WO2011008039A3 - Hot melt adhesive tape and a production method therefor, a method for connecting electronic equipment using the same and a connecting device therefor, and electronic equipment of this type - Google Patents

Hot melt adhesive tape and a production method therefor, a method for connecting electronic equipment using the same and a connecting device therefor, and electronic equipment of this type Download PDF

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Publication number
WO2011008039A3
WO2011008039A3 PCT/KR2010/004630 KR2010004630W WO2011008039A3 WO 2011008039 A3 WO2011008039 A3 WO 2011008039A3 KR 2010004630 W KR2010004630 W KR 2010004630W WO 2011008039 A3 WO2011008039 A3 WO 2011008039A3
Authority
WO
WIPO (PCT)
Prior art keywords
electronic equipment
adhesive tape
hot
therefor
production method
Prior art date
Application number
PCT/KR2010/004630
Other languages
French (fr)
Korean (ko)
Other versions
WO2011008039A2 (en
Inventor
박성식
정묘선
Original Assignee
(주)새티스
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from KR1020100041298A external-priority patent/KR20110007569A/en
Application filed by (주)새티스 filed Critical (주)새티스
Publication of WO2011008039A2 publication Critical patent/WO2011008039A2/en
Publication of WO2011008039A3 publication Critical patent/WO2011008039A3/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B3/00—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar form; Layered products having particular features of form
    • B32B3/26—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar form; Layered products having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer
    • B32B3/266—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar form; Layered products having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer characterised by an apertured layer, the apertures going through the whole thickness of the layer, e.g. expanded metal, perforated layer, slit layer regular cells B32B3/12
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
    • C09J5/06—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers involving heating of the applied adhesive
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/28—Metal sheet
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
    • B32B2307/202—Conductive
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/30—Properties of the layers or laminate having particular thermal properties
    • B32B2307/31—Heat sealable
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2405/00—Adhesive articles, e.g. adhesive tapes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/10—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
    • C09J2301/12—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers
    • C09J2301/124—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers the adhesive layer being present on both sides of the carrier, e.g. double-sided adhesive tape
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/304—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive being heat-activatable, i.e. not tacky at temperatures inferior to 30°C
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
    • C09J2301/416—Additional features of adhesives in the form of films or foils characterized by the presence of essential components use of irradiation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00013—Fully indexed content

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)

Abstract

The present invention relates to: a hot melt adhesive tape which can be used on diverse materials and can provide high adhesion reliability, and which can be melted and adhered by means of a frequency and particularly high-frequency waves; and a production method therefor. More specifically, it relates to: an adhesive tape in which a hot-melting adhesive layer is provided with an electrically conductive body and in particular conductive aluminium foil, and which provides an adhesive force when the hot-melting layer is melted by heating the electrically conductive body on applying a high frequency; and a production method therefor. The hot-melt adhesive tape according to the present invention comprises: an electrically conductive body; and a hot-melting adhesive layer disposed on one surface or both surfaces of the aluminium foil.
PCT/KR2010/004630 2009-07-16 2010-07-16 Hot melt adhesive tape and a production method therefor, a method for connecting electronic equipment using the same and a connecting device therefor, and electronic equipment of this type WO2011008039A2 (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
KR10-2009-0065110 2009-07-16
KR20090065110 2009-07-16
KR1020100041298A KR20110007569A (en) 2009-07-16 2010-05-03 Hot melt tape and manufacturing method for the same, manufacturing method for electronic equipment using hot melt tape and bonding apparatus for the same, and electronic equipment using hot melt tape
KR10-2010-0041298 2010-05-03

Publications (2)

Publication Number Publication Date
WO2011008039A2 WO2011008039A2 (en) 2011-01-20
WO2011008039A3 true WO2011008039A3 (en) 2011-06-16

Family

ID=43449983

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2010/004630 WO2011008039A2 (en) 2009-07-16 2010-07-16 Hot melt adhesive tape and a production method therefor, a method for connecting electronic equipment using the same and a connecting device therefor, and electronic equipment of this type

Country Status (1)

Country Link
WO (1) WO2011008039A2 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105398180A (en) * 2015-10-20 2016-03-16 薛敬哲 Corrugated board production method and apparatus thereof
CN107512067A (en) * 2017-07-31 2017-12-26 平湖市新保纺织科技有限公司 A kind of new-type heat-melting compounding machine

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4499145A (en) * 1982-04-19 1985-02-12 Sumitomo Bakelite Company Limited Metal-clad laminate and process for producing the same
JP2001262085A (en) * 2000-03-15 2001-09-26 Konishi Co Ltd Induction heating adhesive sheet
JP2002371253A (en) * 2001-06-15 2002-12-26 Konishi Co Ltd Induction heating adhesive tape
US20040241402A1 (en) * 2001-08-08 2004-12-02 Kohichiro Kawate Batch electrically connecting sheet
EP1548081A2 (en) * 1998-03-17 2005-06-29 Ameritherm, Inc. RF active compositions for use in adhesion, bonding and coating
KR20050113937A (en) * 2004-05-31 2005-12-05 주식회사 엘지화학 Adhesive radiation sheet

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4499145A (en) * 1982-04-19 1985-02-12 Sumitomo Bakelite Company Limited Metal-clad laminate and process for producing the same
EP1548081A2 (en) * 1998-03-17 2005-06-29 Ameritherm, Inc. RF active compositions for use in adhesion, bonding and coating
JP2001262085A (en) * 2000-03-15 2001-09-26 Konishi Co Ltd Induction heating adhesive sheet
JP2002371253A (en) * 2001-06-15 2002-12-26 Konishi Co Ltd Induction heating adhesive tape
US20040241402A1 (en) * 2001-08-08 2004-12-02 Kohichiro Kawate Batch electrically connecting sheet
KR20050113937A (en) * 2004-05-31 2005-12-05 주식회사 엘지화학 Adhesive radiation sheet

Also Published As

Publication number Publication date
WO2011008039A2 (en) 2011-01-20

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