WO2011034728A3 - Laser ablation tooling via distributed patterned masks - Google Patents

Laser ablation tooling via distributed patterned masks Download PDF

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Publication number
WO2011034728A3
WO2011034728A3 PCT/US2010/047475 US2010047475W WO2011034728A3 WO 2011034728 A3 WO2011034728 A3 WO 2011034728A3 US 2010047475 W US2010047475 W US 2010047475W WO 2011034728 A3 WO2011034728 A3 WO 2011034728A3
Authority
WO
WIPO (PCT)
Prior art keywords
pattern
distributed
laser ablation
apertures
mask
Prior art date
Application number
PCT/US2010/047475
Other languages
French (fr)
Other versions
WO2011034728A2 (en
Inventor
Thomas R. Corrigan
Original Assignee
3M Innovative Properties Company
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 3M Innovative Properties Company filed Critical 3M Innovative Properties Company
Priority to EP10817660.3A priority Critical patent/EP2478418A4/en
Priority to JP2012529790A priority patent/JP6271836B2/en
Publication of WO2011034728A2 publication Critical patent/WO2011034728A2/en
Publication of WO2011034728A3 publication Critical patent/WO2011034728A3/en

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/066Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms by using masks
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08Devices involving relative movement between laser beam and workpiece
    • B23K26/083Devices involving movement of the workpiece in at least one axial direction
    • B23K26/0853Devices involving movement of the workpiece in at least in two axial directions, e.g. in a plane
    • B23K26/0861Devices involving movement of the workpiece in at least in two axial directions, e.g. in a plane in at least in three axial directions
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36Removing material
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00Articles made by soldering, welding or cutting
    • B23K2101/18Sheet panels
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00Materials to be soldered, welded or cut
    • B23K2103/30Organic material
    • B23K2103/42Plastics
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00Materials to be soldered, welded or cut
    • B23K2103/50Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/24Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24273Structurally defined web or sheet [e.g., overall dimension, etc.] including aperture
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/24Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24479Structurally defined web or sheet [e.g., overall dimension, etc.] including variation in thickness

Abstract

A distributed patterned mask for use in a laser ablation process to image a complete pattern onto a substrate. The mask has a plurality of apertures for transmission of light and non-transmissive areas around the apertures. When the apertures for the distributed pattern are repeatedly imaged on a substrate, structures within the distributed pattern merge within different areas of the imaged pattern to create the complete pattern with distributed stitch lines in order to reduce or eliminate the stitching effect in laser ablation. The mask can also form a sparse and distributed pattern including apertures that individually form merging portions of the complete pattern and collectively form a distributed pattern.
PCT/US2010/047475 2009-09-18 2010-09-01 Laser ablation tooling via distributed patterned masks WO2011034728A2 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
EP10817660.3A EP2478418A4 (en) 2009-09-18 2010-09-01 Laser ablation tooling via distributed patterned masks
JP2012529790A JP6271836B2 (en) 2009-09-18 2010-09-01 Laser ablation tool through a mask with a distributed pattern

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US12/562,369 US20110070398A1 (en) 2009-09-18 2009-09-18 Laser ablation tooling via distributed patterned masks
US12/562,369 2009-09-18

Publications (2)

Publication Number Publication Date
WO2011034728A2 WO2011034728A2 (en) 2011-03-24
WO2011034728A3 true WO2011034728A3 (en) 2011-07-14

Family

ID=43756870

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2010/047475 WO2011034728A2 (en) 2009-09-18 2010-09-01 Laser ablation tooling via distributed patterned masks

Country Status (4)

Country Link
US (2) US20110070398A1 (en)
EP (1) EP2478418A4 (en)
JP (2) JP6271836B2 (en)
WO (1) WO2011034728A2 (en)

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* Cited by examiner, † Cited by third party
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US20110070398A1 (en) * 2009-09-18 2011-03-24 3M Innovative Properties Company Laser ablation tooling via distributed patterned masks
CN104570611B (en) * 2013-10-21 2016-06-08 合肥京东方光电科技有限公司 Mask plate and improvement splicing exposure nurse thereof draw the method for phenomenon
EP3094241B1 (en) * 2014-01-14 2018-07-04 Volcano Corporation Systems and methods for evaluating hemodialysis arteriovenous fistula maturation

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US20080257871A1 (en) * 2007-04-20 2008-10-23 Leiser Judson M Ablation device

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US20080257871A1 (en) * 2007-04-20 2008-10-23 Leiser Judson M Ablation device

Also Published As

Publication number Publication date
JP6271836B2 (en) 2018-01-31
JP2013505136A (en) 2013-02-14
EP2478418A2 (en) 2012-07-25
JP2016190270A (en) 2016-11-10
WO2011034728A2 (en) 2011-03-24
US20110070398A1 (en) 2011-03-24
EP2478418A4 (en) 2017-10-18
US20130003030A1 (en) 2013-01-03

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