as shown in FIG. 4, the first heat sealability of the flange E1a of the frame E1, which is the first component of the mobile phone E, and the heat-sealed tape T The window E2, which is bonded to the adhesive layer T1 and protects the display E3, is in contact with the second heat-adhesive adhesive layer T2 of the heat-sealed tape T.

Between the two heat-adhesive adhesive layers T1 and T2, a conductive foil heated by high frequency, in particular an aluminum foil T3, is located. In the lower enlarged circle of FIG. 4, unexplained reference numeral 'E4' is a buffer pad E4 for protecting the display E3.

In recent years, mobile devices have increased the need for providing a larger display while increasing the usability by keeping up with the trend of light and short, and providing a borderless display with almost no border in terms of design.

The frame E1 is made as small as possible while the display E3 is enlarged. Thus, when the window E2 for display protection is mounted on the flange E1a of the frame, the width of the flange serving as a bezel is very narrow. There is an increasing need for tapes that provide stronger adhesion, and the technique according to the present invention is able to provide optimal adhesion that meets this trend.

First of all, in order to melt the heat-sealable adhesive layer by applying heat to the existing heat-sealed tape, at least one of the two objects to be bonded must be provided with a high thermal conductivity member, particularly a metal member, at the joint.

In the reality of increasing the tendency to manufacture products only with synthetic resins in order to increase mass production, lower manufacturing costs, and achieve lighter weight.

Existing simple heat-sealing tape can not be applied to such a pure synthetic resin product, the heat-sealing tape (T) with a conductive aluminum foil (T3) according to the present invention does not have this problem.

Meanwhile, the high frequency bonding method and the bonding apparatus according to the present invention can be applied to the insert injection frame of the electronic device.

As shown in FIG. 5, the insert injection frame of an electronic device, especially a mobile phone, has a flange E1a as a conductor C (especially a SUS material), and the other body part is made of a synthetic resin (for example, a PC). Material).

When the window is also attached to such a frame, it is preferable to utilize the bonding apparatus B using the high frequency generator B1 according to the present invention.

In particular, in the case of joining two parts simply by using an adhesive, labor and training costs are likely to be burdened because it requires high skill of the operator to reduce the defect rate due to problems due to the flow characteristics of the adhesive.

In addition, as mentioned above, in order to solve the conflict between the necessity of light and small size reduction of electronic devices and the demand for the introduction of large display, it is necessary to ensure sufficient adhesion while coping with the tendency that the overlapping area of two parts to be joined is narrowed.

In the case of the window of the cellular phone E, the buffer pad E4 must be hidden in addition to the flange E1a of the frame E1, so that the translucent (especially transparent) window is provided with the flange E1a by introducing the printing unit E2a at the edge. The pad E4 should be hidden, and no damage should occur to such a print due to the adhesive means.

In addition, in the case of using the existing heat-sealing tape as an adhesive means, a problem may arise in the bonding state between the metal part of the insert-injected frame and the contact part of the synthetic resin body during the heating process for melting the adhesive resin. Regarding the conventional adhesive means, pressure sensitive double-sided adhesive tape (Pressure Sensitive Adhesive), adhesive (bond), heat-sealed tape has a disadvantage.

In order to solve this problem, the present invention may utilize the aforementioned high frequency bonding method and its bonding apparatus.

The method involves first and second parts requiring inter-bonding, namely insert injection frame E1 and window E2 as can be seen in FIG.

As shown in FIG. 3, the bonding is performed using a heat-sealing tape T ′ having first and second heat-adhesive adhesive layers T1 and T2 on both surfaces thereof. In FIG. 3, a base layer T3a is provided between two heat-adhesive adhesive layers T1 and T2, which may be made of a nonwoven fabric or other fabric, or various synthetic resins. However, as described above without the base layer, a heat fusion tape composed of a single heat fusion adhesive layer produced through a coater or a T-die may be employed.

The first component or the second component, or both, should be provided with a conductor at the contact portion with the first heat sealable adhesive layer or the second heat sealable adhesive layer. In the case of the inner flange (E1a) is made of metal, patent SUS material.

As shown in FIG. 3 ([a] is a cross-sectional view, [b] is an exploded perspective view of a release paper and a tape, [c] is a perspective view of the bonding), FIGS. 5, 6 and 7, the specific bonding method is as follows. Same as

The heat-sealed tape T 'also has a hollow portion Ta in accordance with the shape of the flange E1a, and a release paper T4 having a through hole T4a formed therein for fixing the jig in the second heat-adhesive adhesive layer T2, In particular, the light-transmissive release paper is combined to check the bonding position with the naked eye.

The heat-sealed tape T 'is seated on the flange E1a of the frame E1, which is a first part placed on the support frame B2c of the pressurizing device B2, and the plunger B2b is lowered to press the plate ( B2a) to apply the high frequency to the conductor C in a state where the first heat-adhesive adhesive layer T1 of the heat-sealing tape T 'is brought into close contact with the flange E1a of the frame E1. The frame E1a is subjected to a first bonding step such that the frame E1a is bonded to the first heat sealable adhesive layer T1.

Then, the pressing plate B2a of the pressurizing device B2 is lifted and the release paper T4 is removed. Then, the second part of the window E2 is seated on the flange E1a of the frame E1, thereby printing the edge of the window. In the state where E2a) is in contact with the second heat-adhesive adhesive layer T2, the pressure plate B2a is lowered again so that the edge of the window E2 is in close contact with the second heat-adhesive adhesive layer T2. Is subjected to a second bonding step of bonding the second component window and the second heat-adhesive adhesive layer to each other.

