WO2011030277A3 - Rfic interfaces and millimeter-wave structures - Google Patents

Rfic interfaces and millimeter-wave structures Download PDF

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Publication number
WO2011030277A3
WO2011030277A3 PCT/IB2010/054004 IB2010054004W WO2011030277A3 WO 2011030277 A3 WO2011030277 A3 WO 2011030277A3 IB 2010054004 W IB2010054004 W IB 2010054004W WO 2011030277 A3 WO2011030277 A3 WO 2011030277A3
Authority
WO
WIPO (PCT)
Prior art keywords
millimeter
interfaces
wave
pcb
printed
Prior art date
Application number
PCT/IB2010/054004
Other languages
French (fr)
Other versions
WO2011030277A2 (en
Inventor
Yigal Leiba
Elad Dayan
Baruch Schwarz
Amir Shmuel
Yonatan Biran
Original Assignee
Yigal Leiba
Elad Dayan
Baruch Schwarz
Amir Shmuel
Yonatan Biran
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US12/554,987 external-priority patent/US8912858B2/en
Priority claimed from US12/791,936 external-priority patent/US8536954B2/en
Application filed by Yigal Leiba, Elad Dayan, Baruch Schwarz, Amir Shmuel, Yonatan Biran filed Critical Yigal Leiba
Priority to DE112010003585T priority Critical patent/DE112010003585T5/en
Publication of WO2011030277A2 publication Critical patent/WO2011030277A2/en
Publication of WO2011030277A3 publication Critical patent/WO2011030277A3/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P5/00—Coupling devices of the waveguide type
    • H01P5/08—Coupling devices of the waveguide type for linking dissimilar lines or devices
    • H01P5/10—Coupling devices of the waveguide type for linking dissimilar lines or devices for coupling balanced with unbalanced lines or devices
    • H01P5/107—Hollow-waveguide/strip-line transitions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P5/00—Coupling devices of the waveguide type
    • H01P5/02—Coupling devices of the waveguide type with invariable factor of coupling
    • H01P5/022—Transitions between lines of the same kind and shape, but with different dimensions
    • H01P5/028—Transitions between lines of the same kind and shape, but with different dimensions between strip lines
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q9/00—Electrically-short antennas having dimensions not more than twice the operating wavelength and consisting of conductive active radiating elements
    • H01Q9/04—Resonant antennas
    • H01Q9/0485—Dielectric resonator antennas
    • H01Q9/0492—Dielectric resonator antennas circularly polarised
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors

Abstract

Systems and methods for waveguides comprising laminate structure, waveguide- backshorts comprising a printed conducting layer, millimeter-wave chip packaging and interfaces, low-loss millimeter-wave interfaces comprising a bare-die, and methods for constructing millimeter-wave laminate structures and chip interfaces. One exemplary embodiment for injecting and guiding millimeter- waves through a Printed Circuit Board (PCB) including at least two laminas belonging to a PCB, an electrically conductive plating applied on the insulating walls of a cavity formed perpendicularly through the laminas, and optionally a probe located above the cavity printed on a lamina belonging to the PCB.
PCT/IB2010/054004 2009-09-08 2010-09-07 Rfic interfaces and millimeter-wave structures WO2011030277A2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE112010003585T DE112010003585T5 (en) 2009-09-08 2010-09-07 RFIC INTERFACES AND MILLIMETER SHAFT STRUCTURES

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
US12/554,987 2009-09-08
US12/554,987 US8912858B2 (en) 2009-09-08 2009-09-08 Interfacing between an integrated circuit and a waveguide through a cavity located in a soft laminate
US12/791,936 2010-06-02
US12/791,936 US8536954B2 (en) 2010-06-02 2010-06-02 Millimeter wave multi-layer packaging including an RFIC cavity and a radiating cavity therein
US38021710P 2010-09-04 2010-09-04
US61/380,217 2010-09-04

Publications (2)

