WO2011034728A3 - Laser ablation tooling via distributed patterned masks - Google Patents
Laser ablation tooling via distributed patterned masks Download PDFInfo
- Publication number
- WO2011034728A3 WO2011034728A3 PCT/US2010/047475 US2010047475W WO2011034728A3 WO 2011034728 A3 WO2011034728 A3 WO 2011034728A3 US 2010047475 W US2010047475 W US 2010047475W WO 2011034728 A3 WO2011034728 A3 WO 2011034728A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- pattern
- distributed
- laser ablation
- apertures
- mask
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
- B23K26/066—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms by using masks
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/083—Devices involving movement of the workpiece in at least one axial direction
- B23K26/0853—Devices involving movement of the workpiece in at least in two axial directions, e.g. in a plane
- B23K26/0861—Devices involving movement of the workpiece in at least in two axial directions, e.g. in a plane in at least in three axial directions
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/18—Sheet panels
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/30—Organic material
- B23K2103/42—Plastics
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24273—Structurally defined web or sheet [e.g., overall dimension, etc.] including aperture
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24479—Structurally defined web or sheet [e.g., overall dimension, etc.] including variation in thickness
Abstract
A distributed patterned mask for use in a laser ablation process to image a complete pattern onto a substrate. The mask has a plurality of apertures for transmission of light and non-transmissive areas around the apertures. When the apertures for the distributed pattern are repeatedly imaged on a substrate, structures within the distributed pattern merge within different areas of the imaged pattern to create the complete pattern with distributed stitch lines in order to reduce or eliminate the stitching effect in laser ablation. The mask can also form a sparse and distributed pattern including apertures that individually form merging portions of the complete pattern and collectively form a distributed pattern.
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP10817660.3A EP2478418A4 (en) | 2009-09-18 | 2010-09-01 | Laser ablation tooling via distributed patterned masks |
JP2012529790A JP6271836B2 (en) | 2009-09-18 | 2010-09-01 | Laser ablation tool through a mask with a distributed pattern |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US12/562,369 US20110070398A1 (en) | 2009-09-18 | 2009-09-18 | Laser ablation tooling via distributed patterned masks |
US12/562,369 | 2009-09-18 |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2011034728A2 WO2011034728A2 (en) | 2011-03-24 |
WO2011034728A3 true WO2011034728A3 (en) | 2011-07-14 |
Family
ID=43756870
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US2010/047475 WO2011034728A2 (en) | 2009-09-18 | 2010-09-01 | Laser ablation tooling via distributed patterned masks |
Country Status (4)
Country | Link |
---|---|
US (2) | US20110070398A1 (en) |
EP (1) | EP2478418A4 (en) |
JP (2) | JP6271836B2 (en) |
WO (1) | WO2011034728A2 (en) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20110070398A1 (en) * | 2009-09-18 | 2011-03-24 | 3M Innovative Properties Company | Laser ablation tooling via distributed patterned masks |
CN104570611B (en) * | 2013-10-21 | 2016-06-08 | 合肥京东方光电科技有限公司 | Mask plate and improvement splicing exposure nurse thereof draw the method for phenomenon |
EP3094241B1 (en) * | 2014-01-14 | 2018-07-04 | Volcano Corporation | Systems and methods for evaluating hemodialysis arteriovenous fistula maturation |
Citations (5)
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US6285001B1 (en) * | 1995-04-26 | 2001-09-04 | 3M Innovative Properties Company | Method and apparatus for step and repeat exposures |
WO2007029028A1 (en) * | 2005-09-06 | 2007-03-15 | Plastic Logic Limited | Laser ablation of electronic devices |
WO2007135379A2 (en) * | 2006-05-24 | 2007-11-29 | Oerlikon Balzers Coating (Uk) Limited | Method and unit for micro-structuring a moving substrate |
WO2007135377A1 (en) * | 2006-05-19 | 2007-11-29 | Oerlikon Balzers Coating (Uk) Limited | Method and tool for patterning thin films on moving substrates |
US20080257871A1 (en) * | 2007-04-20 | 2008-10-23 | Leiser Judson M | Ablation device |
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-
2009
- 2009-09-18 US US12/562,369 patent/US20110070398A1/en not_active Abandoned
-
2010
- 2010-09-01 EP EP10817660.3A patent/EP2478418A4/en not_active Withdrawn
- 2010-09-01 JP JP2012529790A patent/JP6271836B2/en not_active Expired - Fee Related
- 2010-09-01 WO PCT/US2010/047475 patent/WO2011034728A2/en active Application Filing
-
2012
- 2012-09-13 US US13/613,427 patent/US20130003030A1/en not_active Abandoned
-
2016
- 2016-05-02 JP JP2016092574A patent/JP2016190270A/en active Pending
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6285001B1 (en) * | 1995-04-26 | 2001-09-04 | 3M Innovative Properties Company | Method and apparatus for step and repeat exposures |
WO2007029028A1 (en) * | 2005-09-06 | 2007-03-15 | Plastic Logic Limited | Laser ablation of electronic devices |
WO2007135377A1 (en) * | 2006-05-19 | 2007-11-29 | Oerlikon Balzers Coating (Uk) Limited | Method and tool for patterning thin films on moving substrates |
WO2007135379A2 (en) * | 2006-05-24 | 2007-11-29 | Oerlikon Balzers Coating (Uk) Limited | Method and unit for micro-structuring a moving substrate |
US20080257871A1 (en) * | 2007-04-20 | 2008-10-23 | Leiser Judson M | Ablation device |
Also Published As
Publication number | Publication date |
---|---|
JP6271836B2 (en) | 2018-01-31 |
JP2013505136A (en) | 2013-02-14 |
EP2478418A2 (en) | 2012-07-25 |
JP2016190270A (en) | 2016-11-10 |
WO2011034728A2 (en) | 2011-03-24 |
US20110070398A1 (en) | 2011-03-24 |
EP2478418A4 (en) | 2017-10-18 |
US20130003030A1 (en) | 2013-01-03 |
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