Through this process, it is possible to solve the problem of damage to the printing part in the melting process of the heat-sealed resin by simple heating, the problem of product failure when using the liquid adhesive, the problem caused by the narrow overlapping part of the two parts, and the problem of low adhesion. Can be.

In the above description, the conventionally known techniques related to the types of the heat-sealing resin, the specific types of the release paper and the release agent, the specific specifications of the high frequency generator, etc. are omitted, but those skilled in the art can easily infer, infer, and reproduce them.

In addition, in the above description of the present invention with reference to the accompanying drawings, the object (or the adherend), the shape of the heat-sealed tape, the pressurizing equipment, etc. have been described mainly limited to the bar, but the present invention various modifications by those skilled in the art , Modifications and substitutions are possible, and such modifications, changes and substitutions should be interpreted as falling within the protection scope of the present invention.

Claims

Conductors; And

A heat sealable adhesive layer arranged on one or both surfaces of the conductor;

Including but not limited to,

The aluminum foil and the heat sealable adhesive layer is provided with a hollow portion,

A heat-sealing tape in which a heat-sealable adhesive layer is melted by heating the aluminum foil at high frequency.
The method of claim 1,

And a release paper is attached to the heat sealable adhesive layer.
The method of claim 2,

The release paper is a heat-sealed tape, characterized in that the through hole is formed for fixing the jig.
Press between the two rollers

Laminating the aluminum foil (foil), and the heat-adhesive adhesive layer provided on one side or both sides of the aluminum foil,

And a hollow portion is formed in the aluminum foil and the heat sealable adhesive layer.
First and second components requiring mutual bonding; And

And a heat-sealing tape including a first heat-adhesive adhesive layer in contact with the first component, a conductor in contact with the first heat-adhesive adhesive layer, and a second heat-adhesive adhesive layer in contact with the conductor and the second component. Done,

The aluminum foil and the first and second adhesive layers are provided with a hollow portion,

An electronic device using a heat fusion tape manufactured by bonding a first part and a second part by heating the conductor by applying a high frequency to melt the first and second heat fusion adhesive layers of the heat fusion tape.
The method of claim 1,

Electronic paper using a heat-sealed tape, characterized in that the release paper is attached to the first or second heat-sealed adhesive layer of the heat-sealed tape, or both.
The method according to claim 5 or 6,

And said first part is an injection frame, and said second part is a window.
To the first and second parts

A first heat sealable adhesive layer in contact with the first part, a conductor in contact with the first heat sealable adhesive layer, a second heat sealable adhesive layer in contact with the conductor and the second part, and a release paper attached to the second adhesive layer In the joining method formed by bonding to each other using a heat-sealed tape comprising a,

A first joining step of applying a high frequency through a high frequency generator and pressing the first adhesive layer to the first component to contact the first adhesive layer;

Removing the release paper attached to the second adhesive layer;

In the state in which the second part is in contact with the second adhesive layer, a high frequency is applied and pressurized, but the heating time is increased by increasing the output of the high frequency generator or increasing the high frequency application time in the first bonding step. Bonding method of an electronic device using a heat-sealed tape, characterized in that the second bonding step.
To the first and second parts

In the mutual bonding using a heat-sealing tape comprising a first adhesive layer in contact with the first component, a second adhesive layer in contact with the second component, and a release paper attached to the second adhesive layer,

The first component or the second component, or both of them, is provided with a conductor at a contact portion with the first adhesive layer or the second adhesive layer, and a high frequency is applied to heat the conductor to form the heat-sealed tape. The first part and the second part are joined by melting the first and second adhesive layers,

A first joining step of applying a high frequency through a high frequency generator and pressing the first adhesive layer to the first component to contact the first adhesive layer;

Removing the release paper attached to the second adhesive layer;

In the state in which the second part is in contact with the second adhesive layer, a high frequency is applied and pressurized, but the heating time is increased by increasing the output of the high frequency generator or increasing the high frequency application time in the first bonding step. Bonding method of an electronic device using a heat-sealed tape, characterized in that the second bonding step.
The method according to claim 8 or 9,

The release paper attached to the second adhesive layer in the heat-sealed tape is a joining method of the electronic device using a heat-sealed tape, characterized in that a through hole is formed for fixing the jig.
The method according to claim 8 or 9,

In the heat-sealed tape

The first adhesive layer, the conductor, the second adhesive layer, or the first adhesive layer and the second adhesive layer

Joining method of an electronic device using a heat-sealed tape, characterized in that the hollow portion is formed.
To the first and second parts

For bonding to each other using a heat-sealed tape consisting of a first adhesive layer in contact with the first component, a second adhesive layer in contact with the second component,

The first component or the second component, or both, is provided with a conductor at the contact portion with the first adhesive layer or the second adhesive layer,

A conductor is provided between the first and second adhesive layers of the heat-sealed tape,

A high frequency generator having a coil for heating the conductor by applying a high frequency;

It comprises a pressurizing device for pressurizing the first or second adhesive layer and the first component or the second component of the heat-sealed tape melted by the heated conductor,

The pressurizing device includes a support frame in which a first or second part is placed in a lower part, a pressure plate connected to a plunger to press the first or second part placed in the support frame, and a lifting device provided in the lower part of the support frame. Joining device for an electronic device using a heat-sealing tape, characterized in that the horizontal adjusting means consisting of a means and a horizontal system.