Publication Number Publication Date
WO2011030277A2 WO2011030277A2 (en) 2011-03-17
WO2011030277A3 true WO2011030277A3 (en) 2011-06-09

Family

ID=43732882

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/IB2010/054004 WO2011030277A2 (en) 2009-09-08 2010-09-07 Rfic interfaces and millimeter-wave structures

Country Status (2)

Country Link
DE (1) DE112010003585T5 (en)
WO (1) WO2011030277A2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103597658A (en) * 2011-07-04 2014-02-19 华为技术有限公司 Module and coupling arrangement

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8536954B2 (en) 2010-06-02 2013-09-17 Siklu Communication ltd. Millimeter wave multi-layer packaging including an RFIC cavity and a radiating cavity therein
US8912858B2 (en) 2009-09-08 2014-12-16 Siklu Communication ltd. Interfacing between an integrated circuit and a waveguide through a cavity located in a soft laminate
CN103650235B (en) * 2011-07-04 2015-03-25 华为技术有限公司 Coupling arrangement
DE102012203293B4 (en) * 2012-03-02 2021-12-02 Robert Bosch Gmbh Semiconductor module with integrated waveguide for radar signals
US9356352B2 (en) 2012-10-22 2016-05-31 Texas Instruments Incorporated Waveguide coupler
DE102015202872A1 (en) * 2015-02-18 2016-08-18 Robert Bosch Gmbh Apparatus and method for transmitting a radio frequency signal
FR3062525B1 (en) * 2017-02-01 2020-11-20 Inst Vedecom SLOTTED ANTENNA INTEGRATED IN A PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME
EP3492881B1 (en) * 2017-12-04 2020-02-26 VEGA Grieshaber KG Printed circuit board for use in a radar fill level measuring device with hollow wire coupling
CN112701092A (en) * 2020-12-24 2021-04-23 北京国联万众半导体科技有限公司 Millimeter wave monolithic integrated circuit packaging structure and packaging method thereof

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US3255408A (en) * 1963-02-25 1966-06-07 Beloit Corp Instrument for measuring moisture content and the like
US5384557A (en) * 1992-11-10 1995-01-24 Sony Corporation Polarization separator and waveguide-microstrip line mode transformer for microwave apparatus
US5475394A (en) * 1991-01-30 1995-12-12 Comsat Corporation Waveguide transition for flat plate antenna
US6320543B1 (en) * 1999-03-24 2001-11-20 Nec Corporation Microwave and millimeter wave circuit apparatus
US6359590B2 (en) * 2000-05-26 2002-03-19 Kyocera Corporation Antenna feeder line, and antenna module provided with the antenna feeder line
US20030012006A1 (en) * 2001-07-11 2003-01-16 Silverman Lawrence H. Pocket mounted chip having microstrip line
US6572955B2 (en) * 2000-04-27 2003-06-03 Kyocera Corporation Ceramics having excellent high-frequency characteristics and method of producing the same
US6573808B1 (en) * 1999-03-12 2003-06-03 Harris Broadband Wireless Access, Inc. Millimeter wave front end
US6608535B2 (en) * 2000-04-13 2003-08-19 Raytheon Company Suspended transmission line with embedded signal channeling device
US20040041657A1 (en) * 2000-12-04 2004-03-04 Peter Paakkonen Directional coupler, antenna interface unit and radio base station having an antenna interface unit
US20040145426A1 (en) * 2002-07-13 2004-07-29 Ke-Li Wu Waveguide to laminated waveguide transition and methodology
US6822528B2 (en) * 2001-10-11 2004-11-23 Fujitsu Limited Transmission line to waveguide transition including antenna patch and ground ring
US20050024166A1 (en) * 2002-03-05 2005-02-03 Xytrans, Inc. Millimeter wave (MMW) radio frequency transceiver module and method of forming same
US20060256016A1 (en) * 2005-03-17 2006-11-16 Ke-Li Wu Integrated LTCC mm-wave planar array antenna with low loss feeding network
US20070085626A1 (en) * 2005-10-19 2007-04-19 Hong Yeol Lee Millimeter-wave band broadband microstrip-waveguide transition apparatus
US20070109070A1 (en) * 2005-11-14 2007-05-17 Honeywell International Inc. Monolithic microwave integrated circuit providing power dividing and power monitoring functionality
US20090207090A1 (en) * 2007-06-22 2009-08-20 Vubiq Incorporated Integrated antenna and chip package and method of manufacturing thereof
US20090206473A1 (en) * 2008-02-14 2009-08-20 Viasat, Inc. System and Method for Integrated Waveguide Packaging

Patent Citations (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3255408A (en) * 1963-02-25 1966-06-07 Beloit Corp Instrument for measuring moisture content and the like
US5475394A (en) * 1991-01-30 1995-12-12 Comsat Corporation Waveguide transition for flat plate antenna
US5384557A (en) * 1992-11-10 1995-01-24 Sony Corporation Polarization separator and waveguide-microstrip line mode transformer for microwave apparatus
US6573808B1 (en) * 1999-03-12 2003-06-03 Harris Broadband Wireless Access, Inc. Millimeter wave front end
US6320543B1 (en) * 1999-03-24 2001-11-20 Nec Corporation Microwave and millimeter wave circuit apparatus
US6608535B2 (en) * 2000-04-13 2003-08-19 Raytheon Company Suspended transmission line with embedded signal channeling device
US6572955B2 (en) * 2000-04-27 2003-06-03 Kyocera Corporation Ceramics having excellent high-frequency characteristics and method of producing the same
US6359590B2 (en) * 2000-05-26 2002-03-19 Kyocera Corporation Antenna feeder line, and antenna module provided with the antenna feeder line
US20040041657A1 (en) * 2000-12-04 2004-03-04 Peter Paakkonen Directional coupler, antenna interface unit and radio base station having an antenna interface unit
US20030012006A1 (en) * 2001-07-11 2003-01-16 Silverman Lawrence H. Pocket mounted chip having microstrip line
US6822528B2 (en) * 2001-10-11 2004-11-23 Fujitsu Limited Transmission line to waveguide transition including antenna patch and ground ring
US20050024166A1 (en) * 2002-03-05 2005-02-03 Xytrans, Inc. Millimeter wave (MMW) radio frequency transceiver module and method of forming same
US20040145426A1 (en) * 2002-07-13 2004-07-29 Ke-Li Wu Waveguide to laminated waveguide transition and methodology
US20060256016A1 (en) * 2005-03-17 2006-11-16 Ke-Li Wu Integrated LTCC mm-wave planar array antenna with low loss feeding network
US20070085626A1 (en) * 2005-10-19 2007-04-19 Hong Yeol Lee Millimeter-wave band broadband microstrip-waveguide transition apparatus
US20070109070A1 (en) * 2005-11-14 2007-05-17 Honeywell International Inc. Monolithic microwave integrated circuit providing power dividing and power monitoring functionality
US20090207090A1 (en) * 2007-06-22 2009-08-20 Vubiq Incorporated Integrated antenna and chip package and method of manufacturing thereof
US20090206473A1 (en) * 2008-02-14 2009-08-20 Viasat, Inc. System and Method for Integrated Waveguide Packaging

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
CLENET: "Array of Laminated Waveguides for Implementation in LTCC Technology", MEMORANDUM, November 2006 (2006-11-01), pages 1 - 4, Retrieved from the Internet <URL:http://www.dtic.mil/cgi-bin/GetTRDoc?Location=U2&doc=GetTRDoc.pdf&AD=ADA462936> [retrieved on 20101228] *

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103597658A (en) * 2011-07-04 2014-02-19 华为技术有限公司 Module and coupling arrangement

Also Published As

Publication number Publication date
DE112010003585T5 (en) 2012-11-22
WO2011030277A2 (en) 2011-03-17

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